A memory system includes a memory module and a memory controller. The memory module includes a control device, a module temperature sensor configured to measure a module temperature and a plurality of semiconductor memory devices configured to store data. The plurality of semiconductor memory devices respectively include a plurality of temperature measurement circuits configured to measure a plurality of internal temperatures respectively corresponding to the plurality of semiconductor memory devices. The memory system is configured to generate a reference offset value based on the module temperature and the plurality of internal temperatures and perform a thermal throttling of the memory module based on the reference offset value and the module temperature. Physical damage to the semiconductor memory devices is reduced by dynamically generating the reference offset value based on the real internal temperatures of the semiconductor memory devices to perform the thermal throttling based on the reference offset value.

A method includes measuring a linearity of a first pull-up circuit, a second pull-up circuit, a third pull-up circuit, a first pull-down circuit, a second pull-down circuit and a third pull-down circuit using an initial pull-up code and an initial pull-down code, each of the first pull-up circuit, the second pull-up circuit and the third pull-up circuit having a respective resistance value determined based on a respective pull-up code, and each of the first pull-down circuit, the second pull-down circuit and the third pull-down circuit having a respective resistance value determined based on a respective pull-down code, and determining a calibration setting indicator based on the measurement result, the calibration setting indicator indicating a calibration method of a transmission driver including the first pull-up circuit, the second pull-up circuit, the third pull-up circuit, the first pull-down circuit, the second pull-down circuit and the third pull-down circuit.

Methods, systems, and devices for life expectancy monitoring for memory devices are described. Some memory devices may degrade over time, and this degradation may include or refer to a reduction of an ability of the memory device to reliably store, read, process, or communicate information, among other degradation. In accordance with examples as disclosed herein, a system may include components configured for monitoring health or life expectancy of the memory device, such as components that perform comparisons between signals or other operating characteristics resulting from operating at the memory device and one or more threshold values that may be indicative of a life expectancy of the memory device. In various examples, a memory device may perform a subsequent operation based on such a comparison, or may provide an indication of a life expectancy to a host device based on one or more comparisons or determinations about health or life expectancy.

A system includes a plurality of memory dice and a processing device coupled to the plurality of memory dice. The processing device is to determine whether an error correcting code (ECC) check of ECC-protected data read from a die of the plurality of memory dice results in detecting an error. In response to detecting the error from the ECC-protected data, the processing device performs a confirmation check that the error is a result of a defect in the die. In response to the confirmation check confirming the die is defective, the processing device ignores a temperature value from the die when determining whether to trigger a thermal-related operation.

A semiconductor device that has a normal mode of operation and a test mode of operation and can include: a first circuit that generates at least one assist signal having an assist enable logic level in the normal mode of operation, the at least one assist signal alters a read operation or a write operation to a static random access memory (SRAM) cell of the semiconductor device as compared to read or write operations when the assist signal has an assist disable logic level; and the first circuit generates the at least one assist signal having the assist disable logic level in the test mode of operation

In an SRAM circuit mounted in a semiconductor device, power supply voltage reduction circuits generate reduction voltage obtained by reducing an external power supply voltage. A first power supply voltage selection circuit selects one of the external power supply voltage and the reduction voltage as a drive voltage supplied to a word line driver. A second power supply voltage selection circuit selects one of the external power supply voltage and the reduction voltage as a voltage of a power supply line supplying an operating voltage to a memory cell.

A process is provided to trim PCRAM cells to have consistent programming curves. Initial programming curves of PCRAM cells are measured. A target programming curve is set up for the PCRAM cells. Each PCRAM cell is then modulated individually to meet the target programming curve.

Dynamically controlling voltage for access (i.e., read and/or write) operations to magneto-resistive random access memory (MRAM) bit cells to account for process variations is disclosed. An MRAM bit cell process variation measurement circuit (PVMC) is configured to measure process variations in MTJs that affect MTJ resistance, which can change write current at a given fixed supply voltage applied to an MRAM bit cell. The MRAM bit cell PVMC may also be configured to measure process variations in logic circuits representing process variations in access transistors employed in MRAM bit cells. These measured process variations in MTJs and/or logic circuits are used to dynamically determine a supply voltage for access operations to MRAM.

A memory device includes a voltage generator that provides a read voltage to a selected word line and provides a pass voltage to a plurality of unselected word lines, and a deterioration level detection circuit. The selected word line and the unselected word lines are connected to a plurality of memory cells. The deterioration level detection circuit detects a deterioration level of memory cells connected to the selected word line based on data of memory cells that receive the read voltage. The memory cells connected to the selected word line and the memory cells that receive the read voltage are included in the plurality of memory cells. The voltage generator changes the pass voltage provided to the unselected word lines based on the deterioration level.

An estimation method for a variable resistance element including (i) a first electrode, (ii) a second electrode, and therebetween (iii) a variable resistance layer in which a local region is formed which has resistive status that reversibly changes according to an electric pulse applied between the first electrode and the second electrode, the estimation method including: obtaining, when changes are made to the resistive status of the local region, measurement values each indicating a resistance state after one of the changes; and determining, based on a distribution of the obtained measurement values, an estimated amount of a physical parameter regarding structural characteristics of the local region by a calculation.