A system on chip (SOC) integrated circuit device having an incorporated ferroelectric memory configured to be selectively refreshed, or not, depending on different operational modes. The ferroelectric memory is formed of an array of ferroelectric memory elements (FMEs) characterized as non-volatile, read-destructive semiconductor memory cells each having at least one ferroelectric layer. The FMEs can include FeRAM, FeFET or FTJ constructions. A read/write circuit writes data to the FMEs and subsequently reads back data from the FMEs responsive to respective write and read signals supplied by a processor circuit of the SOC. A refresh circuit is selectively enabled in a first normal mode to refresh the FMEs after a read operation, and is selectively disabled in a second exception mode so that the FMEs are not refreshed after a read operation. The FMEs can be used as a main memory, a cache, a buffer, an OTP, a keystore, etc.

A drain programmed read-only memory includes a diffusion region that spans a width of a bitcell and forms a drain of a first transistor and a second transistor. A bit line lead in a metal layer adjacent the diffusion region extends across the width of the bitcell. A first via extends from an upper half of the bit line lead and couples to a drain of the first transistor. Similarly, a second via extends from a lower half of the bit line and couples to a drain of the second transistor.

Provided is a read-only memory (ROM) device. The ROM device comprises a substrate that has a plurality of vertical transport field effect transistors (VFETs). The ROM device further comprises an un-activated semiconductor layer provided on each VFET. The un-activated semiconductor layer includes implanted dopants that have not been substantially activated.

Provided is a read-only memory (ROM) device. The ROM device comprises a substrate that has a plurality of vertical transport field effect transistors (VFETs). The ROM device further comprises an un-activated semiconductor layer provided on each VFET. The un-activated semiconductor layer includes implanted dopants that have not been substantially activated.

A device includes a programmable ROM circuit, an address circuit, and a processor. The programmable ROM circuit includes multiple physically contiguous pairs of bit-cells, each pair of bit-cells includes an active layer trace extending continuously across both of the bit-cells, each pair of bit-cells comprises a shared contact layer point when the pair of bit-cells is programmed to a value of one and no shared contact layer point when the pair of bit-cells is programmed to a value of zero. The address circuit is coupled to the programmable ROM circuit and configured to address only a first bit-cell of each pair of bit-cells. The processor is coupled to the address circuit and the programmable ROM circuit and configured to use the address circuit to read data from one or more pairs of bit-cells of the programmable ROM circuit.

A device includes a programmable ROM circuit, an address circuit, and a processor. The programmable ROM circuit includes multiple physically contiguous pairs of bit-cells, each pair of bit-cells includes an active layer trace extending continuously across both of the bit-cells, each pair of bit-cells comprises a shared contact layer point when the pair of bit-cells is programmed to a value of one and no shared contact layer point when the pair of bit-cells is programmed to a value of zero. The address circuit is coupled to the programmable ROM circuit and configured to address only a first bit-cell of each pair of bit-cells. The processor is coupled to the address circuit and the programmable ROM circuit and configured to use the address circuit to read data from one or more pairs of bit-cells of the programmable ROM circuit.

An apparatus for reading a bit of a memory array includes a bit cell column, voltage enhancement circuitry, and control circuitry. The voltage enhancement circuitry is configured to couple a bitline to a reference node. The control circuitry is configured to, in response to a read request for a bitcell element of a plurality of bitcell elements, couple a current source to the bitcell column such that a read current from the current source flows from the source line, through the bitcell column and the voltage enhancement circuitry, to the reference node and determine a state for the bitcell element based on a voltage between the source line and the reference node. The voltage enhancement circuitry is configured to generate, when the read current flows through the voltage enhancement circuitry, a voltage at the bitline that is greater than a voltage at the reference node.

A memory device includes a data storage circuit configured to access a cell array having first data stored therein when an arithmetic active operation is performed, output the first data when a first read operation is performed, access a cell array having second data stored therein when an active operation is performed, and output the second data when a second read operation is performed. The memory device also includes an arithmetic circuit configured to receive latch data generated through the first read operation and read data generated through the second read operation, and perform an arithmetic operation on the latch data and the read data.

An operation method of a multi-bits read only memory includes a step of applying a gate voltage to a conductive gate, a first voltage to a first electrode, and a second voltage to a second electrode. The multi-bits read only memory of the present invention includes a substrate and a transistor structure with the conductive gate mounted between the first electrode and the second electrode, a first oxide located between the first electrode and the conductive gate, and a second oxide located between the second electrode and the conductive gate. The present invention creates an initial state wherein the transistor structure is not conducting, an intermediate state wherein the first oxide is punched through by the first voltage, and a fully opened state wherein both the first oxide and the second oxide are punched through. The aforementioned states allow storage of multiple bits on the read only memory.

An operation method of a multi-bits read only memory includes a step of applying a gate voltage to a conductive gate, a first voltage to a first electrode, and a second voltage to a second electrode. The multi-bits read only memory of the present invention includes a substrate and a transistor structure with the conductive gate mounted between the first electrode and the second electrode, a first oxide located between the first electrode and the conductive gate, and a second oxide located between the second electrode and the conductive gate. The present invention creates an initial state wherein the transistor structure is not conducting, an intermediate state wherein the first oxide is punched through by the first voltage, and a fully opened state wherein both the first oxide and the second oxide are punched through. The aforementioned states allow storage of multiple bits on the read only memory.