A semiconductor memory device has a memory cell array area including a normal area including memory blocks and a redundant memory area including a redundant block which is a replacement target of a defective block among memory blocks; a storage unit storing address information indicating a position of the defective block in the normal area and address information indicating a position of the redundant block being the replacement target of the defective block, both being in association with each other as a first information; and an output circuit outputting a data row exhibiting a positional relation between the defective block and a memory block other than the defective block in the normal area based on the first information stored in the storage unit in response to the data read signal.

A memory system includes a memory device and a controller. The memory device includes a memory cell array including a normal memory cell area and a redundancy memory cell area, the redundancy memory cell area having a replacement memory cell region and a reserved memory cell region; a register suitable for generating a first signal indicating existence of the reserved memory cell region; and a fuse unit suitable for activating the reserved memory cell region based on the first signal. The controller assigns an address for accessing a reserved memory cell of the reserved memory cell region based on the first signal. A replacement memory cell in the replacement memory cell region replaces a failed memory cell in the normal memory cell region, and the reserved memory cell in the reserved memory cell region remains without replacing any failed memory cell in the normal memory cell region.

A memory system includes a memory device and a memory controller. The memory device includes a memory cell array including normal memory cells and redundancy memory cells suitable for replacing failed memory cell among the normal memory cells, and a device controller for activating reserved memory cells which are included in the redundancy memory cells and not used to replace the failed memory cell. The memory controller controls the memory device, when a first memory cells are accessed more than a threshold access number, to move data stored in the first memory cells to the reserved memory cells and replace the first memory cells with the reserved memory cells.

A method of testing a memory device, a memory built-in self-test (MBIST) circuit, and a memory device for improving reliability and reducing a test time. The memory device includes a plurality of memory banks and the MBIST circuit. The MBIST circuit is configured to generate double data rate (DDR) test patterns and parallel bit test (PBT) test patterns to test the memory banks. When a defective cell is detected as a result of the PBT test or the DDR test, the MBIST circuit is configured to perform a repair operation for replacing the defective cell with a redundancy cell and perform a re-test to verify the repair operation. The MBIST circuit may be configured to perform the DDR test on one or more memory cells including the defective cell during the re-test.

A semiconductor system includes a first semiconductor device and a first semiconductor device. The first semiconductor device outputs a clock, a chip selection signal and addresses. The second semiconductor device generates a masking signal from the addresses inputted in synchronization with a first pulse of the clock in response to the chip selection signal and decodes internal addresses generated from the addresses inputted in synchronization with a second pulse of the clock to select a word line. The second semiconductor device controls a connection between an address decoder and a fuse circuit in response to the masking signal. The address decoder selects the word line.

A semiconductor memory device includes a memory cell array and an address decoder. The memory cell array includes a plurality of memory blocks, each of the plurality of memory blocks includes a plurality of dynamic memory cells coupled to word-lines and bit-lines, each of the plurality of memory blocks are divided into a plurality of row blocks by row block identity bits of a row address, and each of the of row blocks includes a plurality of sub-array blocks arranged in a first direction. The address decoder changes a physical row address of a memory cell that stores or outputs data based on a column address received with a write command or a read command.

Systems and methods for repairing a memory. A method includes performing a repair analysis of the embedded memories to produce repair information. The method includes storing the repair information in the registers, where the registers are organized into groups having chains of identical length. The method includes performing collision detection between the repair information in each of the groups. The method includes merging the repair information in each of the groups. The method includes repairing the embedded memories using the merged repair information.

Methods, systems, and apparatuses for redundancy in a memory array are described. A memory array may include some memory cells that are redundant to other memory cells of the array. Such redundant memory cells may be used if a another memory cell is discovered to be defective in some way; for example, after the array is fabricated and before deployment, defects in portions of the array that affect certain memory cells may be identified. Memory cells may be designated as redundant cells for numerous other memory cells of the array so that a total number of redundant cells in the array is relatively small fraction of the total number of cells of the array. A configuration of switching components may allow redundant cells to be operated in a manner that supports redundancy for numerous other cells and may limit or disturbances to neighboring cells when accessing redundancy cells.

A memory system includes a memory device and a controller. The memory device includes a memory cell array including a normal memory cell area and a redundancy memory cell area, the redundancy memory cell area having a replacement memory cell region and a reserved memory cell region; a register suitable for generating a first signal indicating existence of the reserved memory cell region; and a fuse unit suitable for activating the reserved memory cell region based on the first signal. The controller assigns an address for accessing a reserved memory cell of the reserved memory cell region based on the first signal. A replacement memory cell in the replacement memory cell region replaces a failed memory cell in the normal memory cell region, and the reserved memory cell in the reserved memory cell region remains without replacing any failed memory cell in the normal memory cell region.

A system includes a memory device having a plurality of memory dies and at least a first spare memory die and a processing device coupled to the memory device. The processing device is to perform operations including: tracking a value of a write counter representing a number of write operations performed at the plurality of memory dies; activating the first spare memory die in response to detecting a failure of a first memory die of the plurality of memory dies; storing an offset value of the write counter in response to activating the first spare memory die; and commanding the memory device to modify die trim settings of the first spare memory die at predetermined check point values of the write counter that are offset from the offset value.