One or more write operations are performed on a memory component. First data stored at the memory component is read. A determination is made as to whether an error rate associated with the first data stored at the memory component exceeds an error rate threshold. If the error rate exceeds the error rate threshold, a threshold value is adjusted. A determination is made as to whether a number of the plurality of write operations performed on the memory component since performance of a refresh operation on the memory component exceeds the threshold value. In response to determining that the number of write operations performed on the memory component exceeds the threshold value, a memory cell of the memory component is identified based on the plurality of write operations. Second data stored at memory cells of the memory component that are proximate to the identified memory cell is refreshed.

A vertical resistive memory array is presented. The array includes a pillar electrode and a switching liner around the side perimeter of the pillar electrode. The array includes two or more vertically stacked single cell (SC) electrodes connected to a first side of the switching liner. The juxtaposition of the switching liner, the pillar electrode, and each SC electrode forms respective resistance switching cells (e.g., OxRRAM cell). A vertical group or bank of these cells may be connected in parallel and each share the same pillar electrode. The cells in the vertical cell bank may written to or read from as a group to limit the effects of inconsistent CF formation of any one or more individual cells within the group.

A method of operating a memory circuit includes generating a first voltage by a first amplifier circuit of a first driver circuit coupled to a first column of memory cells, and generating a first current in response to the first voltage. The first current includes a first set of leakage currents and a first write current. The method further includes generating, by a tracking circuit, a second set of leakage currents configured to track the first set of leakage currents of the first column of memory cells, and mirroring the first current in a first path with a second current in a second path by a first current mirror. The second current includes the second set of leakage currents and a second write current. The first write current corresponds to the second write current. The first set of leakage currents corresponds to the second set of leakage currents.

A memory device includes a cell region including a plurality of word lines, a plurality of bit lines, and a plurality of memory cells connected to the plurality of word lines and the plurality of bit lines disposed therein, where each of the plurality of memory cells includes a switch element and a memory element connected to each other in series between a corresponding word line and a corresponding bit line, and a peripheral circuit region including a control logic configured to, when a read command for a selected memory cell among the memory cells is received from an external controller, input a pre-voltage to the selected memory cell before reading data of the selected memory cell. The control logic is configured to determine a level of the pre-voltage with reference to an elapsed time after programming of the selected memory cell.

Provided is a variable resistance random-access memory for suppressing degradation of performance by recovering a memory cell that fails. A variable resistance random-access memory of the disclosure includes a memory array, a row selection circuit, a column selection circuit, a controller, an error checking and correcting (ECC) circuit, an error bit flag register, and an error bit address register. The memory array includes a plurality of memory cells. The column selection circuit includes a sense amplifier and a write driver/read bias circuit. The error bit flag register stores bits for indicating presence/absence of an error bit in a write operation. The error bit address register stores an address of the error bit. The controller recovers the error bit when a predetermined event occurs.

The present application provides methods for programming a circuit device with reduced disturbances. The methods may include: selecting a first target device on a target row of a plurality of rows and a target column of a plurality of columns; selecting the target row; connecting the plurality of rows other than the target row to a voltage potential with the same polarity as a programming signal; grounding the target column; preparing the programming signal on the target rows; sending a pulse signal enable an access transistor on the target column; and sending the programming signal to pass the first target device.

A resistive element array circuit includes word lines, bit lines, resistive elements, a selector, a differential amplifier, and a ground terminal. The word lines are coupled to a power supply. The resistive elements are each disposed at an intersection of corresponding one of the word lines and corresponding one of the bit lines. The selector is configured to select one word line and one bit line. The differential amplifier includes a positive input terminal configured to be coupled to the selected one of the bit lines which is selected by the selector, a negative input terminal configured to be coupled to non-selected one of the bit lines which is not selected by the selector and to non-selected one of the word lines which is not selected by the selector, an output terminal being coupled to the negative input terminal. The ground terminal is coupled to the positive input terminal.

The present disclosure includes apparatuses, methods, and systems for performing refresh operations on memory cells. An embodiment includes a memory having a group of memory cells and one or more additional memory cells whose data state is indicative of whether to refresh the group of memory cells, and circuitry configured to apply a first voltage pulse to the group of memory cells to sense a data state of the memory cells of the group, apply, while the first voltage pulse is applied to the group of memory cells, a second voltage pulse having a greater magnitude than the first voltage pulse to the one or more additional memory cells to sense a data state of the one or more additional memory cells, and determine whether to perform a refresh operation on the group of memory cells based on the sensed data state of the one or more additional memory cells.

The disclosed invention presents a self-tracking reference circuit that compensates for IR drops and achieves the target resistance state at different temperatures after write operations. The disclosed self-tracking reference circuit includes a replica access path, a configurable resistor network, a replica selector mini-array and a step current generator that track PVT variations to provide a PVT tracking level for RRAM verify operation.

A system and method for operating a memory cell is provided. A non-volatile memory storage device includes an array of memory cells of differential or single-ended type. In an embodiment, a regulator is coupled to a sense amplifier. The regulator is configured to generate a voltage to gate terminals of one or two transistors of the sense amplifier. In the differential type, the voltage is generated such that the first bias current and the second bias current have a current value equal to the sum of a maximum current flowing in a memory cell being in a RESET state and a fixed current. In the single-ended type, the regulated voltage is generated such that the first bias current and the second bias current have a current value equal to the sum of a fixed current and the reference current generated by the reference current source across temperature.