The present application provides a memory test circuit and a device wafer including the memory test circuit. The memory test circuit is coupled to a memory array having intersecting first and second signal lines, and includes a fuse element and a transistor. The fuse element has a first terminal coupled to a first group of the first signal lines and a test voltage, and has a second terminal coupled to second and third groups of the first signal lines. The transistor has a source/drain terminal coupled to the second terminal of the fuse element and another source/drain terminal coupled to a reference voltage. The first group of the first signal lines are selectively coupled to the test voltage when the transistor is turned on, and all of the first signal lines are coupled to the test voltage when the transistor is kept off.

Apparatus having an array of memory cells and a controller for access of the array of memory cells, wherein the controller is configured to cause the apparatus to apply a reference current to a selected access line, determine a time difference between a voltage level of a near end of the selected access line being deemed to exceed a first voltage level while applying the reference current and the voltage level of the near end of the selected access line being deemed to exceed a second voltage level while applying the reference current, and determine a capacitance value of the selected access line in response to a current level of the reference current, the time difference, and a voltage difference between the second voltage level and the first voltage level.

The present disclosure provides a circuit for detecting leakage between word lines in a memory device. The circuit includes a first and a second coupling capacitor. A first terminals of the first and second coupling capacitors are connected to a first word line and a second word line, respectively. The first terminals of the first and second coupling capacitors are also connected to a first and a second voltage supply, respectively. The circuit further includes a comparator, wherein a first input of the comparator is connected to a second terminal of the first coupling capacitor and a second input of the comparator is connected to a second terminal of the second coupling capacitor. The comparator is configured to send alarm signal when a differential voltage between the first input and the second input of the comparator is larger than a hysteresis level of the comparator.

Provided are memory devices and memory systems. The memory device includes a memory cell array in a first semiconductor layer and including word lines stacked in a first direction, and channel structures passing through the word lines in the first direction; a control logic circuit in a second semiconductor layer located below the first semiconductor layer in the first direction; and a physical unclonable function (PUF) circuit including a plurality of through electrodes passing through the first semiconductor layer and the second semiconductor layer, and configured to generate PUF data according to resistance values of the plurality of through electrodes, and generate the PUF data based on a node voltage between through electrodes connected in series, among the plurality of through electrodes.

Disclosed herein is a semiconductor device including a non-volatile memory unit. The non-volatile memory unit has a subject current path disposed in a semiconductor integrated circuit and a fuse element inserted in series on the subject current path, and changes output data according to a voltage between both ends of the fuse element when supply of a subject current to the subject current path is intended. A current supply part that switches the subject current between a plurality of stages is disposed in the non-volatile memory unit.

There is provided a semiconductor apparatus including a memory operation terminal group that includes a plurality of memory operation terminals; an inspection terminal group that includes a plurality of inspection terminals; a constant voltage terminal group that includes a plurality of constant voltage terminals; a drive terminal group that includes a plurality of drive terminals, the inspection terminal group, and the constant voltage terminal group, and of which voltage values change in accordance with an operation of a CPU; and a terminal mounting surface, in which at the terminal mounting surface, the inspection terminal group and the constant voltage terminal group are located to separate the memory operation terminal group and the drive terminal group, and the memory operation terminal group is located not to be adjacent to a terminal which is not included in the inspection terminal group and the constant voltage terminal group.

Methods, systems, and devices for charge leakage detection for memory system reliability are described. In accordance with examples as disclosed herein, a memory system may employ memory management techniques configured to identify precursors of charge leakage in a memory device, and take preventative action based on such identified precursors. For example, a memory system may be configured to perform a leakage detection evaluation for a memory array, which may include various biasing and evaluation operations to identify whether a leakage condition of the memory array may affect operational reliability. Based on such an evaluation, the memory device, or a host device in communication with the memory device, may take various preventative measures to avoid operational failures of the memory device or host device that may result from ongoing operation of a memory array associated with charge leakage, thereby improving reliability of the memory system.

An electronic device includes a masking signal generation circuit configured to generate a test masking signal by receiving a fuse data during a period in which a test masking mode is executed; and a test mode signal generation circuit configured to, when a test command for executing a test in an internal circuit is input, execute the test based on the test masking signal.

Technology is disclosed for detecting latent defects in non-volatile storage systems. Prior to writing data, a stress voltage is applied to SGS transistors in a 3D memory structure. After applying the stress voltage, the Vt of the SGS transistors are tested to determine whether they meet a criterion. The criterion may be whether a Vt distribution of the SGS transistors falls within an allowed range. If the criterion is not met, then a sub-block mode may be enabled. In the sub-block mode, data is not written to memory cells in a sub-block that contains SGS transistors whose Vt does not meet the criterion. Hence, the possibility of data loss due to defective SGS transistors is avoided. However, in the sub-block mode, data is written to memory cells in a sub-block that does not contain SGS transistors whose Vt does not meet the criterion. Hence, data capacity is preserved.

A test apparatus configured to test a device under test includes a power supply and a power compensation circuit. The power supply is configured to supply electric power to a power supply terminal of the device under test via a first route or a second route that are connected in parallel. The first route includes a first switch element configured to be controlled according to a first control signal. The power compensation circuit is located on the second route, wherein the power compensation circuit includes a second switch element configured to be controlled according to a second control signal, the power compensation circuit is configured to generate a compensation pulse current when the first switch element is turned off and the second switch element is turned on.