A current operating characteristic value of a unit of the memory device is identified. An operating characteristic threshold value is identified from a set of operating characteristic thresholds, where the current operating characteristic value satisfies an operating characteristic threshold criterion that is based on the operating characteristic threshold value. A set of write-to-read (W2R) delay time thresholds that corresponds to the operating characteristic threshold value is identified from a plurality of sets of W2R delay time thresholds. Each of the W2R delay time thresholds in the set is associated with a corresponding read voltage level. A W2R delay time threshold associated with a W2R delay time threshold criterion is identified from the set of W2R delay time thresholds, where the W2R threshold criterion is satisfied by a current W2R delay time of the memory sub-system. A read voltage level associated with the identified W2R delay time threshold is identified.

A data storage device includes a non-volatile memory device including a memory block having a number of memory dies, and a controller coupled to the memory device. A memory access command is received and a memory access operation based on the received command is performed. A number of bytes transferred during the memory access operation is determined, and the determined number of bytes is analyzed to determine whether the number of transferred bytes is equal to a predetermined number. A transfer status fail bit is set if the number of transferred bytes is not equal to the predetermined number.

An electronic device, and more particularly, a page buffer is provided. The page buffer includes a sensing node configured to sense a potential of a bit line coupled to a memory cell, a precharging circuit coupled to the sensing node and configured to precharge a potential of the sensing node to a first voltage during an evaluation operation on the memory cell, a discharging circuit coupled to the sensing node and configured to discharge the potential of the sensing node from the first voltage to a second voltage, and a latch circuit coupled to the discharging circuit and configured to store therein data sensed from the memory cell based on a result of comparing the potential of the sensing node with a reference voltage after the potential of the sensing node is discharged to the second voltage and a predetermined period elapses.

Apparatuses and techniques are described for programming memory cells with a reduced number of program pulses. A program operation includes a first, foggy program pass followed by a second, fine program pass. The number of program loops in the foggy program pass is minimized while providing relatively narrow Vth distributions for the foggy states. The program loops include one or more checkpoint program loops in which a program speed of the memory cells is determined through a read operation. In a next program loop, the fast-programming memory cells are inhibited from programming while the slow-programming memory cells are programmed with a reduced speed by applying a program speed-reducing bit line voltage. This brings the threshold voltage of the slow-programming memory cells into alignment with the threshold voltage of the fast-programming memory cells.

An example memory sub-system to receive a request to execute a read operation associated with data of a memory unit of a memory sub-system. A time after program associated with the data is determined. The time after program is compared to a threshold time level to determine if a first condition is satisfied or a second condition is satisfied. The memory sub-system selects one of a first set of read offset values based on the time after program in response to satisfying the first condition, or a second set of read offset values based on a data state metric measurement in response to satisfying the second condition.

An example memory sub-system to receive a request to execute a read operation associated with data of a memory unit of a memory sub-system. A time after program associated with the data is determined. The time after program is compared to a threshold time level to determine if a first condition is satisfied or a second condition is satisfied. The memory sub-system selects one of a first set of read offset values based on the time after program in response to satisfying the first condition, or a second set of read offset values based on a data state metric measurement in response to satisfying the second condition.

Apparatuses and methods including memory commands for semiconductor memories are described. A controller provides a memory system with memory commands to access memory. The commands are decoded to provide internal signals and commands for performing operations, such as operations to access the memory array. The memory commands provided for accessing memory may include timing command and access commands. Examples of access commands include a read command and a write command. Timing commands may be used to control the timing of various operations, for example, for a corresponding access command. The timing commands may include opcodes that set various modes of operation during an associated access operation for an access command.

A memory device includes pages containing memory cells arranged in an array on a substrate. In each memory cell, a voltage applied to a first gate conductor layer, second gate conductor layer, third gate conductor layer, first impurity layer, and second impurity layer is controlled to form a hole group by impact ionization inside a channel semiconductor layer, and a page write operation of holding the hole group and a page erase operation of removing the hole group are performed. The first impurity layer is connected to a source line, the second impurity layer to a bit line, the first gate conductor layer to a first plate line, the second gate conductor layer to a second plate line, and the third gate conductor layer to a word line. A page erase operation is performed without inputting a positive or negative bias pulse to the bit line and the source line.

According to the one embodiment, a memory system includes a semiconductor memory device and a memory controller. The semiconductor memory device includes: first and second memory cells stacked above a substrate; a first word line coupled to the first and second memory cells; a first bit line coupled to the first memory cell; and a second bit line coupled to the second memory cell. A first state read operation includes a first read operation for reading data from the first memory cell and a second read operation for reading data from the second memory cell. A first read voltage is applied to the first word line during a first period for executing the first read operation, and a second read voltage is applied to the first word line during a second period for executing the second read operation.

A memory device includes a memory array comprising a plurality of wordlines, and control logic, operatively coupled with the memory array. The control logic causes a measurement programming pulse to be sequentially applied to each of the plurality of wordlines of the memory array and determines respective threshold voltages stored in a number of memory cells associated with each of the plurality of wordlines. The control logic further determines a difference in the respective threshold voltages based on a location of the number of memory cells within each wordline and determines a respective resistance-capacitance (RC) time constant for each of the plurality of wordlines in view of the difference in the respective threshold voltages.