Apparatuses and methods for refreshing memory of a semiconductor device are described. An example method includes during a refresh operation, determining a respective row of a memory cells slated for refresh in each of a plurality of sections of a memory bank of a memory device, and determining whether the respective row of memory cells slated for refresh for a particular section of the plurality of sections of the memory bank has been repaired. The example method further includes in response to a determination that the row of memory cells slated for refresh has been repaired, cause a refresh within the particular section of the memory bank to be skipped while contemporaneously performing a refresh of the rows of memory cells slated for refresh in other sections of the plurality of sections of the memory bank to be refreshed.

A memory core including a memory core including memory cells that are arranged in a plurality of rows and a plurality of columns; and a refresh target selection circuit suitable for storing an address and a risk score of each of activated rows among the rows, wherein the refresh target selection circuit is further suitable for increasing the risk score of a corresponding row whenever the corresponding row is activated, whenever a row at a ‘+2’ position of the corresponding row is activated, and whenever a row at a ‘−2’ position of the corresponding row is activated.

A memory device includes a memory cell array including memory cells arranged in a plurality of rows; an ECC engine configured to detect an error in first data that is read from the memory cell array in response to a read command and a read address, to output a first error occurrence signal, and to correct the error in the first data; a row fail detector configured to output a fail row address, which indicates a fail row among the plurality of rows; and a flag generator configured to receive the read address, the first error occurrence signal, and the fail row address, and to generate a decoding state flag, which indicates whether an error is detected and whether an error is corrected, and a fail row flag, which indicates that a read row address included in the read address is the fail row address.

A system includes a memory device and a processing device, operatively coupled with the memory device, to perform operations including initiating a read operation with respect to a block of the memory device, selecting, based on a set of criteria, a default read offset from a set of read offsets, wherein the set of criteria includes at least one of: a parameter related to trigger rate, or an amount of time that an open block is allowed to remain open to control threshold voltage shift due to storage charge loss, and applying the default read offset to a read operation performed with respect to the block.

A memory device includes: a memory cell array; a sense amplifier for amplifying data stored in the memory cell array; a first memory cell sub-array included in the memory cell array directly coupled to the sense amplifier; a switch coupled to the first memory cell sub-array; and a second memory cell array included in the memory cell array coupled to the sense amplifier through the first memory cell sub-array and the switch. When the switch is enabled, the first memory cell sub-array has a first operation speed, and the second memory cell sub-array has a second operation speed slower than the first operation speed. When the switch is disabled, a bit line loading associated with the second memory cell sub-array is decreased, and the first memory cell sub-array has a third operation speed faster than the first operation speed.

A memory system includes a memory device and a memory controller. The memory device includes a memory cell array including normal memory cells and redundancy memory cells suitable for replacing failed memory cell among the normal memory cells, and a device controller for activating reserved memory cells which are included in the redundancy memory cells and not used to replace the failed memory cell. The memory controller controls the memory device, when a first memory cells are accessed more than a threshold access number, to move data stored in the first memory cells to the reserved memory cells and replace the first memory cells with the reserved memory cells.

A memory system includes a plurality of memory devices and a controller. Each of the memory devices includes a memory cell array, a sense amplifier for amplifying data stored in the memory cell array, a first memory cell sub-array included in the memory cell array directly coupled to the sense amplifier, a switch coupled to the first memory cell sub-array, and a second memory cell array included in the memory cell array coupled to the sense amplifier through the first memory cell sub-array and the switch. When the switch is enabled, the memory device operates as a normal mode, and when the switch is disabled, the memory device operates as a fast mode faster than the normal mode. The controller dynamically sets a mode of each of the memory devices based on requests externally provided, by controlling the switch of each of the memory devices.

Addresses of accessed word lines are stored. Data related to victim word lines associated with the accessed word line are also stored. The victim word lines may have data stored in relation to multiple accessed word lines. The data related to the victim word lines is adjusted when the victim word line is refreshed during a targeted refresh operation or an auto-refresh operation. The data related to the victim word lines is adjusted when the victim word line is accessed during a memory access operation.

A method of operating a memory device includes; receiving a refresh command, performing a refresh operation on a target row of a bank memory array, and providing status information to a memory controller for an adjacent row, relative to the target row, during a refresh operation period defining a refresh operation performed by the memory device.

Apparatuses and methods for refreshing memory of a semiconductor device are described. An example method includes during a refresh operation, determining a respective row of a memory cells slated for refresh in each of a plurality of sections of a memory bank of a memory device, and determining whether the respective row of memory cells slated for refresh for a particular section of the plurality of sections of the memory bank has been repaired. The example method further includes in response to a determination that the row of memory cells slated for refresh has been repaired, cause a refresh within the particular section of the memory bank to be skipped while contemporaneously performing a refresh of the rows of memory cells slated for refresh in other sections of the plurality of sections of the memory bank to be refreshed.