A memory system and method for storing data in one or more storage chips includes: one or more memory cards each having a plurality of storage chips, and each chip having a plurality of dies having a plurality of memory cells; a memory controller comprising a translation module, the translation module further comprising: a logical to virtual translation table (LVT) having a plurality of entries, each entry in the LVT configured to map a logical address to a virtual block address (VBA), where the VBA corresponds to a group of the memory cells on the one or more memory cards, wherein each entry in the LVT further includes a write wear level count to track the number of writing operations to the VBA, and a read wear level count to track the number of read operations for the VBA mapped to that LVT entry.

Various examples of the present technology provide systems and methods for tracking PPR usage in dual in-line memory modules (DIMMs) of a server system. BIOS of the server system can check a record of the PPR usage before conduct a PPR flow and send a usage status of spare row(s) of a plurality of bank groups of a DIMM to a controller (e.g., BMC) of the server system such that a user or the server system can check PPR status of each DIMM of the server system. A determination can be made either automatically by the server system or manually by the user whether or not to replace a corresponding

A Fail Bit (FB) repair method includes: a bank to be repaired of a chip to be repaired is determined; first repair processing is performed on a first FB using a redundant circuit; a bit position of a second FB in each target repair bank is determined, and second repair processing is performed on the second FB; an unrepaired FB in each target repair bank is determined, and candidate repair combinations of the unrepaired FBs and a candidate combination count are determined; and if the candidate combination count is greater than a combination count threshold, a target repair position is determined, and repair processing is performed on the target repair position using a Redundant Word-Line (RWL), the target repair position being a position of an FB that maximally reduces the candidate combination count after repair processing.

A memory device includes a memory bank that includes a first set of memory rows in a first section of the memory bank, a first set of redundant rows in a first section of the memory bank, a second set of memory rows in a second section of the memory bank, and a second set of redundant rows in the second section of the memory bank. The memory bank also includes a repeater blocker circuit that when in operation selectively blocks a signal from transmission to the second section of the memory bank and blocker control circuitry that when in operation transmits a control signal to control the selective blocking of the signal by the repeater blocker circuit.

Methods, systems, and apparatuses for redundancy in a memory array are described. A memory array may include some memory cells that are redundant to other memory cells of the array. Such redundant memory cells may be used if a another memory cell is discovered to be defective in some way; for example, after the array is fabricated and before deployment, defects in portions of the array that affect certain memory cells may be identified. Memory cells may be designated as redundant cells for numerous other memory cells of the array so that a total number of redundant cells in the array is relatively small fraction of the total number of cells of the array. A configuration of switching components may allow redundant cells to be operated in a manner that supports redundancy for numerous other cells and may limit or disturbances to neighboring cells when accessing redundancy cells.

A memory-testing circuit configured to perform a test of a memory comprising error-correcting code circuitry comprises repair circuitry configured to allocate a spare row or row block in the memory for a defective row or row block in the memory, a defective row or row block being a row or row block in which a memory word has a number of error bits greater than a preset number, wherein the test of the memory comprises: disabling the error-correcting code circuitry, performing a pre-repair operation, the pre-repair operation comprising: determining whether the memory has one or more defective rows or row blocks, and allocating one or more spare rows or row blocks for the one or more defective rows or row blocks if the one or more spare rows or row blocks are available, and performing a post-repair operation on the repaired memory.

Methods, apparatuses and systems related to managing repair assets are described. An apparatus stores a repair segment locator and a repair address for each defect repair. The apparatus may be configured to selectively apply a repair asset to one of multiple sections according to the repair segment locator.

Apparatuses, systems, and methods for fuse based device identification. A device may include a number of fuses which are used to encode permanent information on the device. The device may receive an identification request, and may generate an identification number based on the states of at least a portion of the fuses. For example, the device may include a hash generator, which may generate the identification number by using the fuse information as a seed for a hash algorithm.

A memory device includes a memory bank that includes a first set of memory rows in a first section of the memory bank, a first set of redundant rows in a first section of the memory bank, a second set of memory rows in a second section of the memory bank, and a second set of redundant rows in the second section of the memory bank. The memory bank also includes a repeater blocker circuit that when in operation selectively blocks a signal from transmission to the second section of the memory bank and blocker control circuitry that when in operation transmits a control signal to control the selective blocking of the signal by the repeater blocker circuit.

A memory device includes a cell region in which memory blocks, respectively including gate electrodes and insulating layers, alternately stacked on a substrate, and channel structures, extending in a first direction, perpendicular to an upper surface of the substrate, passing through the gate electrodes and the insulating layers, and connected to the substrate, are arranged. A peripheral circuit region includes a row decoder connected to the gate electrodes and a page buffer connected to the channel structures. The memory blocks include main blocks and at least one spare block, wherein a length of the spare block is shorter than a length of each of the main blocks, in a second direction, parallel to the upper surface of the substrate.