Systems and methods for correcting data errors in memory caused by high-temperature processing of the memory are provided. An integrated circuit (IC) die including a memory is formed. Addresses of memory locations that are susceptible to data loss when subjected to elevated temperatures are determined. Bits of data are written to the memory, where the bits of data include a set of bits written to the memory locations. The set of bits are written to a storage device of the IC die that is not susceptible to data loss when subjected to the elevated temperatures, the subset of bits comprise compressed code. At least one of the bits stored at the addresses is overwritten after subjecting the IC die to an elevated temperature. The at least one of the bits is overwritten based on the set of bits written to the storage device.

A syndrome weight of failed decoding attempts is used to select parameters for future read retry operations. The following exemplary steps are performed until a decoding success or a predefined limited number of readings is reached: (i) reading a codeword using different read threshold voltages; (ii) mapping the readings to a corresponding likelihood value using a likelihood value assignment; and (iii) recording a syndrome weight for failed decoding attempts of the readings using the different read threshold voltages. Once the predefined limit is reached, the following exemplary steps are performed: (i) mapping the readings to a corresponding likelihood value using different likelihood value assignments, and (ii) recording a syndrome weight for failed decoding attempts of the readings using the different likelihood value assignments; and using a given read threshold voltage and/or a likelihood value assignment associated with a substantially minimum syndrome weight as an initial read threshold voltage and/or a higher priority read threshold voltage for subsequent read retry operations.

A semiconductor device including an SRAM capable of sensing a defective memory cell that does not satisfy desired characteristics is provided. The semiconductor device includes a memory cell, a bit line pair being coupled to the memory cell and having a voltage changed towards a power-supply voltage and a ground voltage in accordance with data of the memory cell in a read mode, and a specifying circuit for specifying a bit line out of the bit line pair. In the semiconductor device, a wiring capacitance is coupled to the bit line specified by the specifying circuit and a voltage of the specified bit line is set to a voltage between a power voltage and a ground voltage in a test mode.

A system includes a memory device and a processing device, operatively coupled with the memory device, to perform operations including identifying an amount of storage charge loss (SCL) that has occurred on an open block of the memory device, the open block having one or more erased pages, determining that the amount of SCL satisfies a threshold criterion corresponding to an acceptable amount of SCL to occur on the open block, and responsive to determining that the amount of SCL satisfies the threshold criterion, keeping the open block open for programming the one or more erased pages.

According to one embodiment, an electromagnet includes a first electromagnet coil having a first portion and a second portion. The first portion of the first electromagnet coil extends in a direction in parallel with a first plane. The second portion of the first electromagnet coil extends in a direction in parallel with a second plane. The first and second planes intersect at a predetermined angle.

The purpose of the invention is to compensate for the radiation tolerance of a semiconductor memory. An apparatus (10) for compensating for radiation tolerance comprises: a voltage value acquisition unit (11) that acquires a data retention voltage value that is a maximum voltage value at which data is inverted when a power supply voltage of a semiconductor memory having a latch circuit is lowered; a correction value determination unit (12) that determines a voltage correction value on the basis of a difference between the data retention voltage value and a reference voltage value; and a voltage adjustment unit (13) that adjusts at least one among the power supply voltage and a substrate bias voltage by using the voltage correction value. The reference voltage value is set to be equal to or lower than the data retention voltage value that satisfies a required radiation tolerance.

A method of setting the reference voltage for sensing data states in integrated circuits including ferroelectric random access memory (FRAM) cells of the one-transistor-one capacitor (1T-1C) type. In an electrical test operation, some or all of the FRAM cells are programmed to a particular polarization state. A “shmoo” of the reference voltage for sensing the data state is performed, at one or more worst case electrical or environmental conditions for that data state, to determine a reference voltage limit at which the weakest cell fails to return the correct data when read. A configuration register is then written with a reference voltage based on this reference voltage limit, for example at the limit plus/minus a tolerance.

According to one embodiment, a magnetic storage device includes a first and a second magnetoresistive effect element, which are disposed in an arrangement pattern including a plurality of arrangement areas, and in each of which a second ferromagnetic layer and a third ferromagnetic layer are antiferromagnetically coupled. A magnetization orientation of the third ferromagnetic layer of the first magnetoresistive effect element is antiparallel to a magnetization orientation of the third ferromagnetic layer of the second magnetoresistive effect element. The first magnetoresistive effect element is disposed in an arrangement area randomly positioned with respect to an arrangement area in which the second magnetoresistive effect element is disposed.

Disclosed are various embodiments related to stacked memory devices, such as DRAMs, SRAMs, EEPROMs, ReRAMs, and CAMs. For example, stack position identifiers (SPIDs) are assigned or otherwise determined, and are used by each memory device to make a number of adjustments. In one embodiment, a self-refresh rate of a DRAM is adjusted based on the SPID of that device. In another embodiment, a latency of a DRAM or SRAM is adjusted based on the SPID. In another embodiment, internal regulation signals are shared with other devices via TSVs. In another embodiment, adjustments to internally regulated signals are made based on the SPID of a particular device. In another embodiment, serially connected signals can be controlled based on a chip SPID (e.g., an even or odd stack position), and whether the signal is an upstream or a downstream type of signal.

A memory inspecting method and a memory inspecting system are proposed. The memory inspecting system includes a testing machine and a computer system. The memory inspecting method includes: performing a first data retention time test on a plurality of memory chips to obtain a plurality of first qualified memory chips; performing a second data retention time test on the first qualified memory chips to obtain a plurality of second qualified memory chips; performing a third data retention time test on the second qualified memory chips to obtain a plurality of third qualified memory chips. Performing a statistical analysis step on the third qualified memory chips according to a first data retention time, a second data retention time and a third data retention time of each of the third qualified memory chips is for obtaining at least one final qualified memory chip.