A semiconductor memory device is provided. The semiconductor memory device can suppress increases in power consumption. As a result, damage to the data normally caused by row hammer problem can be prevented. The semiconductor memory device includes a control unit. The control unit controls a refresh operation for a memory to be performed at any interval, wherein there are a plurality of possible intervals. When read/write access to the memory is required, the control unit controls the refresh operation for the memory to be performed with a shortest interval among the intervals, until a predetermined condition is met.

Disclosed are various embodiments related to stacked memory devices, such as DRAMs, SRAMs, EEPROMs, ReRAMs, and CAMs. For example, stack position identifiers (SPIDs) are assigned or otherwise determined, and are used by each memory device to make a number of adjustments. In one embodiment, a self-refresh rate of a DRAM is adjusted based on the SPID of that device. In another embodiment, a latency of a DRAM or SRAM is adjusted based on the SPID. In another embodiment, internal regulation signals are shared with other devices via TSVs. In another embodiment, adjustments to internally regulated signals are made based on the SPID of a particular device. In another embodiment, serially connected signals can be controlled based on a chip SPID (e.g., an even or odd stack position), and whether the signal is an upstream or a downstream type of signal.

A system includes a memory controller and a memory device having a command interface, refresh circuitry, control logic, and a plurality of memory banks, each with a plurality of rows of memory cells. The command interface is operable to receive a refresh command from a memory controller and the refresh circuitry is configured to perform one or more refresh operations to refresh data stored in at least one bank of the plurality of memory banks during a refresh time interval in response to the refresh command from the memory controller. The control logic is to configure the command interface to enter a calibration mode during the refresh time interval, and the command interface is configured to perform a calibration operation in the calibration mode during the refresh time interval.

Devices and techniques for temperature informed memory refresh are described herein. A temperature counter can be updated in response to a memory device write performed under an extreme temperature. Here, the write is performed on a memory device element in the memory device. The memory device element can be sorted above other memory device elements in the memory device based on the temperature counter. Once sorted to the top of these memory device elements, a refresh can be performed the memory device element.

The present disclosure relates to a SEDRAM-based stacked Cache system, a controlling method and a Cache device. The stacked Cache system is integrated in multiple layers of wafers bonded together and includes a Cache, a Cache controller and a SEDRAM controller; the multiple layers of wafers includes a SEDRAM wafer structure and a processor wafer structure; a SEDRAM unit is integrated in each layer of SEDRAM wafer in the SEDRAM wafer structure and configured as a storage space of the Cache; a CPU, the Cache controller, the SEDRAM controller and a memory controller are integrated in the processor wafer structure.

A method to perform an on demand refresh operation of a memory sub-system is disclosed. The method includes identifying a temporal attribute of user data stored in the memory component, upon determining that the identified temporal attribute satisfies a time condition, providing an indication whether a refresh operation of the user data improves performance of the memory component, receiving an indication to perform the refresh operation of the memory component, and responsive to a time between the refresh operation and a previously performed refresh operation not satisfying a threshold criterion, refraining from performing the refresh operation of the memory component.

In an embodiment, a memory controller in an integrated circuit may generate refreshes for one or more DRAMs coupled to the integrated circuit according to a refresh rate. The integrated circuit may include one or more temperature sensors. A rate of change of the temperature may be determined from the temperature sensors. If the rate is greater than a threshold, the memory controller may generate refreshes according to a refresh rate specified by the DRAMs. If the rate is less than the threshold, the memory controller may generate refreshes at a reduced refresh rate.

Methods, apparatuses, and systems related to managing operations performed in response to refresh management (RFM) commands. A controller generates the RFM command for coordinating a refresh management operation targeted for implementation at an apparatus. The apparatus tracks refresh target set that includes refresh management target locations within the apparatus. According to the tracked refresh management target set, the apparatus selectively implements the targeted refresh management operation and/or a response operation in addition to or as a replacement for the targeted refresh management operation.

Embodiments of the present application provide a refresh circuit and a memory. The refresh circuit includes: a refresh control module configured to receive and execute a refresh command to output a row address refresh signal; and further configured to receive a process corner signal to adjust an execution proportion of the refresh command, the faster a process corner represented by the process corner signal, the higher the adjusted execution proportion; a row addresser configured to receive the row address refresh signal and output a to-be-refreshed single-row address; and an array refresh device configured to perform a single-row refresh operation according to the single-row address and output a single-row refresh end signal after the end of single-row refresh. The embodiments of the present application help reduce the consumption of refresh currents.

A semiconductor memory apparatus is provided. The semiconductor memory apparatus includes a temperature sensor, a plurality of memory blocks and a refresh controller. The temperature sensor detects a device temperature inside the semiconductor memory apparatus to generate a corresponding temperature signal. Each of the memory blocks includes a memory cell array having a plurality of volatile memory cells, and a plurality of word lines. The refresh controller monitors accesses to the word lines, detects accesses that occur a predetermined number of times within a predetermined period, and assigns a refresh operation corresponding to the refresh operation command to a first refresh operation or a second refresh operation.