A test circuit includes first integration circuit configured to receive first test signal and integrate first test signal to output first integrated signal; second integration circuit configured to receive second test signal and integrate second test signal to output second integrated signal, where first test signal and second test signal are signals inverted with respect to each other, value of first integrated signal is product of duty cycle of first test signal and a voltage amplitude of power supply, and value of second integrated signal is product of duty cycle of second test signal and voltage amplitude of power supply; and comparison circuit connected to first and second integration circuits. The comparison circuit is configured to output high-level signal in response to first integrated signal being greater than second integrated signal, and output low-level signal in response to second integrated signal being greater than first integrated signal.

A load control device may include a semiconductor switch, a control circuit, and first and second terminals adapted to be coupled to a remote device. The load control device may include a first switching circuit coupled to the second terminal, and a second switching circuit coupled between the first terminal and the second terminal. The control circuit may be configured to render the first switching circuit conductive to conduct a charging current from an AC power source to a power supply of the remote device during a first time period of a half-cycle of the AC power source, and further configured to render the first and second switching circuits conductive and non-conductive to communicate with the remote device via the second terminal during a second time period of the half-cycle of the AC power source.

A load control device may include a semiconductor switch, a control circuit, and first and second terminals adapted to be coupled to a remote device. The load control device may include a first switching circuit coupled to the second terminal, and a second switching circuit coupled between the first terminal and the second terminal. The control circuit may be configured to render the first switching circuit conductive to conduct a charging current from an AC power source to a power supply of the remote device during a first time period of a half-cycle of the AC power source, and further configured to render the first and second switching circuits conductive and non-conductive to communicate with the remote device via the second terminal during a second time period of the half-cycle of the AC power source.

According to one embodiment, a memory system includes: a controller configured to execute an error correction process on first data read from a first area at a first address of a memory device and determine a read level used for reading data at the first address according to a result of the correction process. The controller executes the correction process on first frame data of the first data. When the correction process on the first frame data has failed, the controller executes the correction process on second frame data of the first data. When the correction process on the second frame data has succeeded, the controller determines the read level based on a result of comparison between the second frame data and a result of the correction process on the second frame data.

A memory device to determine a voltage optimized to read a group of memory cells by reading the group of memory cells at a plurality of test voltages, computing bit counts at the test voltages respectively, and computing count differences in the bit counts for pairs of adjacent voltages in the test voltages. When a smallest one in the count differences is found at a side of a distribution of the count differences according to voltage, the memory device is configured to determine a location of an optimized read voltage, based on a ratio between a first count difference and a second count difference, where the first count difference is the smallest in the count differences, and the second count difference is closest in voltage to the first count difference.

An apparatus is provided, comprising a controller, a plurality of memory devices operably connected to the controller, circuitry configured to measure a performance metric for each of the plurality of memory devices, and circuitry configured to select, based upon the measured performance metric, a subset of the plurality of memory devices to disable in response to a recovery command. Information corresponding to the selected subset cam be stored in a mode register of the apparatus, and the apparatus can further comprise circuitry configured, in response to a recovery command, to disable the subset of the plurality of memory devices.

Methods and apparatus for configurable ECC (error correction code) mode in DRAM. Selected memory cells in the bank arrays of a DRAM device (e.g., die) are used to store ECC bits. A DRAM device (e.g., die) is configured to operate in a first mode in which an on-die ECC engine employs selected bits in the arrays of memory cells in the DRAM banks as ECC bits to perform ECC operations and to operate in a second mode under which the ECC bits are not employed for ECC operations by the ECC engine and made available for external use by a host. In the second mode, the repurposed ECC bits may comprise RAS bits used for RAS (Reliability, Serviceability, and Availability) operations and/or metabits comprising metadata used for other operations by the host.

An operating method of a memory device includes: acquiring an address of a first bad word line, the first bad word line included in a plurality of word lines of the memory device; detecting whether word lines adjacent to the first bad word line are bad based on the address of the first bad word line, the word lines adjacent to the first bad word line included in the plurality of word lines; designating a first word line among the word lines adjacent to the first bad word line as a prohibited word line, the first word line being detected as a second bad word line; and sending first data via a second word line among the word lines adjacent to the first bad word line, the second word line being detected as a normal word line.

An operating method of a memory device includes: acquiring an address of a first bad word line, the first bad word line included in a plurality of word lines of the memory device; detecting whether word lines adjacent to the first bad word line are bad based on the address of the first bad word line, the word lines adjacent to the first bad word line included in the plurality of word lines; designating a first word line among the word lines adjacent to the first bad word line as a prohibited word line, the first word line being detected as a second bad word line; and sending first data via a second word line among the word lines adjacent to the first bad word line, the second word line being detected as a normal word line.

Disclosed herein are related to a system and a method of extending a lifetime of a memory cell. In one aspect, a memory controller applies a first pulse having a first amplitude to the memory cell to write input data to the memory cell. In one aspect, the memory controller applies a second pulse having a second amplitude larger than the first amplitude to the memory cell to extend a lifetime of the memory cell. The memory cell may include a resistive memory device or a phase change random access memory device. In one aspect, the memory controller applies the second pulse to the memory cell to repair the memory cell in response to determining that the memory cell has failed. In one aspect, the memory controller periodically applies the second pulse to the memory cell to extend the lifetime of the memory cell before the memory cell fails.