A resistive random access memory device includes a first electrode made of inert material; a second electrode made of soluble material; a solid electrolyte including a region made of an oxide of a first metal element, referred to as first metal oxide doped by a second element, distinct from the first metal and able to form a second oxide, the second element being selected such that the band gap energy of the second oxide is strictly greater than the band gap energy of the first metal oxide, the atomic percentage of the second element within the region of the solid electrolyte being comprised between 5% and 20%.

A memory device can include a plurality of bit lines; plurality of memory elements coupled to the bit lines, each memory element including a memory layer formed between two electrodes, the memory layer being programmable between a plurality of different resistance states by creation and removal of conductive regions therein by application of electric fields; and at least one sense amplifier (SA) configured to compare a first value, corresponding to a resistance state of a first memory element, to a second value, corresponding to a resistance state of a second memory element.

A non-volatile memory device with multiple latency tiers includes at least two crossbar memory arrays, each crossbar memory array comprising a number of memory cells, each memory cell connected to a word line and a bit line at a cross point. The crossbar memory arrays each have a different latency. The crossbar memory arrays are formed on a single die.

A semiconductor memory device according to the embodiment includes a first wiring, a second wiring, a resistance change film, a metal film, and a first film. The first wiring is provided between a first interlayer insulating film and a second interlayer insulating film. The second wiring is provided intersecting with the first wiring and extends in a first direction. The resistance change film is provided between the first wiring and the second wiring. The metal film is provided between the second wiring and the resistance change film. The first film is provided between the first wirings and includes chalcogen.

According to embodiments, a semiconductor memory device includes a first electrode, a second electrode, a memory cell, and a control circuit. The memory cell is provided between the first electrode and the second electrode and includes a metal film and a resistance change film. The control circuit applies a voltage between the first electrode and the second electrode to perform transition of a resistive state of the memory cell. The control circuit performs a first writing operation by applying a first pulse having a voltage of a first polarity to the memory cell and applying a second pulse having a voltage of the first polarity smaller than the voltage of the first pulse to the memory cell continuously after applying the first pulse.

According to one embodiment, a semiconductor memory device includes a first electrode, a second electrode, a memory cell, and a control circuit. The memory cell is provided between the first electrode and the second electrode, and includes a metal film and a resistance change film. The control circuit applies a voltage between the first electrode and the second electrode to transition a resistive state of the memory cell. The control circuit performs a first reset operation by applying a first pulse having a voltage of a first polarity to the memory cell, and applying a second pulse having a voltage of a second polarity that is an inverse of the first polarity to the memory cell after applying the first pulse.

A method of controlling an NVM device can include: (i) receiving, by an interface, a write command from a host; (ii) beginning execution of a write operation on a first array plane of a memory array in response to the write command, where the memory array includes a plurality of NVM cells arranged in a plurality of array planes; (iii) receiving, by the interface, a read command from the host; (iv) suspending the write operation in response to detection of the read command during execution of the write operation; (v) beginning execution of a read operation on a second array plane in response to the read command; and (vi) resuming the write operation after the read operation has at least partially been executed.

According to one embodiment, a semiconductor memory device includes: a first bit line; a first source line; a first word line; a first control line; a first memory cell comprising a first variable resistance element and a first transistor, the first transistor including a gate coupled to the first word line, the first memory cell including one end coupled to the first bit line and another end coupled to the first source line; a second transistor including one end coupled to the first bit line; and a third transistor including a gate coupled to the first control line, one end coupled to the first bit line, and another and coupled to the first source line.

Disclosed herein are selector devices and related devices and techniques. In some embodiments, a selector device may include a first electrode, a second electrode, and a selector material between the first electrode and the second electrode. The selector material may include a dielectric material and a conductive dopant.

Disclosed is a solid state memory having a non-linear current-voltage (I-V) response. By way of example, the solid state memory can be used as a selector device. The selector device can be formed in series with a non-volatile memory device via a monolithic fabrication process. Further, the selector device can provide a substantially non-linear I-V response suitable to mitigate leakage current for the nonvolatile memory device. In various disclosed embodiments, the series combination of the selector device and the non-volatile memory device can serve as one of a set of memory cells in a 1-transistor, many-resistor resistive memory cell array.