A device for determining the mass flow of a fluid includes a line for conducting the fluid in a flow direction to a contact with a heat exchanger. The heat exchanger has a surface temperature which is constant in the flow direction. The device also includes a first temperature measuring position upstream from the exchanger for determining a first fluid temperature, a second temperature measuring position downstream from the heat exchanger for determining a second fluid temperature, and a third temperature measuring position for detecting the surface temperature of the heat exchanger.

The present invention provides a thermal flow meter 300 which reduces a stress applied from a fixing portion 3721, which is used to hold and fix a circuit package 400 with respect to a housing 302, to the circuit package 400 and has high reliability. In the thermal flow meter of the invention, the circuit package 400 embedded with a flow rate measurement circuit is formed through a first resin molding process, the fixing portion 3721 is formed along with the housing 302 through a second resin molding process, and the circuit package 400 is enveloped by the fixing portion 3721, whereby the circuit package 400 is held by and fixed to the housing 302. In order to reduce the influence of a stress, generated based on a temperature change of the fixing portion 3721, on the circuit package 400, the fixing portion 3721 is constituted of a thick portion 4714 and a thin portion 4710. Since thickness of a resin of the thin portion 4710 is small, the stress to be generated is small, and a force applied to the circuit package 400 can be reduced.

The present invention provides a thermal flow meter 300 which reduces a stress applied from a fixing portion 3721, which is used to hold and fix a circuit package 400 with respect to a housing 302, to the circuit package 400 and has high reliability. In the thermal flow meter of the invention, the circuit package 400 embedded with a flow rate measurement circuit is formed through a first resin molding process, the fixing portion 3721 is formed along with the housing 302 through a second resin molding process, and the circuit package 400 is enveloped by the fixing portion 3721, whereby the circuit package 400 is held by and fixed to the housing 302. In order to reduce the influence of a stress, generated based on a temperature change of the fixing portion 3721, on the circuit package 400, the fixing portion 3721 is constituted of a thick portion 4714 and a thin portion 4710. Since thickness of a resin of the thin portion 4710 is small, the stress to be generated is small, and a force applied to the circuit package 400 can be reduced.

A medical device, for example, an anesthesia apparatus or ventilator, including a hot wire sensor (10); a hot wire sensor (10) and a hot wire module (14) for a hot wire sensor (10) are provided. A first hot wire and a second hot wire (26, 28), namely, a measuring wire (26) and a compensation wire (28), are connectable to the hot wire sensor (10), for example, in the form of a hot wire module (14), in an electrically conductive manner. A first contact pair (52, 54) is associated with the measuring wire (26) for contacting same and a second contact pair (56, 58) is associated with the compensation wire (28) for contacting same. The contacts of the second contact pair (56, 58) are configured as leading contacts in relation to at least one of the contacts of the first contact pair (52, 54).

A medical device, for example, an anesthesia apparatus or ventilator, including a hot wire sensor (10); a hot wire sensor (10) and a hot wire module (14) for a hot wire sensor (10) are provided. A first hot wire and a second hot wire (26, 28), namely, a measuring wire (26) and a compensation wire (28), are connectable to the hot wire sensor (10), for example, in the form of a hot wire module (14), in an electrically conductive manner. A first contact pair (52, 54) is associated with the measuring wire (26) for contacting same and a second contact pair (56, 58) is associated with the compensation wire (28) for contacting same. The contacts of the second contact pair (56, 58) are configured as leading contacts in relation to at least one of the contacts of the first contact pair (52, 54).

In order to provide a thermal mass flowmeter which makes higher accuracy of gas flowrate measurement possible while reliability in the thermal mass flowmeter is ensured (while deterioration or breakage caused by droplet adhesion is prevented), the thermal mass flowmeter according to the present invention has a heating element for generating heat by conduction, a temperature detection bridge circuit for detecting a temperature of the heating element, and a sensor element driving circuit portion connected to the heating element and the temperature detection bridge circuit and executing conduction control to the heating element, in which the sensor element driving circuit portion has an output mechanism and an output impedance adjustment mechanism and the output impedance adjustment mechanism is disposed between the output mechanism and the heating element and its output impedance is higher than an electric resistance value of the heating element and less than 1 M.

In order to provide a thermal mass flowmeter which makes higher accuracy of gas flowrate measurement possible while reliability in the thermal mass flowmeter is ensured (while deterioration or breakage caused by droplet adhesion is prevented), the thermal mass flowmeter according to the present invention has a heating element for generating heat by conduction, a temperature detection bridge circuit for detecting a temperature of the heating element, and a sensor element driving circuit portion connected to the heating element and the temperature detection bridge circuit and executing conduction control to the heating element, in which the sensor element driving circuit portion has an output mechanism and an output impedance adjustment mechanism and the output impedance adjustment mechanism is disposed between the output mechanism and the heating element and its output impedance is higher than an electric resistance value of the heating element and less than 1 M.

A sensor comprises a substrate having a first surface; a cap structure connected to the substrate, the cap structure configured to define a cavity between an inner surface of the cap structure and the first surface of the substrate, the cap structure configured to block infrared radiation from entering the cavity from outside the cap structure; a plurality of absorbers, each absorber in the plurality of absorbers being connected to the first surface of the substrate and arranged at a respective position within the cavity and configured to absorb infrared radiation at the respective position within the cavity; and a plurality of readout circuits, each readout circuit in the plurality of readout circuits being connected to a respective absorber in the plurality of absorbers and configured to provide a measurement signal that indicates an amount of infrared radiation absorbed by the respective absorber.

An air flow measuring device is adapted to be attached to a duct. The device includes a first housing, a second housing, and a flow sensor. The first housing defines a bypass flow passage which takes in a part of air flowing in the duct, and includes a hollow part and a recess. The bypass flow passage is formed in the hollow part. The recess is formed on an upper side of the hollow part in a vertical direction of the device, and at the recess, an outer surface of the first housing is recessed inward of the first housing. The second housing is formed through secondary formation with the first housing as a primary formed part. The first housing is held on a lower side of the second housing in the vertical direction. The flow sensor is disposed in the bypass flow passage.

Provided is a thermal flow meter that can be prevented from being eroded due to adhesion of water or like to a cut end portion of the lead exposed from the mold resin of the circuit package. A thermal flow meter 300 of the present invention is a thermal flow meter having a circuit package 400 formed by mounting a detection element 518 on leads 544 and 545 supported by a support frame 512, sealing with a mold resin, and cutting off the support frame 512, wherein cut end portions 544a and 545a of the leads 544 and 545 exposed from the mold resin of the circuit package 400 by cutting off the support frame 512 is covered by a covering portion 371.