Apparatus and methods are disclosed, including memory devices and systems. Example memory devices, systems and methods include a buffer interface to translate high speed data interactions on a host interface side into slower, wider data interactions on a DRAM interface side. The slower, and wider DRAM interface may be configured to substantially match the capacity of the narrower, higher speed host interface. In some examples, the buffer interface may be configured to provide multiple sub-channel interfaces each coupled to one or more regions within the memory structure and configured to facilitate data recovery in the event of a failure of some portion of the memory structure. Selected example memory devices, systems and methods include an individual DRAM die, or one or more stacks of DRAM dies coupled to a buffer die.

Apparatus and methods are disclosed, including memory devices and systems. Example memory devices, systems and methods include a buffer interface to translate high speed data interactions on a host interface side into slower, wider data interactions on a DRAM interface side. The slower, and wider DRAM interface may be configured to substantially match the capacity of the narrower, higher speed host interface. In some examples, the buffer interface may be configured to provide multiple sub-channel interfaces each coupled to one or more regions within the memory structure and configured to facilitate data recovery in the event of a failure of some portion of the memory structure. Selected example memory devices, systems and methods include an individual DRAM die, or one or more stacks of DRAM dies coupled to a buffer die.

A semiconductor device includes a counter configured to count a refresh signal and output a counting signal. The semiconductor device may include a mode control circuit configured to receive a first mode signal for controlling a refresh cycle and a second mode signal for constantly controlling a refresh cycle, in correspondence to error correction code information, configured to output an advanced refresh signal in which the refresh cycle is adjusted, by controlling the counting signal depending on the first mode signal, and configured to output a smart refresh signal which has a constant refresh cycle, in correspondence to the second mode signal. The semiconductor device may include a refresh control circuit configured to output a bank address for performing a refresh operation that is set in correspondence to the advanced refresh signal and the smart refresh signal, to a bank.

A memory device includes an error correction code (ECC) block suitable for performing an ECC operation, and generating a flag signal when an error is detected and corrected through the ECC operation in data read from a memory cell array, and a refresh control block suitable for comparing an active row address with a target address in response to the flag signal, and refreshing data of a neighboring address of the target address based on a comparison result.

A memory system includes: a memory device including a plurality of banks; and a memory controller suitable for: controlling an operation of the memory device, calculating row hammer information for each of the banks for each program having a command set requested from a host, and scheduling the banks based on the row hammer information for each of the banks corresponding to a specific program when the specific program is requested from the host.

Methods, systems, and apparatuses for memory (e.g., DRAM) having an error check and scrub (ECS) procedure in conjunction with refresh operations are described. While a refresh operation reads the code words of a memory row, ECS procedures may be performed on some of the sensed code words. When the write portion of the refresh begins, a code word discovered to have errors may be corrected before it is written back to the memory row. The ECS procedure can be incremental across refresh operations, beginning, for example, each ECS at the code word where the pervious ECS for that row left off. The ECS procedure can include an out-of-order (OOO) procedure where ECS is performed more often for certain identified code words.

Methods, systems, and devices for an error correcting code scrub scheme are described. A memory device may correct an error associated with a first data bit or a first parity bit of a plurality of data bits and a plurality of parity bits, respectively. The memory device may correct the error by reading each of the plurality of data bits and the plurality of parity bits from a memory array, and determining that an error associated with a single bit exists. The memory device may then correct the determined single-bit error, and may write the corrected bit directly back to the memory array.

A memory system includes a memory device including memory cells, and a controller that performs a write operation, a read operation, and a check operation on the memory device. During the check operation, the controller controls the memory device to read check data from target memory cells of the memory cells by using a check level, compares the check data with original data stored in the target memory cells, and determines a reliability of the target memory cells or the check data based on a result of the comparison.

A memory system includes a memory device having a plurality of volatile memory modules therein, and a memory controller, which is electrically coupled to the plurality of volatile memory modules. The memory controller is configured to correct an error in a first of the plurality of volatile memory modules in response to generation of an alert signal by the first of the plurality of volatile memory modules, concurrently with an operation to refresh at least a portion of a second of the plurality of volatile memory modules upon the generation of the alert signal.

A method of ECC encoding a DRAM and a DRAM thereof. The method comprises determining whether to encode the data according to the value of a flag bit while the DRAM is being refreshed. The ECC encoding module encodes data only if of the flag bit setting and detecting module generates an enable signal. As a result, the length of the valid data for ECC encoding can be guaranteed to comply with the requirements of ECC encoding.