Provided herein is a semiconductor memory device. The semiconductor memory device includes: a memory cell array including a plurality of memory blocks; a voltage generation circuit configured to generate a plurality of operating voltages; a decoder circuit configured to transmit the plurality of operating voltages to the memory cell array in response to a serial data signal that is sequentially inputted; and a control logic configured to generate the data signal, internal address signals and an internal clock signal in response to a command.

Apparatus might include an array of memory cells and a controller to perform access operations on the array of memory cells. The controller might be configured to establish a negative potential in a body of a memory cell of the array of memory cells, and initiate a sensing operation on the memory cell while the body of the memory cell has the negative potential. Apparatus might further include an array of memory cells, a timer, and a controller to perform access operations on the array of memory cells. The controller might be configured to advance the timer, and establish a negative potential in a body of a memory cell of the array of memory cells in response to a value of the timer having a desired value.

Apparatus might include an array of memory cells and a controller to perform access operations on the array of memory cells. The controller might be configured to establish a negative potential in a body of a memory cell of the array of memory cells, and initiate a sensing operation on the memory cell while the body of the memory cell has the negative potential. Apparatus might further include an array of memory cells, a timer, and a controller to perform access operations on the array of memory cells. The controller might be configured to advance the timer, and establish a negative potential in a body of a memory cell of the array of memory cells in response to a value of the timer having a desired value.

Apparatus having a controller configured to connect a string of series-connected memory cells (e.g., a NAND string) to a node, perform a sensing operation on a selected memory cell of the NAND string while the selected memory cell is connected to the node through a first field-effect transistor (FET) between the node and the NAND string and through a second FET between the first FET and the NAND string, connect a control gate of the first FET to receive a lower voltage level after performing the sensing operation, connect the control gate of the second FET to receive the lower voltage level after connecting the control gate of the first FET to receive the lower voltage level, and connect a control gate of the selected memory cell to receive the lower voltage level after connecting the control gate of the second FET to receive the lower voltage level.

First signaling indicative of instructions to enter a self-refresh (SREF) mode can be received concurrently by a plurality of memory dies. Responsive to a memory die of the plurality of memory dies entering the SREF mode, self-refreshing of memory banks of the memory die can be delayed, at the memory die and based on fuse states of an array of fuses of the memory die, an amount of time relative to receipt of the signaling by the memory die. Delaying self-refreshing of memory banks of memory dies in a staggered, or asynchronous, manner can evenly distribute power consumption of the memory dies so that the likelihood of an associated power spike is reduced or eliminated.

A 3D memory device may include a first set of memory layers, a second set of memory layers above the first set of memory layers, and a first dummy memory layer between the first and second memory layers. The 3D memory device may include a plurality of NAND memory strings each extending through the first and second set of memory layers and the first dummy memory layer. The 3D memory device may include a word line (WL) driving circuit that, when programming one of the first set of memory layers, may be configured to apply a second pre-charge voltage to the first dummy memory layer during the pre-charge period. The second pre-charge voltage may overlap with the first pre-charge voltage and ramp down prior to the first pre-charge voltage.

An object is to shorten the time for rewriting data in memory cells. A memory module includes a first memory cell, a second memory cell, a selection transistor, and a wiring WBL1. The first memory cell includes a first memory node. The second memory cell includes a second memory node. One end of the first memory cell is electrically connected to the wiring WBL1 through the selection transistor. The other end of the first memory cell is electrically connected to one end of the second memory cell. The other end of the second memory cell is electrically connected to the wiring WBL1. When the selection transistor is on, data in the first memory node is rewritten by a signal supplied through the selection transistor to the wiring WBL1. When the selection transistor is off, data in the first memory node is rewritten by a signal supplied through the second memory node to the wiring WBL1.

A memory controller includes an interface and a control module. The interface interfaces with a memory device which includes a plurality of dies that each include a plurality of blocks. The control module groups a plurality of blocks included in different dies and manages the plurality of blocks as a super block. The control module performs scheduling to alternately perform a program on a part of an Nth super block, wherein N is a natural number, and a phased erase on an N+1st super block, and the control module completes the program on the Nth super block and the erase on the Nth super block before the program on the N+1st super block starts.

A memory controller includes an interface and a control module. The interface interfaces with a memory device which includes a plurality of dies that each include a plurality of blocks. The control module groups a plurality of blocks included in different dies and manages the plurality of blocks as a super block. The control module performs scheduling to alternately perform a program on a part of an Nth super block, wherein N is a natural number, and a phased erase on an N+1st super block, and the control module completes the program on the Nth super block and the erase on the Nth super block before the program on the N+1st super block starts.

A page buffer includes a charging circuit, first and second storage circuits, and a selection circuit. The charging circuit charges a bit line during a precharging period. The first storage circuit determines and stores data corresponding to a state of a selected memory cell among memory cells connected to the bit line while the charging circuit charges the bit line. The second storage circuit, which is a circuit separate from the first storage circuit, determines and stores data corresponding to a state of the selected memory cell after the precharging period. The selection circuit outputs a control voltage controlling a switch element connected between the bit line and the charging circuit, and determines a magnitude of the control voltage during the precharging period, based on the data stored in the first storage circuit.