The invention relates to a control system for an optical coherence tomography imaging system to be used with a microscopy system for viewing and/or imaging a subject (190, 192), the microscopy system comprising an objective (164) and a viewing lens system (170) including a relay lens (172), wherein the viewing lens system (170) is arranged at a subject’s side of the objective (164), the control system being configured to perform the following steps: controlling the optical coherence tomography imaging system to perform at least one radial scan of a surface (176) of the relay lens (172), determining, from data of the at least one radial scan at least one curve corresponding to a shape of the surface (176) of the relay lens (172), determining (520), from the at least one curve a lateral offset (178) between a center of the relay lens (172) and an origin of the optical coherence tomography imaging system, and adjusting the origin of the optical coherence tomography imaging system taking into account to the lateral offset (178), to an arrangement with an OCT imaging system and a method for adjusting an OCT imaging system.

A method for calibrating a measuring device (10) for interferometrically determining a shape of an optical surface (12) of an object under test (14). The measuring device includes a module plane (32) for arranging a diffractive optical test module (30) which is configured to generate a test wave (34) that is directed at the optical surface and that has a wavefront at least approximately adapted to a target shape (60) of the optical surface. The method includes: arranging a diffractive optical calibration module (44) in the module plane for generating a calibration wave (80), acquiring a calibration interferogram (88) generated using the calibration wave in a detector plane (43) of the measuring device, and determining a position assignment distribution (46) of points (52) in the module plane to corresponding points (54) in the detector plane from the acquired calibration interferogram.

A method for calibrating at least one optical sensor of a laser machining head is provided. The laser machining head comprises a first optical sensor, a deflection device, and a focusing device. A laser beam path of the first optical sensor passes through the deflection device and the focusing device. The method comprises the steps of: deflecting the beam path of the first optical sensor by the deflection device to a first position on a first reference; generating a first optical measurement signal based on measurement light received by the first optical sensor from the first position on the first reference; and determining a correction value for calibrating the first optical sensor based on the first optical measurement signal and according to a deviation of the first position on the first reference from a first target position, which is specified relative to a position of the machining laser beam.

Embodiments of systems and methods for measuring a surface topography of a semiconductor structure are disclosed. In certain examples, a plurality of interference signals, each corresponding to a respective one of a plurality of positions on a surface of the semiconductor structure, are measured. Calibration signals, associated with a baseline region corresponding to a first category of a plurality of categories and a calibrated region corresponding to a second category of the plurality of categories, are measured. A surface height offset, associated with the baseline region and the calibrated region, is determined based on original surface heights and the calibration signals. The original surface heights are determined based on the plurality of interference signals corresponding to the baseline region and the calibrated region. The surface topography of the semiconductor structure is characterized based, at least in part, on the surface height offset and the original surface heights.

This optical interference tomographic imaging device comprising: a wavelength swept laser light source; a splitting means for splitting light emitted from the light source into object light and reference light; an irradiation means for directing the object light outputted to an object, and scanning a predetermined range; a light spectral data generation means for generating information regarding the wavelength dependency of the intensity ratio of interfering light of the reference light and the object light that has been directed to the object to be measured and has been scattered; a wavelength dispersion compensation processing means for performing compensation for the information regarding the wavelength dependency generated, the compensation carried out based on the wavelength dispersion difference of the path of the object light path and the path of the reference light; and a cross section structure information generation means for generating cross section structure information of the object.

A calibration method includes the steps of placing a structure to be measured at a first position, measuring a first distance from a laser interferometer to a reflector, and measuring first coordinates of a body to be measured, moving the structure to be measured to a second position, measuring a second distance from the laser interferometer to the reflector and measuring second coordinates of the structure to be measured with the coordinate measuring apparats, while the structure to be measured is at the second position, determining a scale error of the reference instrument, mounting the reference instrument, measuring the interval between objects to be measured, and calculating a calibration value of the interval between the objects to be measured.

The invention relates to a device for measuring a substrate for semiconductor lithography with a reference interferometer for ascertaining the change in the ambient conditions, wherein the reference interferometer comprises a means for changing the optical path length of a measurement section of the reference interferometer, wherein the means is configured to bring about a change in the refractive index.

Furthermore, the invention relates to a method for correcting cyclic error components of a reference interferometer, wherein the reference interferometer comprises a means for changing the optical path length of a measurement section of the reference interferometer, comprising the following method steps: starting up the reference interferometer, continuously detecting measurement values of the reference interferometer, changing the optical path length of the measurement section of the reference interferometer until a path length change of at least one quarter of the wavelength of the reference interferometer is detected, determining the cyclic errors on the basis of the continuously detected measurement values of the reference interferometer, and correcting the current measurement values ascertained by the reference interferometer on the basis of the cyclic errors ascertained.

Embodiments of systems and methods for measuring a surface topography of a semiconductor chip are disclosed. In an example, a method for measuring a surface topography of a semiconductor chip is disclosed. A plurality of interference signals each corresponding to a respective one of a plurality of positions on a surface of the semiconductor chip are received by at least one processor. The interference signals are classified by the at least one processor into a plurality of categories using a model. Each of the categories corresponds to a region having a same material on the surface of the semiconductor chip. A surface height offset between a surface baseline and at least one of the categories is determined by the at least one processor based, at least in part, on a calibration signal associated with the region corresponding to the at least one of the categories. The surface topography of the semiconductor chip is characterized by the at least one processor based, at least in part, on the surface height offset and the interference signals.

A microscope is provided which includes an optical module, an OCT module, and a control device. The optical module is configured to generate optical image representations. The OCT module is configured to generate tomographic recordings. The control device is configured to determine the relative spatial position of a marking element, in each case from an optical image representation of the marking element and from a tomographic recording of the same marking element.

A measurement apparatus (10) for interferometrically determining a surface shape of a test object (14). A radiation source provides an input wave (42), a multiply-encoded diffractive optical element (60), which is configured to produce by diffraction from the input wave a test wave (66) that is directed at the test object and has a wavefront in the form of a free-form surface and at least one calibration wave (70), and a capture device (46). The calibration wave has a wavefront with a non-rotationally symmetric shape (68f), wherein cross sections through the wavefront of the calibration wave along cross-sectional surfaces each aligned transversely to one another have a curved shape. The curved shapes in the different cross-sectional surfaces differ in terms of an opening parameter. The capture device (46) captures a calibration interferogram formed by superimposing a reference wave (40) with the calibration wave after interaction with a calibration object (74).