A non-volatile memory device, described herein, comprises: a plurality of memory strings and at least one control circuit in communication with the non-volatile memory cell array. The at least one control circuit is configured to perform, for the plurality of memory strings, one erase-verify iteration in an erase operation including determining whether at least one memory string of the plurality of memory strings passes an erase-verify test. The at least one control circuit is configured to, if the at least one memory string passes the erase-verify test, inhibit the at least one memory string for erase including ramping up, to an erase voltage, of a voltage applied to a gate of a SGD transistor of the at least one memory string and to perform a next erase-verify iteration in the erase operation for remaining memory strings of the plurality of memory strings other than the at least one memory string.

According to one embodiment, a memory system includes a semiconductor memory and a controller. The semiconductor memory includes first to fourth word lines and first to fourth memory cells. The controller is configured to issue first and second instructions. The controller is further configured to execute a first operation to obtain a first read voltage based on a threshold distribution of the first memory cell, and a second operation to read data from the second memory cell.

In certain aspects, a memory device includes a memory cell array having rows of memory cells, word lines respectively coupled to the rows of memory cells, and a peripheral circuit coupled to the memory cell array through the word lines. Each memory cell is configured to store a piece of N-bits data in one of 2.sup.N levels, where N is an integer greater than 1. The level corresponds to one of 2.sup.N pieces of N-bits data. The peripheral circuit is configured to program, in a first pass, a row of target memory cells, such that each target memory cell is programmed into one of K intermediate levels based on the corresponding piece of N-bits data, wherein 2.sup.N-1<K<2.sup.N. The peripheral circuit is also configured to program, in a second pass after the first pass, the row of target memory cells, such that each target memory cell is programmed into one of the 2.sup.N levels based on the corresponding piece of N-bits data.

A memory device includes a plurality of memory cells arranged in a plurality of rows and a plurality of strings. A method of programming the memory device includes programming a first row of the memory cells. The method also includes, after programing the first row of the memory cells, programming a second row of the memory cells. The second row is adjacent to the first row in a first string direction. The method further includes, after programming the second row of the memory cells, programming a third row of the memory cells. The third row is two rows apart from the second row in a second string direction opposite to the first string direction.

An operating method of a memory device, which includes a first memory region and a second memory region, includes reading first data from the first memory region and storing the read first data in a data buffer block, performing a first XOR operation on the first data provided from the data buffer block and second data read from the second memory region to generate first result data, writing the first data stored in the data buffer block in the second memory region, performing a second XOR operation on the first data and the first result data to generate the second data, storing the generated second data in the data buffer block, and writing the second data stored in the data buffer block in the first memory region.

A memory device can include a memory block operatively connected to a common source line and a plurality of bit lines, wherein the memory block includes first and second sub-blocks each having a respective position in the memory block relative to the common source line and the plurality of bit lines. The memory device can be operated by receiving a command and an address from outside the memory device and performing a precharge operation on the memory block in response to the command, using a first precharge path through the memory block or a second precharge path through the memory block based on the respective position of the first or second sub-block that includes a word line that is configured to activate responsive to the address.

A method of operating a semiconductor device, the semiconductor device includes: a memory block including a plurality of word lines; and a control logic for performing a first program operation on first memory cells corresponding to a first word line among the plurality of word lines, performing the first program operation on second memory cells corresponding to a second word line adjacent to the first word line, performing a second program operation on the first memory cells, performing a dummy program operation on third memory cells corresponding to a third word line adjacent to the second word line, and performing the second program operation on the second memory cells.

Memory having an array of memory cells might include control logic configured to cause the memory to inhibit memory cells of a first subset of memory cells from programming during each programming pulse of a first plurality of programming pulses and enable those memory cells for programming for at least one programming pulse of a second plurality of programming pulses, inhibit memory cells of a second subset of memory cells from programming during each programming pulse of the second plurality of programming pulses and enable those memory cells for programming for at least one programming pulse of the first plurality of programming pulses, and enable memory cells of a third subset of memory cells for programming during at least one programming pulse of the first plurality of programming pulses and during at least one programming pulse of the second plurality of programming pulses.

According to one embodiment, a memory system includes a semiconductor memory and a controller. The semiconductor memory includes first to fourth word lines and first to fourth memory cells. The controller is configured to issue first and second instructions. The controller is further configured to execute a first operation to obtain a first read voltage based on a threshold distribution of the first memory cell, and a second operation to read data from the second memory cell.

The present technology relates to an electronic device. According to the present technology, a method of operating a memory device including a program operation speed in which an effect of a disturbance is reduced, and including a plurality of memory blocks each including a plurality of memory cell strings each including a plurality of memory cells connected in series between a bit line and a source line, a plurality of source select transistors connected in series between the source line and the plurality of memory cells, and a plurality of drain select transistors connected in series between the bit line and the plurality of memory cells, includes applying a precharge voltage to the source line, and applying the precharge voltage to a first source select line connected to a source select transistor adjacent to the source line among source select transistors included in an unselected memory block among the plurality of memory blocks.