A semiconductor device is provided. The semiconductor device has a semiconductor layer comprising a source/drain region, a first magnetic layer over the semiconductor layer, and a first dielectric layer over the source/drain region and adjacent the first magnetic layer. The semiconductor device has a metal structure extending through the first dielectric layer, a second magnetic layer over the metal structure, and a second dielectric layer over the first magnetic layer and adjacent the first dielectric layer.

The present disclosure provides a semiconductor structure including a substrate, a transistor region having a gate over the substrate, a first doped region, and a second doped region at least partially in the substrate, and a contact plug directly over the gate, a first metal interconnect composed of copper over the transistor region, and a magnetic tunneling junction (MTJ) directly over the contact plug and under the first metal interconnect.

A magnetoresistance device is disclosed, comprising a bottom electrode, a magnetic tunneling junction (MTJ) disposed on the bottom electrode, a top electrode disposed on the magnetic tunneling junction, a first spacer disposed on the magnetic tunneling junction and covering a sidewall of the top electrode, and a second spacer disposed on the first spacer and conformally covering along a sidewall of the first spacer, a sidewall of the magnetic tunneling junction and a sidewall of the bottom electrode.

A magnetoresistance device is disclosed, comprising a bottom electrode, a magnetic tunneling junction (MTJ) disposed on the bottom electrode, a top electrode disposed on the magnetic tunneling junction, a first spacer disposed on the magnetic tunneling junction and covering a sidewall of the top electrode, and a second spacer disposed on the first spacer and conformally covering along a sidewall of the first spacer, a sidewall of the magnetic tunneling junction and a sidewall of the bottom electrode.

To accurately read data in a storage device provided with a cell having a variable resistance value. In a reference cell circuit, a resistance value changes to a predetermined initial value when an initialization signal exceeding a predetermined reversal threshold is input. A reference side signal source inputs a reference side read signal of a predetermined value not exceeding the predetermined reversal threshold to the reference cell circuit after the initialization signal is input to the reference cell circuit when there is an instruction to read with respect to a memory cell. A cell side signal source inputs a cell side read signal of the predetermined value to the memory cell after the initialization signal is input. A comparison unit compares a reference signal output from the reference cell circuit into which the reference side read signal has been input, and a cell signal output from the memory cell into which the cell side read current has been input, and acquires the comparison result as read data.

Memory cells with improved tunneling magnetoresistance ratio (TMR) are disclosed. In some embodiments such devices may include a magnetoresistive tunnel junction (MTJ) element coupled in series with a tunneling magnetoresistance enhancement element (TMRE). The MTJ element and TMRE may each be configured to transition between high and low resistance states, e.g., in response to a voltage. In some embodiments, the MTJ and TMRE are configure such that when a read voltage is applied to the cell while the MTJ is in its low resistance state the TMRE is driven to is low resistance state, and when such voltage is applied while the MTJ is in its high resistance state, the TMRE remains in its high resistance state. Devices and systems including such memory cells are also disclosed.

A magnetic wall utilization-analog memory element includes a magnetic wall driving layer including a magnetic wall, a first region, a second region, and a third region located between the first region and the second region, a magnetization fixed layer provided at a the third region through a nonmagnetic layer, and a lower electrode layer provided at a position in the third region that overlaps the magnetization fixed layer in plan view on a second surface opposite to a first surface on which the magnetization fixed layer is provided.

Techniques for reading a Multi-Bit Cell (MBC) can include sensing a state parameter value, such as source line voltage, and applying a successive one of N programming parameter values, such as successive programming currents, between instances of sensing the state parameter values. The N successive programming parameter values can be selected to switch the state of a corresponding one of N cell elements of the MBC. Successive ones of the sensed state parameter values can be compared to determine N state change results, which can be used to determine the read state of the MBC.

A Magnetic Tunnel Junction (MTJ) can include an annular structure and a planar reference magnetic layer disposed about the annular structure. The annular structure can include an annular non-magnetic layer disposed about an annular conductive layer, an annular free magnetic layer disposed about the annular non-magnetic layer, and an annular tunnel insulator disposed about the annular free magnetic layer. The planar reference magnetic layer can be separated from the free magnetic layer by the annular tunnel barrier layer.

The present disclosure provides a semiconductor structure including a substrate, a transistor region having a gate over the substrate and a doped region at least partially in the substrate, a first metal layer over the transistor region, and a magnetic tunneling junction (MTJ) between the transistor region and the first metal layer. The present disclosure provides a method for manufacturing a semiconductor structure, including forming a transistor region over a substrate, the transistor region comprising a gate and a doped region, forming a magnetic tunneling junction (MTJ) over the transistor region, electrically coupling to the transistor region, and forming a first metal layer over the MTJ, electrically coupling to the MTJ and the transistor region.