Patent classifications
G01C19/574
Systems and methods for a time-based optical pickoff for MEMS sensors
Systems and methods for a time-based optical pickoff for MEMS sensors are provided. In one embodiment, a method for an integrated waveguide time-based optical-pickoff sensor comprises: launching a light beam generated by a light source into an integrated waveguide optical-pickoff monolithically fabricated within a first substrate, the integrated waveguide optical-pickoff including an optical input port, a coupling port, and an optical output port; and detecting changes in an area of overlap between the coupling port and a moving sensor component separated from the coupling port by a gap by measuring an attenuation of the light beam at the optical output port, wherein the moving sensor component is moving in-plane with respect a surface of the first substrate comprising the coupling port and the coupling port is positioned to detect movement of an edge of the moving sensor component.
Systems and methods for a time-based optical pickoff for MEMS sensors
Systems and methods for a time-based optical pickoff for MEMS sensors are provided. In one embodiment, a method for an integrated waveguide time-based optical-pickoff sensor comprises: launching a light beam generated by a light source into an integrated waveguide optical-pickoff monolithically fabricated within a first substrate, the integrated waveguide optical-pickoff including an optical input port, a coupling port, and an optical output port; and detecting changes in an area of overlap between the coupling port and a moving sensor component separated from the coupling port by a gap by measuring an attenuation of the light beam at the optical output port, wherein the moving sensor component is moving in-plane with respect a surface of the first substrate comprising the coupling port and the coupling port is positioned to detect movement of an edge of the moving sensor component.
3-AXIS GYROSCOPE WITH ROTATIONAL VIBRATION REJECTION
Columnar multi-axis microelectromechanical systems (MEMS) devices (such as gyroscopes) balanced against undesired linear and angular vibration are described herein. In some embodiments, the columnar MEMS device may comprise at least two multiple-mass columns, each having at least three proof masses and being configured to sense rotation about a respective axis. The motion and mass of the proof masses may be controlled to achieve linear and rotational balancing of the MEMS device. The columnar MEMS device may further comprise one or more modular drive structures disposed alongside each multiple-mass column to facilitate displacement of the proof masses of a respective column. The MEMS devices described herein may be used to sense roll, yaw, and pitch angular rates.
3-AXIS GYROSCOPE WITH ROTATIONAL VIBRATION REJECTION
Columnar multi-axis microelectromechanical systems (MEMS) devices (such as gyroscopes) balanced against undesired linear and angular vibration are described herein. In some embodiments, the columnar MEMS device may comprise at least two multiple-mass columns, each having at least three proof masses and being configured to sense rotation about a respective axis. The motion and mass of the proof masses may be controlled to achieve linear and rotational balancing of the MEMS device. The columnar MEMS device may further comprise one or more modular drive structures disposed alongside each multiple-mass column to facilitate displacement of the proof masses of a respective column. The MEMS devices described herein may be used to sense roll, yaw, and pitch angular rates.
Rotation-rate sensor having a substrate having a main extension plane for detecting a rotation rate
A rotation-rate sensor having a substrate with main extension plane, for detecting a rotation rate, extending in a direction parallel/orthogonal to the main plane; the sensor including a primary/secondary pair of seismic masses; the primary pair having first/second primary masses; the secondary pair having first/second secondary masses; the first/second primary masses being movable relative to the substrate along a primary deflection direction extending parallel to the main plane; the first/second secondary masses being movable relative to the substrate along a secondary deflection direction extending parallel to the main plane; the first/second primary masses and the first/second primary masses being movable antiparallel or parallel to one another corresponding to the deflection direction, essentially extending orthogonally to the secondary deflection direction; and the primary pair and/or secondary pair being drivable so that, based on sensor rotation, the Coriolis force leads to deflection of the first/second primary masses and/or the first/second secondary masses.
Rotation-rate sensor having a substrate having a main extension plane for detecting a rotation rate
A rotation-rate sensor having a substrate with main extension plane, for detecting a rotation rate, extending in a direction parallel/orthogonal to the main plane; the sensor including a primary/secondary pair of seismic masses; the primary pair having first/second primary masses; the secondary pair having first/second secondary masses; the first/second primary masses being movable relative to the substrate along a primary deflection direction extending parallel to the main plane; the first/second secondary masses being movable relative to the substrate along a secondary deflection direction extending parallel to the main plane; the first/second primary masses and the first/second primary masses being movable antiparallel or parallel to one another corresponding to the deflection direction, essentially extending orthogonally to the secondary deflection direction; and the primary pair and/or secondary pair being drivable so that, based on sensor rotation, the Coriolis force leads to deflection of the first/second primary masses and/or the first/second secondary masses.
A QUADRATURE COMPENSATION METHOD FOR MEMS GYROSCOPES AND A GYROSCOPE SENSOR
The present invention relates to a gyroscope sensor (102) for detecting a rotational motion about a sensitivity axis (104) and comprising means for quadrature compensation. The gyroscope sensor comprises a total inertial mass (105) comprising a first inertial mass (106) and a second inertial mass (108) physically attached to each other and arranged such that a rotation of the first inertial mass about a detection axis caused by the coriolis force when the gyroscope sensor is subjected to a rotation about a sensitivity axis. The gyroscope further comprises a first drive structure having a displaceable drive frame which may cause a respective of the first or second inertial mass to rotate about the detection axis in order to compensate for quadrature errors originating from faulty coupling between a drive mode and a sense mode of the gyroscope sensor.
Microsystem device and methods for fabricating the same
A microsystem includes a base layer formed from an electrical insulating material. The base layer has an inner surface defining a cavity and an external surface opposed to the inner surface, and in direct communication with an environment. A cap layer and a microelectromechanical (MEMS) device layer are formed from electrical insulating material or an other electrical insulating material. The cap has an inner surface defining a cavity, and an external surface opposed to the inner surface, and in direct communication with the environment. A MEMS device on/in the MEMS device layer is disposed between the base and the cap. Respective adjacent portions of the base, the cap and the device substrate are bonded to define an enclosed space. The enclosed space at least partially includes the base cavity or the cap cavity. At least a portion of a MEMS device on the device layer is in the enclosed space.
Microsystem device and methods for fabricating the same
A microsystem includes a base layer formed from an electrical insulating material. The base layer has an inner surface defining a cavity and an external surface opposed to the inner surface, and in direct communication with an environment. A cap layer and a microelectromechanical (MEMS) device layer are formed from electrical insulating material or an other electrical insulating material. The cap has an inner surface defining a cavity, and an external surface opposed to the inner surface, and in direct communication with the environment. A MEMS device on/in the MEMS device layer is disposed between the base and the cap. Respective adjacent portions of the base, the cap and the device substrate are bonded to define an enclosed space. The enclosed space at least partially includes the base cavity or the cap cavity. At least a portion of a MEMS device on the device layer is in the enclosed space.
Sensor including moving masses and means for detecting relative movements of the masses
A MEMS type inertial sensor comprising a support structure having at least a first seismic body and a second seismic body connected thereto by resilient means in order to be movable in a suspension plane, transducers for maintaining the seismic bodies in vibration and for determining movements of the seismic bodies in the suspension plane, and a control unit connected to the transducers by electrical conductor means. The transducers comprise at least one electrode secured to the first seismic body and at least one electrode secured to the second seismic body, the two electrodes being arranged to enable relative movements of the seismic bodies relative to each other in the suspension plane to be measured directly.