A method for obtaining information about a layer of an organic solderability preservative on a printed circuit board, the method including Providing or producing a printed circuit board (16) having a copper layer (18) covering a part of an area of the printed circuit board (16), Providing a fluorescence measuring system (10),
the method including following steps a) Obtaining (S2) information about the location of the openings (21) on the printed circuit board (16), b) Selecting (S3) at least one of the openings (21), thereby obtaining at least one selected opening, c) Moving (S4) the radiation source (11) and the printed circuit board (16) relatively to each other, d) Detecting (S5) the fluorescent radiation (23).

An oxide layer thickness measurement device according to the present invention stores, for each of layer thickness measurement sub-ranges constituting a layer thickness measurement range, layer thickness conversion information representing a correlation between a layer thickness and an emitting light luminance where a ratio of a change in the emitting light luminance to a change in the layer thickness in the layer thickness measurement sub-range falls within a set extent. The device includes a plurality of emitting light luminance measurement parts for measuring emitting light luminances of a surface of a steel sheet at respective measurement wavelengths different from each other. Calculated in connection with each of the emitting light luminances of the surface of the steel sheet measured by the emitting light luminance measurement parts are the layer thickness corresponding to the measured emitting light luminance and a ratio at the layer thickness by using the layer thickness conversion information corresponding to each of the emitting light luminance measurement parts. The calculated layer thickness is extracted as a candidate value for an actual thickness layer when the calculated ratio is within the set extent assigned for the layer thickness conversion information.

An oxide layer thickness measurement device according to the present invention stores, for each of layer thickness measurement sub-ranges constituting a layer thickness measurement range, layer thickness conversion information representing a correlation between a layer thickness and an emitting light luminance where a ratio of a change in the emitting light luminance to a change in the layer thickness in the layer thickness measurement sub-range falls within a set extent. The device includes a plurality of emitting light luminance measurement parts for measuring emitting light luminances of a surface of a steel sheet at respective measurement wavelengths different from each other. Calculated in connection with each of the emitting light luminances of the surface of the steel sheet measured by the emitting light luminance measurement parts are the layer thickness corresponding to the measured emitting light luminance and a ratio at the layer thickness by using the layer thickness conversion information corresponding to each of the emitting light luminance measurement parts. The calculated layer thickness is extracted as a candidate value for an actual thickness layer when the calculated ratio is within the set extent assigned for the layer thickness conversion information.

An oxide layer thickness measurement device according to the present invention stores, for each of layer thickness measurement sub-ranges constituting a layer thickness measurement range, layer thickness conversion information representing a correlation between a layer thickness and an emissivity where a ratio of a change in the emissivity to a change in the layer thickness in the layer thickness measurement sub-range falls within a set extent. Emitting light luminances of a surface of a steel sheet are measured at respective measurement wavelengths different from each other, and a temperature of the surface of the steel sheet is measured to thereby calculate the emissivity at each of the measurement wavelengths. Calculated in connection with the emissivity calculated at each of the measurement wavelength are the layer thickness corresponding to the emissivity at the measurement wavelength, and a ratio at the layer thickness by using the layer thickness conversion information corresponding to the measurement wavelength. The calculated thickness is extracted as a candidate value for an actual layer thickness when the calculated ratio is within the preset extent assigned for the layer thickness conversion information.

A virtual metrology apparatus, a virtual metrology method, and a virtual metrology program that allow a highly accurate virtual metrology process to be performed is provided. A virtual metrology apparatus includes an acquisition unit configured to acquire a time series data group measured in association with processing of a target object in a predetermined processing unit of a manufacturing process, and a training unit configured to train a plurality of network sections by machine learning such that a result of consolidating output data produced by the plurality of network sections processing the acquired time series data group approaches inspection data of a resultant object obtained upon processing the target object in the predetermined processing unit of the manufacturing process.

The present invention relates to devices and methods for detecting the amount (degree, extent) of material coating a medical device or substrate, in particular the present invention relates to devices and methods for detecting the amount of vaccine material coating a microarray patch.

A device for detecting a coating applied to a surface includes a portable housing, a light source, a light detector, and a processing unit. The light source emits a first light having a first wavelength. The coating includes a fluorophore that re-emits a second light having a second wavelength, which is different than the first wavelength, in response to excitation by the first light. The light detector receives the second light re-emitted from the coating. The processing unit is adapted to determine a re-emission intensity of the second light and to determine a coverage metric of the coating based on the re-emission intensity of the second light. The coverage metric is then used to infer the efficacy of the coating.

The present invention relates to a method and device for fast and accurate mapping of the thickness of a thin film (10), particularly on a silicon wafer. The method comprises of irradiating the thin film (10) with excitation radiation of at least two wavelengths, wherein a luminescent image is captured during irradiation. In a preferred embodiment, the silicon wafer can move, for example during transport on a belt in a production line. These procedures can be used for online diagnostics of silicon wafer thicknesses in the production of solar cells. Exemplary embodiments include a method and device for obtaining images of an entire silicon wafer and can provide quick feedback for process control if preferably connected to a computing unit.

A method includes: navigating a spray nozzle across and applying a coating to a region of a structure via the spray nozzle; illuminating the coating applied to the region; detecting an intensity of light emitted by the coating at the region; calculating a coating thickness of the coating applied to the region of the structure based on the intensity of light; in response to the coating thickness exceeding a threshold thickness, confirming application of the coating on the region of the structure; in response to the coating thickness falling below the threshold thickness, flagging the region of the structure for coating repair.

The present invention relates to devices and methods for detecting the amount (degree, extent) of material coating a medical device or substrate, in particular the present invention relates to devices and methods for detecting the amount of vaccine material coating a microarray patch.