According to one embodiment, a memory system includes a non-volatile memory and a controller. The memory includes a plurality of storage areas. Each of the storage areas includes a plurality of memory cells to which threshold voltages are set in accordance with data. The controller acquires a first threshold voltage distribution of memory cells in a first storage area of the storage areas. The controller acquires a second threshold voltage distribution of memory cells in a second storage area of the storage areas. The controller detects non-normalcy in the first storage area or the second storage area from a first divergence quantity between the first threshold voltage distribution and the second threshold voltage distribution.

According to one embodiment, a memory system includes a non-volatile memory and a controller. The memory includes a plurality of storage areas. Each of the storage areas includes a plurality of memory cells to which threshold voltages are set in accordance with data. The controller acquires a first threshold voltage distribution of memory cells in a first storage area of the storage areas. The controller acquires a second threshold voltage distribution of memory cells in a second storage area of the storage areas. The controller detects non-normalcy in the first storage area or the second storage area from a first divergence quantity between the first threshold voltage distribution and the second threshold voltage distribution.

A novel semiconductor device is provided. A memory string, which extends in the Z direction and includes a conductor and an oxide semiconductor, intersects with a plurality of wirings CG extending in the Y direction. The conductor is placed along a center axis of the memory string, and the oxide semiconductor is concentrically placed outside the conductor. The conductor is electrically connected to the oxide semiconductor. An intersection portion of the memory string and the wiring CG functions as a transistor. In addition, the intersection portion functions as a memory cell.

A novel semiconductor device is provided. A memory string, which extends in the Z direction and includes a conductor and an oxide semiconductor, intersects with a plurality of wirings CG extending in the Y direction. The conductor is placed along a center axis of the memory string, and the oxide semiconductor is concentrically placed outside the conductor. The conductor is electrically connected to the oxide semiconductor. An intersection portion of the memory string and the wiring CG functions as a transistor. In addition, the intersection portion functions as a memory cell.

A semiconductor memory device includes a memory block including plurality of string groups, a peripheral circuit, and control logic. The peripheral circuit performs a program operation on source select transistors included in the memory block. The control logic controls the program operation of the peripheral circuit. Each of the plurality of string groups includes at least one cell string, and the at least one cell string includes inner source select transistors located adjacent to memory cells and outer source select transistors located adjacent to a common source line. The control logic controls the peripheral circuit to perform program operations on the outer source select transistors and the inner source select transistors by an ISPP method. The control logic controls the peripheral circuit to perform a verify operation by dividing the inner source select transistors into at least two groups during the program operation of the inner source select transistors.

A semiconductor memory device includes a memory block including plurality of string groups, a peripheral circuit, and control logic. The peripheral circuit performs a program operation on source select transistors included in the memory block. The control logic controls the program operation of the peripheral circuit. Each of the plurality of string groups includes at least one cell string, and the at least one cell string includes inner source select transistors located adjacent to memory cells and outer source select transistors located adjacent to a common source line. The control logic controls the peripheral circuit to perform program operations on the outer source select transistors and the inner source select transistors by an ISPP method. The control logic controls the peripheral circuit to perform a verify operation by dividing the inner source select transistors into at least two groups during the program operation of the inner source select transistors.

A memory die includes an alternating stack of insulating layers and electrically conductive layers through which memory opening fill structures vertically extend. The memory die includes at least three memory array regions interlaced with at least two contact regions, or at least three contact regions interlaced with at least two memory array regions in the same memory plane. A logic die including at least two word line driver regions can be bonded to the memory die. The interlacing of the contact regions and the memory array regions can reduce lateral offset of boundaries of the word line driver regions from boundaries of the contact regions.

A memory die includes an alternating stack of insulating layers and electrically conductive layers through which memory opening fill structures vertically extend. The memory die includes at least three memory array regions interlaced with at least two contact regions, or at least three contact regions interlaced with at least two memory array regions in the same memory plane. A logic die including at least two word line driver regions can be bonded to the memory die. The interlacing of the contact regions and the memory array regions can reduce lateral offset of boundaries of the word line driver regions from boundaries of the contact regions.

A current operating characteristic value of a unit of the memory device is identified. An operating characteristic threshold value is identified from a set of operating characteristic thresholds, where the current operating characteristic value satisfies an operating characteristic threshold criterion that is based on the operating characteristic threshold value. A set of write-to-read (W2R) delay time thresholds that corresponds to the operating characteristic threshold value is identified from a plurality of sets of W2R delay time thresholds. Each of the W2R delay time thresholds in the set is associated with a corresponding read voltage level. A W2R delay time threshold associated with a W2R delay time threshold criterion is identified from the set of W2R delay time thresholds, where the W2R threshold criterion is satisfied by a current W2R delay time of the memory sub-system. A read voltage level associated with the identified W2R delay time threshold is identified.

A memory device includes a memory block, a peripheral circuit, and a control logic. The memory block includes a plurality of string groups respectively connected to a corresponding select line, among a plurality of select lines. The peripheral circuit performs a program operation of data on the memory block. The control logic controls the program operation of the peripheral circuit. The memory block is connected to first to n-th word lines. The control logic is configured to control the peripheral circuit to perform a first program operation on a physical page, among physical pages that are included in a first string group, connected to an i-th word line, performs a second program operation on a physical page that is connected to an (i−1)-th word line, and perform a dummy program operation on a physical page that is connected to an (i+1)-th word line. Here, n is a natural number equal to or greater than 3, and i is a natural number greater than 0 and less than n−1.