A memory module includes: a plurality of first memory ranks that belong to a first group; a plurality of second memory ranks that belong to a second group; and a rank mapping circuit suitable for mapping a defective first memory rank among the first memory ranks to a defect-free second memory rank among the second memory ranks.

A data writing method, a memory control circuit unit and a memory storage device are provided. The method includes: executing a first programming operation to data according to a first RAID ECC rate, programming the data into at least a portion of a plurality of first physical programming units, and generating a first RAID ECC; and executing a second programming operation to the data programmed into at least the portion of the first physical programming units according to a second RAID ECC rate, programming the data into at least a portion of a plurality of second physical programming units, and generating a second RAID ECC, wherein the first RAID ECC rate is different from the second RAID ECC rate.

The present disclosure relates to methods and systems for implementing redundancy in memory controllers. The disclosed systems and methods utilize a row of memory blocks, such that each memory block in the row is associated with an independent media unit. Failures of the media units are not correlated, and therefore, a failure in one unit does not affect the data stored in the other units. Parity information associated with the data stored in the memory blocks is stored in a separate memory block. If the data in a single memory block has been corrupted, the data stored in the remaining memory blocks and the parity information is used to retrieve the corrupted data.

According to one embodiment, a memory system manages a plurality of parallel units each including blocks belonging to different nonvolatile memory dies. When receiving from a host a write request designating a third address to identify first data to be written, the memory system selects one block from undefective blocks included in one parallel unit as a write destination block by referring to defect information, determines a write destination location in the selected block, and writes the first data to the write destination location. The memory system notifies the host of a first physical address indicative of both of the selected block and the write destination location, and the third address.

A three-dimensional stacked memory device includes a buffer die having a plurality of core die memories stacked thereon. The buffer die is configured as a buffer to occupy a first space in the buffer die. The first memory module, disposed in a second space unoccupied by the buffer, is configured to operate as a cache of the core die memories. The controller is configured to detect a fault in a memory area corresponding to a cache line in the core die memories based on a result of a comparison between data stored in the cache line and data stored in the memory area corresponding to the cache line in the core die memories. The second memory module, disposed in a third space unoccupied by the buffer and the first memory module, is configured to replace the memory area when the fault is detected in the memory area.

A memory system includes: a memory device; a run-time bad block detector suitable for storing information of super memory blocks, each including a run-time bad block, in a bad list; a bit-map manager suitable for generating a bit-map representing integrity information of memory blocks in each of the super memory blocks; a short super block manager suitable for designating, among the super memory blocks, a super memory block having a number of run-time bad blocks less than or equal to a threshold as a short super memory block based on the bad list and the bit-map, whenever a logical unit configuration command is received from a host; and a processor suitable for controlling the memory device to simultaneously access normal blocks among the memory blocks forming the designated short super memory block and to perform a normal operation, based on the bit-map.

This disclosure relates to testing of integrated artificial intelligence (AI) circuit with embedded memory to improve effective chip yield and to mapping addressable memory segments of the embedded memory to multilayer AI networks at the network level, layer level, parameter level, and bit level based on bit error rate (BER) of the addressable memory segments. The disclosed methods and systems allows for deployment of one or more multilayer AI networks in an AI circuit with sufficient model accuracy even when the embedded memory has an overall BER higher than a preferred overall threshold.

A memory module is disclosed that includes a substrate, a memory device that outputs read data, and a buffer. The buffer has a primary interface for transferring the read data to a memory controller and a secondary interface coupled to the memory device to receive the read data. The buffer includes error logic to identify an error in the received read data and to identify a storage cell location in the memory device associated with the error. Repair logic maps a replacement storage element as a substitute storage element for the storage cell location associated with the error.

Remapping portions of a memory system having a plurality of non-volatile memory dice. A processing device performs a first error analysis of subslice elements to identify a first group of a predetermined number of subslice elements having highest error rates. The processing device determines which of the subslice elements are user subslice elements and remaps user subslice elements of the first group to spare subslice elements to remove subslice elements having the highest rates from a user space of the memory system. The processing device performs a second error analysis to identify a second group of subslice elements having the highest error rates and identifies user subslice elements of the first group that is/are not in the second group. For an identified user subslice element or elements of the first group not in the second group, the processing device reverses the remapping to reinstate removed subslice element(s) back into the user space.

A scheme for handling program errors is provided for a memory system which includes a memory device and a controller including firmware and a memory interface. The firmware issues commands for program operations to the memory interface. After detecting a failed program operation in a particular memory block, the firmware reroutes that program operation to a different location in a different memory block and takes further action to reduce the likelihood of a subsequent error occurring in the same memory block in which the failed program operation occurred.