An apparatus is described. The apparatus includes data buffer to memory chip write training circuitry. The data buffer to memory chip write training circuitry to send MDQ/MDQS phase relationship programming information, write commands and read commands to the data buffer chips for multiple write training iterations without a host memory controller having provided the MDQ/MDQS phase relationship programming information, the write commands and the read commands to the data buffer to memory chip write training circuitry.

Memory devices, systems including memory devices, and methods of operating memory devices are described, in which memory device are configured to add variable delays to a command. The variable delays may be provided by a host device (e.g., a test equipment) using a test mode of the memory devices. Alternatively, the variable delays may be stored in nonvolatile memory (NVM) components of the memory devices. Further, mode registers of the memory devices may be set to indicate that the command is associated with the variable delays stored in the NVM components. Further, the memory devices may include delay components configured to add the variable delays to the command. Such variable delays facilitate staggered execution of the command across multiple memory devices so as to avoid (or mitigate) issues related to an instantaneous, large amount of current drawn from a power supply connected to the memory devices.

Disclosed herein is an apparatus that includes a first group including a plurality of first latch circuits coupled in series and a second group including a plurality of second latch circuits coupled in series. Each of the first latch circuits performs a latch operation in synchronization with a rise trigger signal. Each of the second latch circuits performs a latch operation in synchronization with a fall trigger signal. The rise and fall trigger signals are alternately activated every even clock cycles or every odd clock cycles. In response to a division ratio, first one or more of the first and second latch circuits are bypassed and second one or more of the first and second latch circuits are cyclically coupled.

A test circuit includes a control circuit and a counting circuit. The control circuit is configured to control a charging operation and a discharging operation on a test node. The counting circuit is configured to generate counting information by performing a counting operation during a unit measurement interval.

Memory devices may have a memory array and a delay locked loop (DLL) circuit that adjusts signals associated with operations to access of the memory array. The memory device may also include a controller that delays an access command to access the memory array by transmitting the access command through delay circuitry of the DLL circuit. This may cause the access command to be delayed by a first duration of time when output from the delay circuitry. Delay of the access command may align a data signal and the access command such that the access command and a system clock may cause latching of suitable data of the data signal.

Disclosed are a test method for self-refresh frequency of a memory array and a memory array test device. The test method includes: providing a memory array; determining a shortest duration for charge in memory cells of the memory array to leak off, and marking the shortest duration as a first duration; setting an auto-refresh cycle of the memory array according to the first duration, where the auto-refresh cycle is longer than the first duration; performing m tests, where an n.sup.th test includes sequentially performing the following: refresh position count resetting, writing preset data to the memory array, performing a self-refresh having a duration of T.sub.n, performing an auto-refresh having a duration of one auto-refresh cycle, reading the memory array, and recording a read status, where T.sub.n−1<T.sub.n, and 2≤n≤m.

Apparatuses for providing pads included in external terminals of a semiconductor device are described. An example apparatus includes a memory cell array, a data queue (DQ) circuit, a data pad and a power pad. The memory cell array may include one or more memory cells. In a write operation, the data pad receives write data and provides the write data to the DQ circuit. The DQ circuit receives the write data and provides the write data to the memory cell array. In a read operation, the DQ circuit receives read data from the memory cell array and provides the read data. The data pad receives the read data from the DQ circuit and provides the read data. The power pad provides a power supply voltage. The data pad and the power pad are disposed across from each other with respect to the DQ circuit.

A memory controller having a data receiver to sample data at a sample timing using a strobe signal, wherein the data and the strobe signal are sent by a memory device in connection with a read operation initiated by the memory controller, and a strobe receiver to receive the strobe signal, wherein a phase of the strobe signal has a drift relative to a reference by an amount. The memory controller further having a monitoring circuit to monitor the strobe signal and determine the amount of the drift, and an adjustment circuit to update the sample timing of the data receiver based on the amount of drift determined by the monitoring signal.

A semiconductor IC device comprises a timing circuit to transfer a timing signal, the timing circuit being configured to receive a first test signal and to effect a delay in the timing signal in response to the first test signal, the first test signal including a first timing event. The semiconductor IC device further comprises an interface circuit configured to transfer the data signal in response to the timing signal, the interface circuit being further configured to receive a second test signal and to effect a delay in the data signal in response to the second test signal, the second test signal including a second timing event that is related to the first timing event according to a test criterion.

In a chip-to-chip signaling system includes at least one signaling link coupled between first and second ICs, the first IC has an interface coupled to the signaling link and timed by a first interface timing signal. The second IC has an interface coupled to the signaling link and timed by a second interface timing signal that is mesochronous with respect to the first interface timing signal. The second IC further has phase adjustment circuitry that adjusts a phase of the second interface timing signal using a digital counter implemented with Josephson-junction circuit elements.