A shape measurement device includes: a displacement detector configured to detect displacement of a contact; a relative movement mechanism configured to relatively move the displacement detector with respect to the measurement object, and allow the contact to trace a surface to be measured of the measurement object; a position detecting sensor configured to detect a relative position of the displacement detector with respect to the measurement object; a camera configured to image the contact, and output a captured image of the contact; and a synchronization controller configured to repetitively execute three actions in synchronization together while the relative movement is being performed by the relative movement mechanism, the actions including detection of the relative position by the position detecting sensor, detection of the displacement by the displacement detector, and imaging by the camera.

The invention discloses a toric mirror surface shape measurement method. The measurement method is as follows: first, according to the parameter information of the toric mirror to be measured, using three-dimensional modeling software, establish a CAD model of the toric mirror to be measured and then import the CAD model into the three-coordinate machine software, based on the three-coordinate machine to measure and construct the geometric characteristics of the solid toric mirror, establish the workpiece coordinate system, which is consistent with the CAD model coordinate system. Finally, use the three-coordinate machine to perform scanning measurements to the solid toric mirror and compare the scanning result with the theoretical value to obtain the measurement result data. The measurement method of the present invention is based on the three-coordinate measurement technology and has the advantages of strong operability and high measurement accuracy.

An additive manufacturing system includes an additive manufacturing unit configured to shape an object including a plurality of layers, a measurement unit configured to measure a state of each of the plurality of layers, and a control unit. The control unit includes a storage unit configured to store reference information based on internal defect information indicating a defect existing inside a sample object shaped by the additive manufacturing unit and including the plurality of layers, based on an electromagnetic wave which has passed through the sample object, and sample measurement information indicating a measurement result of the plurality of layers of the sample object measured by the measurement unit, and an estimation unit configured to estimate whether a defect occurs inside the object, based on measurement information indicating a measurement result of the plurality of layers of the object measured by the measurement unit and the reference information.

A profilometer provides, to a controller, a feedback signal indicative of topography of an exposed surface of an object that is being manufactured by a 3d printer. The profilometer includes an emitter and a camera. The emitter illuminates a region of surface of the object with a pattern having an edge that defines a boundary of an illuminated portion of the surface. The camera receives an image that transitions between a first state in which the edge is visible in the image at a location that is indicative of the surface's depth and a second state in which the edge is not visible at all. From this second state, the controller obtains information representative of a depth of the surface.

A bump inspection device images a wafer that includes a plurality of bumps arranged in parallel to each other. Each of the bumps is elongated along a first direction that is along a substrate surface. The bump inspection device includes: a laser-light source that emits laser light in a direction that is inclined relative to the substrate surface; a camera that images the substrate surface onto which the laser light is emitted; and a direction adjusting portion that adjusts an arrangement relation between the direction in which the laser light is emitted and an orientation of the wafer to allow the first direction to become inclined relative to the direction in which the laser light is emitted, in a plan view. The camera images the wafer while the first direction is inclined relative to the direction in which the laser light is emitted, in a plan view.

A machine for processing an edge profile of an ophthalmic lens. The machine is defined by mutually perpendicular X, Y and Z axes. The machine comprises a machine frame, a lens holder unit for selectively holding the ophthalmic lens, a laser scanner unit for determining an edge profile of the ophthalmic lens mounted to the lens holder unit, and a main controller operatively connected to each of the lens holder unit and the laser scanner unit. The lens holder unit is configured to selectively rotate the ophthalmic lens around a C-axis of the lens holder unit, tilt the ophthalmic lens relative to the laser scanner unit and move rectilinearly relative to the machine frame in the directions of the Y axis. The laser scanner unit is selectively moveable rectilinearly relative to the machine frame in the directions of the X and Z axes.

An apparatus for modelling a shaft in 3D, includes a sensor head adapted to be axially moved within the shaft. The sensor head includes: image sensors placed along the circumference of the sensor head, adapted to take images along an inner circumference of the shaft; a measuring apparatus adapted to determine a measured height position of the sensor head within the shaft. A processing unit includes: a placement module configured to place the images in a virtual space, based on the measured height position and the positioning of the image sensors on the sensor head, a correction module configured to correct the placement, based on comparing overlapping images and/or based on a measured deviation of the sensor head with respect to a central axis of the shaft.

A method for optically inspecting a surface (10) of an object (1) and an inspection device (9) are described. With the method a temporally periodic pattern (13) with different illumination patterns (130) is generated on the surface (10) by means of a illumination device (8) of the inspection device (9) during an image recording sequence (13), and in the image recording sequence a number of images of the pattern (13) on the surface (10) are recorded by means of an image recording device (7) of the inspection device (9), wherein generating one of the different illumination patterns (130) is synchronised, respectively, with the image recording of one of the images of the pattern (13), the phase of the pattern (13) is determined from the succession of the recorded known illumination patterns (130) in at least one image point and defects (4, 5) on the surface (10) are detected from deviations of the recorded illumination pattern (130) from the generated known illumination pattern (130). The illumination device (8) and the image recording device (7) are arranged in the reflection angle (α), wherein the object (1) is moved relative to the inspection device (9) and the duration of the image recording sequence is chosen such that a sequence reflection zone (17) can be regarded as constant (FIG. 4b).

The invention relates to a device for determining the three-dimensional geometry of an individual object, the device comprising, a supplier, a line projection, an image capturing system, and a processing unit connected to the first image capturing system for receiving the first signal, wherein the processing unit is configured to: determine, for each image from the image capturing system, a two-dimensional representation of a slice of the object; and determine, using the representation of each slice, a three-dimensional representation of the object. The invention also relates to a method of determining a three-dimensional representation of an individual object, the method comprising amongst others said steps performed by the processing unit.

Methods and systems for determining the integrity of a manufactured board are disclosed. An example system includes a testing platform configured to secure the manufactured board, a sensor configured to measure a parameter corresponding to a flatness of a surface of the board, and a controller. The controller is configured to identify regions on the surface corresponding to one of a peak or a valley based on the parameter, and calculate a score representing the integrity of the manufactured board based on the identified peaks and valleys. The controller adjusts a flow rate, a pressure, a temperature, and position of a deposited substance in a manufacturing process based on a comparison with a height of the peak and/or a depth of the valley to stored peak heights and/or valley depths. In some examples, a mechanical tester determines a compressive strength and a density of the board at the identified regions.