Disclosed herein is an apparatus that includes first and second shift register circuits coupled in series, the first and second shift register circuits being configured to perform a shift operation of a trigger signal in synchronization with a clock signal, and a clock control circuit configured to set a frequency of the clock signal to a first frequency when the trigger signal is in the first shift register circuit and set a frequency of the clock signal to a second frequency different from the first frequency when the trigger signal is in the second shift register circuit.

A duty adjustment circuit, and a delay locked loop circuit and a semiconductor memory device including the same are provided. The duty adjustment circuit includes a pulse generator configured to generate a pulse signal at a constant pulse width regardless of a frequency of a reference clock signal, based on frequency information, a code generator configured to generate a first predetermined number of delayed pulse signals by delaying the pulse signal, as a first code in response to the pulse signal, and a duty adjuster configured to receive a delay clock signal, and generate a duty correction clock signal by adjusting a slope of rising transition and a slope of falling transition of the delay clock signal in response to the first code and a second code.

A memory system in an embodiment includes; one or more memory chips; and a controller connected to the one or more memory chips, the controller including a first driver configured to send a sending signal to the one or more memory chips, a second driver configured to generate a boost signal that is added to the sending signal, and a control circuit configured to set an addition period for the boost signal based on information relevant to a characteristic of distortion that occurs in the sending signal to the one or more memory chips.

Memory devices may have a memory array and a delay locked loop (DLL) circuit that adjusts signals associated with operations to access of the memory array. The memory device may also include a controller that delays an access command to access the memory array by transmitting the access command through delay circuitry of the DLL circuit. This may cause the access command to be delayed by a first duration of time when output from the delay circuitry. Delay of the access command may align a data signal and the access command such that the access command and a system clock may cause latching of suitable data of the data signal.

The present disclosure provides a test system and a test method. The test system includes: a signal providing module, configured to provide a first clock signal and a second clock signal for a to-be-tested memory, the to-be-tested memory executes a write command based on the first clock signal, so that the to-be-tested memory stores preset data, and the to-be-tested memory executes a read command based on the second clock signal, to read storage data stored in the to-be-tested memory; and one of the first clock signal and the second clock signal is a symmetrical clock signal, and the other is an asymmetrical clock signal with a preset duty cycle; and a processing module, configured to obtain the storage data, and obtain a clock signal tolerance of the to-be-tested memory according to a comparison result between the storage data and the preset data.

An integrated circuit comprises a signal transmitter and a sampling circuit coupled to the signal transmitter, wherein the sampling circuit is to sample output voltage levels of an output of the signal transmitter at different respective times. The integrated circuit further comprises a measurement circuit coupled to the sampling circuit, wherein the measurement circuit is to compare the output voltage levels of the output of the signal transmitter to corresponding reference voltages to identify a first time when a first output voltage level equals a first reference voltage and a second time when a second output voltage level equals a second reference voltage. A time difference between the first time and the second time is used to configure a slew rate adjustment control of the signal transmitter.

Disclosed is an operating method of a memory device communicating with a memory controller, which includes receiving a first command from the memory controller, the first command indicating initiation of synchronization of a data clock signal and defining a clock section corresponding to the synchronization, preparing a toggling of the data clock signal during a preparation time period, processing a first data stream based on the data clock signal toggling at a reference frequency, and processing a second data stream based on the data clock toggling at the reference frequency and extended for a period of the defined first clock section.

Dynamic trim selection based on operating voltage levels for semiconductor devices and associated methods and systems are disclosed. Certain semiconductor devices are expected to operate under two or more operating voltage levels. In some embodiments, the semiconductor device can be characterized to determine optimum timing and/or voltage conditions across multiple operating voltage levels. Consequently, multiple sets of timing and/or voltage conditions can be identified depending on the operating voltage levels, which can be stored in a non-volatile memory (NVM) array of the semiconductor device. During operation, the semiconductor device can determine the operating voltage level currently supplied to the semiconductor device and select one of the timing and/or voltage conditions stored in the NVM array such that the semiconductor device can operate with the optimum timing and/or voltage conditions that has been predetermined for the semiconductor device operating under the operating voltage level.

The low end operating voltage of an integrated circuit is adjusted. Oscillations are counted at a ring oscillator on the integrated circuit over a designated period of clock cycles. Based on the number of oscillations, a prediction model associated with a first set of device degradation data and a second set of static random-access memory (SRAM) low end operating voltage data is used to select a low end operating voltage limit for a processor on the integrated circuit. The low end operating voltage of the processor is set based on the selected low end operating voltage limit. These steps are repeated multiple times during operation of the processor. A method of testing integrated circuits to provide the data employed to produce the prediction model is also provided.

According to one embodiment, a memory system includes a memory interface circuit. The memory interface circuit has delay circuits, a detection circuit, and a control circuit. One of the delay circuits applies a delay to a data signal. Another delay circuit generates, fora strobe signal, a first delay strobe signal, a second delay strobe signal, and a third delay strobe signal, each with different delay amounts. The detection circuit detects a drift in the timing of the first delay strobe signal with respect to the delayed data signal by using the delay data signal, the first delay strobe signal, the second delay strobe signal, and the third delay strobe signal. The control circuit adjusts the first delay amount, the second delay amount, and the third delay amount in a direction to compensate the drift.