A resistive memory including a first storage circuit, a verification circuit, a second storage circuit and a control circuit is provided. The first storage circuit includes various cell groups. Each of the cell groups includes at least one memory cell. The verification circuit is coupled to the first storage circuit to verify whether a specific operation performed on at least one of the memory cells was successful. The second storage circuit includes various flag bits. Each of the flag bits corresponds to a cell group. In a reset period, the control circuit is configured to perform a first reset operation or a second reset operation on a first memory cell of a specific cell group among the cell groups according to a specific flag bit corresponding to the specific cell group.

According to one embodiment, a semiconductor memory includes a first memory cell array including a plurality of first memory cells; and a second memory cell array including a plurality of second memory cells. Each of threshold voltages of the first memory cells and the second memory cells is set to any of a first threshold voltage, a second threshold voltage higher than the first threshold voltage, and a third threshold voltage higher than the second threshold voltage. Data of three or more bits including a first bit, a second bit, and a third bit is stored using a combination of a threshold voltage of the first memory cell and a threshold voltage of the second memory cell.

According to one embodiment, a memory system includes a semiconductor memory device including a memory cell capable of holding at least 4-bit data and a controller configured to control a first write operation and a second write operation based on the 4-bit data. The controller includes a conversion circuit configured to convert 4-bit data into 2-bit data. The semiconductor memory device includes a recovery controller configured to recover the 4-bit data based on the converted 2-bit data and data written in the memory cell by the first write operation. The first write operation is executed based on the 4-bit data received from the controller, and the second write operation is executed based on the 4-bit data recovered by the recovery controller.

Systems, methods, and apparatus including computer-readable mediums for managing block arrangement of super blocks in a memory such as NAND flash memory are provided. In one aspect, a memory controller for managing block arrangement of super blocks in a memory includes control circuitry coupled to the memory having at least two planes of physical blocks and configured to maintain block information of each individual physical block in the planes and select one or more physical blocks from the planes for a super block based on the block information of the physical blocks in the planes.

Devices and techniques for NAND temperature-aware operations are disclosed herein. A device controller can receive a command to write data to a component in the device. A temperature corresponding to the component can be obtained in response to receiving the command. The command can be executed by the controller to write data to the component. Executing the command can include writing the temperature into a management portion of the device that is separate from a user portion of the device to which the data is written.

According to one embodiment, a memory system includes a semiconductor memory and a controller. The memory system is capable of executing a first operation and a second operation. In the first operation, the controller issues a first command sequence, the semiconductor memory applies a first voltage to a first word line and applies a second voltage to a second word line to read data from the first memory, and the read data is transmitted to the controller from the semiconductor memory. In the second operation, the controller issues a second command sequence, the semiconductor memory applies a third voltage to the first word line and applies a fourth voltage to the second word line, and data held in the memory cell array is left untransmitted to the controller.

A non-volatile memory has an array of non-volatile memory cells, first reference word lines and second reference word lines, and sense amplifiers. The sense amplifiers read system data, that has been written to supplemental non-volatile memory cells of the first reference word lines, using comparison of the supplemental non-volatile memory cells of the first reference word lines to supplemental non-volatile memory cells of the second reference word lines. Status of erasure of the non-volatile memory cells of the array is determined based on reading the system data.

A memory system may include: a memory device including a memory cell array, the memory cell array including a plurality of scan areas, each of the plurality of the scan areas including at least two group areas, each of the group areas including a flag area storing a flag that represents whether a corresponding group area is programmed or not; and a controller suitable for requesting the memory device to read the flag of each of the group areas a flag when a sudden power-off occurs, and rebuilding at least one of the group areas when at least one of the flags is in an erase state.

Data storage circuits are connected to the bit lines in a one-to-one correspondence. A write circuit writes the data on a first page into a plurality of 5 first memory cells selected simultaneously by a word line. Thereafter, the write circuit writes the data on a second page into the plurality of first memory cell. Then, the write circuit writes the data on the first and second pages into second memory cells adjoining 10 the first memory cells in the bit line direction.

A non-volatile memory device may include a memory cell array, a peripheral circuit and a control logic. The memory cell array may include pages including data cells and over-program flag cells configured to represent whether or not the data cells may correspond to an over-programmed cells. The peripheral circuit may be configured to store data in the memory cell array or read the data from the memory cell array. The control logic may be configured to determine whether or not the data cells are programmable when a program command may be received from an external device. The control logic may be configured to program the over-program flag cell corresponding to the data cells when the data cells are not programmable.