A memory device is provided, including a built-in self-test circuit and a redundancy address replacement circuit. The built-in self-test circuit coupled to a main memory cell array is configured to performing a built-in self-test process on the main memory cell array so as to provide a built-in self-test signal. The redundancy address replacement circuit includes a first redundancy circuit and a second redundancy circuit. The first redundancy circuit replaces portion of word line addresses of the main memory cell array with that of a redundancy memory block according to first redundancy data signals generated by a first test process. The second redundancy circuit, coupled to the first redundancy circuit, replaces the failure word line addresses detected in the main memory cell array with another portion of word line addresses of the redundancy memory block according to the built-in self-test signal.

A semiconductor system includes a first semiconductor device and a first semiconductor device. The first semiconductor device outputs a clock, a chip selection signal and addresses. The second semiconductor device generates a masking signal from the addresses inputted in synchronization with a first pulse of the clock in response to the chip selection signal and decodes internal addresses generated from the addresses inputted in synchronization with a second pulse of the clock to select a word line. The second semiconductor device controls a connection between an address decoder and a fuse circuit in response to the masking signal. The address decoder selects the word line.

A memory device includes a main one-time programmable (OTP) memory cell connected to a main word line and a main bit line; a redundant OTP memory cell connected to a redundant word line and a redundant bit line; and an input/output circuit configured to, during a program operation to program the main OTP memory cell and the redundant OTP memory cell, electrically separate the main bit line and the redundant bit line and form a first program current path to the main bit line and a second program current path to redundant bit line, wherein the first program current path and the second program current path are independent from each other.

The purposes of the present invention are: to provide a layered semiconductor device capable of improving production yield; and to provide a method for producing said layered semiconductor device. This layered semiconductor device has, layered therein, a plurality of semiconductor chips, a reserve semiconductor chip which is used as a reserve for the semiconductor chips, and a control chip for controlling the operating states of the plurality of semiconductor chips and the operating state of the reserve semiconductor chip. In such a configuration, the semiconductor chips and the reserve semiconductor chip include contactless communication units and operating switches. The semiconductor chips and the reserve semiconductor chip are capable of contactlessly communicating with another of the semiconductor chips via the contactless communication units. The control chip controls the operating states of the semiconductor chips by switching the operating switches of the semiconductor chips, and controls the operating state of the reserve semiconductor chip by switching the operating switch of the reserve semiconductor chip.

Methods, systems, and apparatuses for redundancy in a memory array are described. A memory array may include some memory cells that are redundant to other memory cells of the array. Such redundant memory cells may be used if a another memory cell is discovered to be defective in some way; for example, after the array is fabricated and before deployment, defects in portions of the array that affect certain memory cells may be identified. Memory cells may be designated as redundant cells for numerous other memory cells of the array so that a total number of redundant cells in the array is relatively small fraction of the total number of cells of the array. A configuration of switching components may allow redundant cells to be operated in a manner that supports redundancy for numerous other cells and may limit or disturbances to neighboring cells when accessing redundancy cells.

Provided are a semiconductor memory device and a memory system including the same. The semiconductor memory device includes a power-up signal generator configured to generate a power-up signal in response to a memory voltage reaching a target voltage level, an initializer configured to generate an initialization signal in response to the power-up signal and a reset signal and to generate an initial refresh command in response to completion of an initialization operation, and a memory cell array including a plurality of memory cells connected between a plurality of word lines and a plurality of bit lines, the memory cell array configured to perform an initial refresh operation on the plurality of memory cells in response to the initial refresh command.

A semiconductor system includes a first semiconductor device and a first semiconductor device. The first semiconductor device outputs a clock, a chip selection signal and addresses. The second semiconductor device generates a masking signal from the addresses inputted in synchronization with a first pulse of the clock in response to the chip selection signal and decodes internal addresses generated from the addresses inputted in synchronization with a second pulse of the clock to select a word line. The second semiconductor device controls a connection between an address decoder and a fuse circuit in response to the masking signal. The address decoder selects the word line.

Examples of defective memory cell detection circuitry are described herein. Defective memory cell detection circuitry may provide a failure signal indicative of a failure of a sub-group of memory cells (e.g., a row of memory cells). The failure signal may be generated responsive to the failure of a sense line to transition to one of a set of reference voltages within a threshold time from a memory command. Failure signals indicative of a failure of a sub-group of memory cells may be used by vehicle computer control systems to improve performance and/or reliability of vehicle operations.

A semiconductor memory device has a memory cell array area including a normal area including memory blocks and a redundant memory area including a redundant block which is a replacement target of a defective block among memory blocks; a storage unit storing address information indicating a position of the defective block in the normal area and address information indicating a position of the redundant block being the replacement target of the defective block, both being in association with each other as a first information; and an output circuit outputting a data row exhibiting a positional relation between the defective block and a memory block other than the defective block in the normal area based on the first information stored in the storage unit in response to the data read signal.

A layered semiconductor device capable of improving production yield and a method for producing the layered semiconductor device. The layered semiconductor device has, layered therein, a plurality of semiconductor chips, a reserve semiconductor chip which is used as a reserve for the semiconductor chips, and a control chip for controlling the operating states of the plurality of semiconductor chips and the operating state of the reserve semiconductor chip. The semiconductor chips and the reserve semiconductor chip include contactless communication units and operating switches, and are capable of contactlessly communicating with another of the semiconductor chips via the contactless communication units. The control chip controls the operating states of the semiconductor chips by switching the operating switches of the semiconductor chips, and controls the operating state of the reserve semiconductor chip by switching the operating switch of the reserve semiconductor chip.