A signal generation circuit includes: a clock module, configured to generate a clock signal based on a flag signal; a control module, configured to generate a control signal according to number of transitions of the clock signal within a fixed time; and a generation module, respectively connected to the clock module and the control module, and configured to receive the clock signal, the control signal, and the flag signal, and to generate a target signal. When the flag signal changes from a first level to a second level, the target signal changes from a third level to a fourth level. After being maintained at the fourth level for a target duration, the target signal changes from the fourth level to the third level. The generation module is further configured to determine the target duration according to the clock signal and the control signal.

Disclosed herein is an apparatus that includes a plurality of memory sections each including a plurality of word lines, a predecoder circuit configured to generate predecoded section address signals to select one of the plurality of memory sections and predecoded word line address signals to select one of the word lines included in a selected one of the plurality of memory sections based on a row address, and a section address control circuit configured to retain the predecoded section address signals regardless of an update of the row address in a test operation mode.

Disclosed herein is an apparatus that includes a plurality of memory sections each including a plurality of word lines, a predecoder circuit configured to generate predecoded section address signals to select one of the plurality of memory sections and predecoded word line address signals to select one of the word lines included in a selected one of the plurality of memory sections based on a row address, and a section address control circuit configured to retain the predecoded section address signals regardless of an update of the row address in a test operation mode.

A read technique for both SLC (single level cell) and MLC (multi-level cell) cross-point memory can mitigate drift-related errors with minimal or no drift tracking. In one example, a read at a higher magnitude voltage is applied first, which causes the drift for cells in a lower threshold voltage state to be reset. In one example, the read at the first voltage can be a full float read to minimize disturb. A second read can then be performed at a lower voltage without the need to adjust the read voltage due to drift.

An apparatus includes a first group of memory units and a second group of memory units coupled to a first data path and a second data path coupled to a controller, a first delay element on the first data path coupled to the second group of memory units and configured to send, from the controller to the second group of memory units, signals for write and read operations in a sequence of time cycles delayed by a time cycle with respect to the first group of memory units, and a second delay element on the second data path and coupled to the first group of memory units and configured to send, from the first group of memory units to the controller, test result signals delayed by a time cycle, the delayed test result signals having a matching delay to the delayed write and read operations.

A memory controller receives a multi-plane read request and identifies a set of actual read offsets for a set of pages in the multi-plane read request. The memory controller calculates a common read offset using the set of actual read offsets. The memory controller calculates an offset difference for. Each page. Each offset difference reflects the difference between an actual read offset for that page and the common read offset. The memory controller compares a particular page's offset difference to an offset difference threshold. The memory controller categorizes, based on the comparing, a first subset of pages from the set of pages into a single plane group and a second subset of pages from the set of pages into a multi-plane group. The memory controller performs a multi-plane read on the multi-plane group.

Disclosed are devices and methods for improving the initialization of devices housing memories. In one embodiment, a method is disclosed comprising writing a test program to a first region of a memory device during production of the memory device; executing a self-test program in response to detecting a first power up of the memory device, the self-test program stored within the test program; and retrieving and installing an image from a remote data source in response to detecting a subsequent power up of the memory device, the retrieving performed by the test program.

Disclosed are devices and methods for improving the initialization of devices housing memories. In one embodiment, a method is disclosed comprising writing a test program to a first region of a memory device during production of the memory device; executing a self-test program in response to detecting a first power up of the memory device, the self-test program stored within the test program; and retrieving and installing an image from a remote data source in response to detecting a subsequent power up of the memory device, the retrieving performed by the test program.

A test structure for 3D memory arrays and methods of forming the same are disclosed. In an embodiment, a memory array includes a first word line over a semiconductor substrate and extending in a first direction; a second word line over the first word line and extending in the first direction; a memory film contacting the first word line and the second word line; an oxide semiconductor (OS) layer contacting a first source line and a first bit line, the memory film being between the OS layer and each of the first word line and the second word line; and a test structure over the first word line and the second word line, the test structure including a first conductive line electrically coupling the first word line to the second word line, the first conductive line extending in the first direction.

A test structure for 3D memory arrays and methods of forming the same are disclosed. In an embodiment, a memory array includes a first word line over a semiconductor substrate and extending in a first direction; a second word line over the first word line and extending in the first direction; a memory film contacting the first word line and the second word line; an oxide semiconductor (OS) layer contacting a first source line and a first bit line, the memory film being between the OS layer and each of the first word line and the second word line; and a test structure over the first word line and the second word line, the test structure including a first conductive line electrically coupling the first word line to the second word line, the first conductive line extending in the first direction.