A non-destructive opto-acoustic metrology device detects the presence and location of non-uniformities in a film stack that includes a large number, e.g., 50 or more, transparent layers. A transducer layer at the bottom of the film stack produces an acoustic wave in response to an excitation beam. A probe beam is reflected from the layer interfaces of the film stack and the acoustic wave to produce an interference signal that encodes data in a time domain from destructive and constructive interference as the acoustic wave propagates upward in the film stack. The data may be analyzed across the time domain to determine the presence and location of one or more non-uniformities in the film stack. An acoustic metrology target may be produced with a transducer layer configured to generate an acoustic wave with a desired acoustic profile based on characteristics of the film stack.

Systems and processes are provided for measuring carbon deposits on an engine. In some examples, a light source can be transmitted through a viewing window of an engine onto an area of an internal surface of the engine and reflected back through the viewing window and detected using an optical sensor. A topography of the area can be determined based, at least in part, on the reflected light source detected by the optical sensor and used to determine whether carbon deposits have increased, decreased, or remained constant on the area.

A method and device of thin film spectroellipsometric imaging are disclosed. The device comprises an illuminator to direct light through a polarization generator system toward an extended area of a sample; an imaging system to form images; a detection system to record in a plurality of spectral channels; a computer to display and analyze the recorded images; and at least one reference phantom with known optical properties to replace the sample for calibration. The method comprises directing light from an illuminator through a polarization generator system toward an extended area of a sample having a geometrical shape; forming images with an imaging system; adjusting a polarization generator system and a polarization analyzer system to obtain a series of polarimetric setups; recording the images with a detection system in a plurality of spectral channels; replacing the sample with at least one reference phantom; and analyzing the recorded images with a computer.

A measuring device includes a measuring stage on which a subject is placed, an X-ray irradiation unit, an X-ray detection unit that detects scattered X-rays generated from the subject and an analysis unit that analyzes the diffraction image obtained by photo-electrically converting scattered X-rays and presumes (estimates) the three-dimensional shape of the subject. In the subject, holes are formed in the ON stack film from the opening of the etching mask film formed on the ON stack film. The analysis unit presumes the three-dimensional shape of the subject based a plurality of the diffraction images acquired while changing a rotation angle of the measuring stage and the measurement data of the subject by at least one of measuring methods of a multi-wavelength light measurement and a laser ultrasonic wave measurement.

A method for optical inspection includes illuminating a patterned polymer layer on a semiconductor wafer with optical radiation over a range of infrared wavelengths, measuring spectral properties of the optical radiation reflected from multiple points on the patterned polymer layer over the range of infrared wavelengths, and based on the measured spectral properties, computing a complex refractive index of the patterned polymer layer.

A method of inspecting a component includes the steps of identifying a component having an outer surface of a first hardness, and mounted with a holding member of a second hardness which is greater than the first hardness. A protective coating is provided about the first component, and the protective coating having a dye which absorbs a particular range of electromagnetic wavelengths. The amount of the dye remaining in the coating is inspected to identify an amount of wear of the coating.

A film-thickness measuring method capable of substantially extending a wavelength range of a spectrum of reflected light from a workpiece, and accurately measuring a film thickness is disclosed. The film-thickness measuring method includes: pressing a workpiece against a polishing pad, while rotating a polishing table that supports the polishing pad, to polish the workpiece; during the polishing of the workpiece, directing light to the workpiece from a liquid-seal sensor and a transparent-window sensor disposed in the polishing table and receiving reflected light from the workpiece by the liquid-seal sensor and the transparent-window sensor; and determining a film thickness of the workpiece based on a spectrum of the reflected light from the workpiece.

A method for determining thickness of layers of the tear film includes reconstructing a full- or hyper-spectral interference pattern from an imaged multi-spectral pattern. Tear film thickness can then be estimated from the full- or hyper-spectral interference pattern. Using a full- or hyper-spectral interference pattern provides a greater number of frequency sampling points for increased tear film thickness estimation accuracy, without traditional time consuming techniques.

Disclosed are apparatuses and methods for measuring a thickness. The apparatus for measuring a thickness including a light source that emits a femto-second laser, an optical coupler through which a portion of the femto-second laser is incident onto a target and other portion of the femto-second laser is incident onto a reference mirror, a detector configured to receive a reflection signal reflected on the reference mirror and a sample signal generated from the target and configured to measure a thickness of the target based on an interference signal between the reflection signal and the sample signal, and a plurality of optical fiber lines configured to connect the light source, the optical coupler, and the detector to each other may be provided.

A method of processing a substrate according to a PECVD process is described. Temperature profile of the substrate is adjusted to change deposition rate profile across the substrate. Plasma density profile is adjusted to change deposition rate profile across the substrate. Chamber surfaces exposed to the plasma are heated to improve plasma density uniformity and reduce formation of low quality deposits on chamber surfaces. In situ metrology may be used to monitor progress of a deposition process and trigger control actions involving substrate temperature profile, plasma density profile, pressure, temperature, and flow of reactants.