Methods, systems, and devices for modifying memory bank operating parameters are described. Operating parameter(s) may be individually adjusted for memory banks or memory bank groups within a memory system based on trimming information. The local trimming information for a memory bank or memory bank group may be stored in a fuse set that also stores repair information for the particular memory bank or in a fuse set that also stores repair information for a memory bank in the particular memory bank group. The local trimming information may be applied to operating parameters for particular memory banks or memory bank groups relative to or instead of global adjustments applied to operating parameters of multiple or all of the memory banks in the memory system.

Various embodiments, disclosed herein, include apparatus and methods of using the apparatus having a core array of memory cells arranged as data storage elements; and an array of latches to store repair information for the core array. Each latch can be structured as a static random access memory cell. Additional apparatus, systems, and methods are disclosed.

Example implementations relate to dynamic random-access memory (DRAM) row sparing. In example implementations, utilization of a failed row of a DRAM device may be excluded. A fuse in the DRAM device may be blown to replace the failed row with a spare row. The fuse may be blown during runtime operation of the DRAM device. Error-correcting code (ECC) may be used to correct erroneous data from the failed row while the fuse is being blown. Accesses of the failed row may be redirected to the spare row after the fuse is blown.

An anti-fuse device includes: a substrate; an anti-fuse gate, partially embedded in the substrate, a portion of the anti-fuse gate embedded in the substrate having one or more sharp corners; and an anti-fuse gate oxide layer, located between the anti-fuse gate and the substrate.

Various embodiments, disclosed herein, include apparatus and methods of using the apparatus having a core array of memory cells arranged as data storage elements; and an array of latches to store repair information for the core array. Each latch can be structured as a static random access memory cell. Additional apparatus, systems, and methods are disclosed.

The present disclosure provides a memory test system, including a tester and a processor. The tester is configured to perform a final test to the memory device to obtain a test result, and read a read-only data of the packaged memory device. The processor is coupled to the tester, configured to perform a function to transform the read-only data to a chip ID of the packaged memory device when the memory device does not pass the final test according to the test result. When the packaged memory device does not pass the final test, the processor is further configured to obtain a process history of the packaged memory device according to the chip ID.

The present disclosure provides a memory test system, including a tester and a processor. The tester is configured to perform a final test to the memory device to obtain a test result, and read a read-only data of the packaged memory device. The processor is coupled to the tester, configured to perform a function to transform the read-only data to a chip ID of the packaged memory device when the memory device does not pass the final test according to the test result. When the packaged memory device does not pass the final test, the processor is further configured to obtain a process history of the packaged memory device according to the chip ID.

Example implementations relate to dynamic random-access memory (DRAM) row sparing. In example implementations, utilization of a failed row of a DRAM device may be excluded. A fuse in the DRAM device may be blown to replace the failed row with a spare row. The fuse may be blown during runtime operation of the DRAM device. Error-correcting code (ECC) may be used to correct erroneous data from the failed row while the fuse is being blown. Accesses of the failed row may be redirected to the spare row after the fuse is blown.

The invention provides a layout pattern of static random access memory, which comprises a plurality of fin structures on a substrate, a plurality of gate structures on the substrate and spanning the fin structures to form a plurality of transistors distributed on the substrate. The transistors include a first pull-up transistor (PU1), a first pull-down transistor (PD1), a second pull-up transistor (PU2) and a second pull-down transistor (PD2), a first access transistor (PG1), a second access transistor (PG2), a first read port transistor (RPD) and a second read port transistor (RPG). The gate structure of the first read port transistor (RPD) is connected to the gate structure of the first pull-down transistor (PD1), wherein a drain of the first pull-down transistor (PD1) is connected to a first voltage source Vss1, and a drain of the first read port transistor (RPD) is connected to a second voltage source Vss2.