A method for detecting and isolating defective memory plane(s) of a non-volatile memory structure during a program verify operation, comprising: initiating, for each plane, a word line verify voltage level scan with a bit scan pass fail criterion and at a starting voltage located within an intended program threshold voltage distribution curve, incrementally decreasing the word line verify voltage by a predetermined offset until a specific condition of the scan is obtained, and storing the voltage at which the specific condition of the scan is obtained, wherein the stored voltage represents a voltage of an upper tail portion of an actual programmed threshold voltage distribution curve of the plane. The stored voltages of all of the memory planes of the structure are compared to determine which plane corresponds to the lowest stored voltage. A “fail” status is applied to the plane corresponding to the lowest stored voltage.

The present disclosure provides a method of analyzing a semiconductor device. The method includes providing a first transistor, a second transistor disposed adjacent to the first transistor, and a gate electrode common to the first transistor and the second transistor; connecting a power-supply voltage (V.sub.dd) to the gate electrode to turn on the first transistor, determining a first threshold voltage (V.sub.th) based on the power-supply voltage; switching the power-supply voltage to a ground voltage (V.sub.ss); connecting the ground voltage to the gate electrode to turn on the second transistor; and determining a second threshold voltage based on the ground voltage.

A three-dimensional (3D) memory device includes a memory cell array formed by a plurality of memory cells, the memory cells in a same row are connected to a same word line; a word line driving circuit including a driving voltage source for providing a driving voltage to a selected word line; at least one word line leakage detection circuit, configured to detect a leakage state of the selected word line; and at least one coupling circuit corresponding to the word line leakage detection circuit. The coupling circuit includes a switch and an isolation capacitor arranged between the switch and the word line leakage detection circuit, and the isolation capacitor is used for isolating the word line leakage detection circuit and the word line driving circuit.

Methods, systems, and devices supporting an auto-power on mode for biased testing of a power management integrated circuit (PMIC) are described. A system may program a PMIC of a memory system to a specific mode. The mode may cause the PMIC to apply a bias to a memory device of the memory system upon receiving power and independent of a command to apply the bias to the memory device. The system may transmit power to the memory system while controlling one or more operating conditions (e.g., temperature, humidity) for a threshold time. The PMIC may apply a bias to the memory device during the threshold time based on the PMIC being programmed to the mode and the transmitted power. The system may identify a capability or defect of the memory device resulting from transmitting the power to the memory system while controlling the operating conditions for the threshold time.

A method for testing a memory and a memory testing device are provided. The method for testing the memory includes writing data to a memory including a candidate storage unit, a fuse, and a redundant unit for replacing the candidate storage unit through the fuse when the candidate storage unit is determined to be defective; adjusting a temperature of the memory, and while adjusting the temperature, repeatedly refreshing the memory and recording the state of the fuse; reading the data of the memory if the temperature of the memory is stable at a predetermined temperature; and determining that the fuse is defective if the read data of the memory has an error.

A method of operating a memory device comprises generating a target voltage using a pump circuit of the memory device, the target voltage to be applied to a word line or pillar of a memory cell of the memory device; providing an indication of current generated by the pump circuit after the pump circuit output reaches the target voltage; and determining when the current generated by the pump circuit is greater than a specified threshold current and generating a fault indication according to the determination.

A method includes performing a first read operation involving a set of memory cells using a first voltage, determining a quantity of bits associated with the set of memory cells based on the first read operation, performing a second read operation involving the set of memory cells using a second voltage that is greater than the first voltage when the quantity of bits is above a threshold quantity of bits for the set of memory cells, and performing the second read operation involving the set of memory cells using a third voltage that is less than the first voltage when the quantity of bits is below the threshold quantity of bits for the set of memory cells.

A deterioration detection device includes a storage including a first current path and a second current path and configured such that a current is applied to the first current path and the second current path, a storage input control unit configured to compare an internal operating condition of a memory device with a target condition in a first operating mode and to select one of the first current path and the second current path of the storage based on a result of the comparison, and an output unit configured to output an output signal indicated deterioration, accumulated in one of the first current path and the second current path, in a second operating mode.

A storage device includes a memory including a plurality of regions arranged along a first axis and a second axis orthogonal to each other, each of the plurality of regions belonging to one of first groups and one of second groups; and a controller configured to, when a programmed and weak region exists, put into a scan list on the basis of a weak list, a programmed and weak sub-region included in the programmed and weak region among the plurality of regions, put into the scan list, a first programmed and adjacent sub-region in a first programmed and adjacent region selected according to a second axis expansion order among the plurality of regions, and put into the scan list, a second programmed and adjacent sub-region in a second programmed and adjacent region selected according to a first axis expansion order among the plurality of regions.

The present technology relates to a semiconductor memory device and a method of operating the same. The semiconductor memory device includes a memory block including memory cells, a peripheral circuit configured to program the memory cells in a set program state during a test operation and perform a test erase voltage application operation on the memory cells programmed in the set program state, and control logic configured to control the peripheral circuit to count abnormal memory cells of which a threshold voltage is less than a set threshold voltage among the memory cells.