A method includes determining a quantity of refresh operations performed on a block of a memory device of a memory sub-system and determining a quantity of write operations and a quantity of read operations performed to the block. The method also includes determining the block is read dominant using the quantity of write operations and the quantity of read operations and determining whether the quantity of refresh operations has met a criteria. The method further includes, responsive to determining that the block is read dominant and that the quantity of refresh operations has met the criteria, modifying trim settings used to operate the block of the memory device.

Provided are a non-volatile memory device, a memory system, and a method of operating the non-volatile memory device. The method includes: performing a user operation according to at least one mode selected from among a writing mode, a reading mode, and an erasing mode with respect to a memory cell array; setting up voltages of a plurality of word lines; floating at least one word line from among the plurality of word lines, the voltages of which are set up, according to the at least one selected mode; and detecting whether the at least one word line has a progressive defect, according to a result of detecting a voltage level of the at least one floated word line.

A semiconductor device including an SRAM capable of sensing a defective memory cell that does not satisfy desired characteristics is provided. The semiconductor device includes a memory cell, a bit line pair being coupled to the memory cell and having a voltage changed towards a power-supply voltage and a ground voltage in accordance with data of the memory cell in a read mode, and a specifying circuit for specifying a bit line out of the bit line pair. In the semiconductor device, a wiring capacitance is coupled to the bit line specified by the specifying circuit and a voltage of the specified bit line is set to a voltage between a power voltage and a ground voltage in a test mode.

According to an embodiment, a semiconductor device includes a transmission circuit including first and second transistors coupled in series between a first voltage terminal and a second voltage terminal, and a first common node coupled between the first and second transistors and coupled to a through line, the transmission circuit outputting a signal transferred from an internal circuit to the first common node according to an output control signal; a reception circuit including third and fourth transistors coupled in series between the first voltage terminal and the second voltage terminal, and a second common node coupled between the third and fourth transistors and coupled to the internal circuit, the reception circuit transferring a signal transferred through the through line to the internal circuit according to a first input control signal; and a deterioration acceleration circuit for applying stress to the first and third transistors according to a test signal.

Techniques are presented for determining current leakage from a memory array or other circuit based on a low voltage path. For example, the technique can be applied to determine word line to word line leakage. By looking at a count for the clock used in regulating the low voltage output node, the amount of leakage can be determined. The leakage determination can be performed as part of test process or during normal memory operations.

A memory device comprises a memory array; a word line driver circuit including a charge pump circuit configured to generate a program voltage target to be applied to a word line to program a memory cell of the memory array, and a control loop to activate the charge pump circuit using a control signal according to a comparison of a pump circuit output voltage to a specified duty cycle after the charge pump circuit output reaches the program voltage target, and provides an indication of current generated by the charge pump circuit according to the duty cycle; and logic circuitry that generates a fault indication when the current generated by the charge pump circuit is greater than a specified threshold current.

Systems, apparatuses, and methods for tracking a retention voltage are disclosed. In one embodiment, a circuit is utilized for generating a standby voltage for a static random-access memory (SRAM) array. The circuit tracks the leakage current of the bitcells of the SRAM array as the leakage current varies over temperature. The circuit mirrors this leakage current and tracks the higher threshold voltage of a p-channel transistor or an n-channel transistor, with the p-channel and n-channel transistors matching the transistors in the bitcells of the SRAM array. The circuit includes a voltage regulator to supply power to the SRAM array at a supply voltage proportional to the higher threshold voltage tracked. Setting a supply voltage of the SRAM array based on threshold voltages and leakage current may reduce power consumption as compared to using a supply voltage based on a worst case operating conditions assumption for the SRAM array.

Embodiments of the disclosure are drawn to apparatuses and methods for testing through silicon vias (TSVs) which may be used, for example, to couple layers of a semiconductor memory device. The TSVs and/or the die around the TSVs may require testing. A switch circuit may be used to selectively couple one or more test circuits to an amplifier. The test circuits may generate a voltage that is related to one or more parameters of the TSV being tested. The amplifier may amplify the voltage, which may be used to determine if the TSV passes the particular test determined by the test circuit selected by the switch circuit. The switch circuit and/or other components of the test circuits may be controlled by control signals to determine the operation of a particular test.

An electronic device including a semiconductor memory. The semiconductor memory may include a cell array including a plurality of resistive storage cells; a current code generation block suitable for generating a current code which has a value corresponding to an average value of current amounts of test currents respectively flowing through at least two first resistive storage cells among the plurality of resistive storage cells, in a test operation; and a sensing block suitable for comparing a read current flowing through a second resistive storage cell selected among the plurality of resistive storage cells with a reference current, and thereby sensing data of the second resistive storage cell, wherein the semiconductor memory is operable to adjust a current amount of at least one current flowing through the sensing block based on the value of the current code.

Methods, systems, and devices for a current monitor for a memory device are described. A memory device may monitor potential degradation of memory cells on the device by monitoring the amount of current drawn by one or more memory cells. As the memory cells degrade, the current supplied to the memory cells may change (e.g., increase due to additional leakage current. The memory device may indirectly monitor changes in the current supplied to the memory cells by monitoring a voltage of a node of a transistor that controls the amount of current supplied to the array of memory cells. The voltage at the control node may be compared to a reference voltage to determine whether the two voltages differ by a threshold amount, indicating that the memory cells are drawing more current. The memory device may output a status indicator when the voltages differ, for example, by the threshold amount.