A three-dimensional stacked integrated circuit (3D SIC) that can have at least a first 3D XPoint (3DXP) die and, in some examples, can have at least a second 3DXP die too. In such examples, the first 3DXP die and the second 3DXP die can be stacked. The 3D SIC can be partitioned into a plurality of columns that are perpendicular to each of the stacked dies. In such examples, when a first column of the plurality of columns is determined as failing, data stored in the first column can be replicated to a second column of the plurality of columns. Also, for example, when a part of a first column of the plurality of columns is determined as failing, data stored in the part of the first column can be replicated to a corresponding part of a second column of the plurality of columns.

An information handling system includes interleaved dual in-line memory modules (DIMMs) that are partitioned into logical partitions, wherein each logical partition is associated with a namespace. A DIMM controller sets a custom DIMM-level namespace-based threshold to detect a DIMM error and to identify one of the logical partitions of the DIMM error using the namespace associated with the logical partition. The detected DIMM error is repaired if it exceeds an error correcting code (ECC) threshold.

A memory system includes a memory device including a plurality of memory blocks, each including a plurality of memory cells coupled to a plurality of word lines, and a controller configured to determine an operation status regarding a selected memory block among the plurality of memory blocks by performing read test operations to the selected memory block in stages. During the read test operations, the controller adjusts the numbers of word lines selected in each of the stages, based on an error.

Some examples described herein relate to redundancy in a multi-chip stacked device. An example described herein is a multi-chip device. The multi-chip device includes a chip stack including vertically stacked chips. Neighboring pairs of the chips are directly connected together. Each of two or more of the chips includes a processing integrated circuit. The chip stack is configurable to operate a subset of functionality of the processing integrated circuits of the two or more of the chips when any portion of the processing integrated circuits is defective.

An information handling system includes interleaved dual in-line memory modules (DIMMs) that are partitioned into logical partitions, wherein each logical partition is associated with a namespace. A DIMM controller sets a custom DIMM-level namespace-based threshold to detect a DIMM error and to identify one of the logical partitions of the DIMM error using the namespace associated with the logical partition. The detected DIMM error is repaired if it exceeds an error correcting code (ECC) threshold.

A memory device includes a memory region; and an access unit suitable for setting an offset value according to control of an external device, changing, in response to an access command of the external device for a first address of the memory region, the first address into a second address of the memory region based on the offset value, and performing an access operation for the second address.

Apparatuses, systems, and methods to perform continuous read operations are described. A system configured to perform such continuous read operations enables improved access to and processing of data for performance of associated functions. For instance, one apparatus described herein includes a memory device having an array that includes a plurality of pages of memory cells. The memory device includes a page buffer coupled to the array and a continuous read buffer. The continuous read buffer includes a first cache to receive a first segment of data values and a second cache to receive a second segment of the data values from the page buffer. The memory device is configured to perform a continuous read operation on the first and second segments of data from the first cache and the second cache of the continuous read buffer.

A three-dimensional stacked integrated circuit (3D SIC) that can have at least a first 3D XPoint (3DXP) die and, in some examples, can have at least a second 3DXP die too. In such examples, the first 3DXP die and the second 3DXP die can be stacked. The 3D SIC can be partitioned into a plurality of columns that are perpendicular to each of the stacked dies. In such examples, when a first column of the plurality of columns is determined as failing, data stored in the first column can be replicated to a second column of the plurality of columns. Also, for example, when a part of a first column of the plurality of columns is determined as failing, data stored in the part of the first column can be replicated to a corresponding part of a second column of the plurality of columns.

A memory system includes: a memory device; a run-time bad block detector suitable for storing information of super memory blocks, each including a run-time bad block, in a bad list; a bit-map manager suitable for generating a bit-map representing integrity information of memory blocks in each of the super memory blocks; a short super block manager suitable for designating, among the super memory blocks, a super memory block having a number of run-time bad blocks less than or equal to a threshold as a short super memory block based on the bad list and the bit-map, whenever a logical unit configuration command is received from a host; and a processor suitable for controlling the memory device to simultaneously access normal blocks among the memory blocks forming the designated short super memory block and to perform a normal operation, based on the bit-map.

A three-dimensional stacked integrated circuit (3D SIC) that can have at least a first 3D XPoint (3DXP) die and, in some examples, can have at least a second 3DXP die too. In such examples, the first 3DXP die and the second 3DXP die can be stacked. The 3D SIC can be partitioned into a plurality of columns that are perpendicular to each of the stacked dies. In such examples, when a first column of the plurality of columns is determined as failing, data stored in the first column can be replicated to a second column of the plurality of columns. Also, for example, when a part of a first column of the plurality of columns is determined as failing, data stored in the part of the first column can be replicated to a corresponding part of a second column of the plurality of columns.