G01J1/0477

Scene Generation Using Surface Plasmon Polaritons
20190234795 · 2019-08-01 ·

An infrared scene generator can generate a second infrared scene representative of a first infrared scene by emitting a beam of electromagnetic radiation onto a plurality of prism-coupled electrically conductive elements that modulate a portion of the beam incident thereon with surface plasmon polaritons based on parameters of the first infrared scene to yield a modulated beam that produces the second infrared scene.

PROJECTING SYSTEM, SMALL RIGHT ANGLE PRISM MIRRORS, AND METHOD FOR FABRICATING SMALL RIGHT ANGLE PRISM MIRRORS

The present invention provides a method for fabricating small right angle prism mirrors, projecting system, and small right angle prism mirrors fabricated by a semiconductor process. The method comprises: coating a reflecting layer on a top surface of a glass substrate; forming an optical glue layer on a bottom surface of the glass substrate; utilizing a mold to form a 3D shape on the optical glue layer; exposing the optical glue layer having the 3D shape to solidify the optical glue layer having the 3D shape and combine the glass substrate having the reflecting layer and the optical glue layer having the 3D shape; removing the mold to form a small prism array; and dicing the small prism array to generate a plurality of small right angle prism mirrors.

Image Sensor Module With Turning Prism

An image sensor module includes a circuit board, an image sensor, and a turning prism. The circuit board has first and second side sections each extending in a respective plane transverse to a plane of a center section to define a module interior volume. The image sensor has a bottom plane mounted on an inner face of the circuit board within the module interior volume. The turning prism has a mounting surface secured to a top plane of the image sensor. An electronic component arrangement is operatively mounted on the inner face of the circuit board between the image sensor and a circuit board rearward end. A number of wires providing power and data connections to the circuit board are operatively connected to contacts located on the circuit board in the interior volume between the electronic component arrangement and the circuit board rearward end.

REFRACTIVE INDEX MEASURING DEVICE AND REFRACTIVE INDEX MEASURING METHOD
20190094139 · 2019-03-28 · ·

Provided are a refractive index measuring device and a refractive index measuring method. A detector (2) detects an intensity of a measuring beam transmitted through the sample. A camera (200) images a color image of the measuring beam which is dispersed into multiple colors by transmitting through the sample. A scanning processing portion (101) carries out scanning by changing an angle of receiving the measuring beam transmitted through the sample or an angle of the measuring beam incident on the sample. A wavelength specifying processing portion (102) specifies, based on the detected intensity of the detector (2) varying with the scanning by the scanning processing portion (101) and color information corresponding to a position of the measuring beam incident on the detector (2) in a color image which is imaged by the camera (200), the wavelength corresponding to each peak of the detected intensity.

OPTICAL SENSING MODULE AND ELECTRONIC APPARATUS
20190078931 · 2019-03-14 ·

An optical sensing module including a lens and a sensing device is provided. The lens has an optical axis. The sensing device is disposed under the lens, wherein the sensing device is to receive an object beam passing the lens. The optical axis of the lens deviates from a geometric center of the sensing device. An optical sensing module including a prism film, a sensing device and a lens is further provided. The prism film has a plurality of prisms. The sensing device is disposed under the prism film, wherein the sensing device is to receive an object beam sequentially passing the prism film and the lens. The lens is disposed between the prism film and the sensing device.

OPTICAL PARAMETER MEASUREMENT DEVICE AND OPTICAL PARAMETER MEASUREMENT METHOD

An optical parameter measurement device and a corresponding method are provided. A light beam from a to-be-tested display panel is split by a beam-splitting assembly into at least two testing light beams. A voltage value corresponding to a first testing light beam is measured by a trans-impedance amplification circuit corresponding to a first optical sensor. Next, an integration time period is determined by a control circuit according to voltage values from the trans-impedance amplification circuit and a predetermined relational model between voltage values corresponding to the light intensities and integration time periods. A voltage value corresponding to a second testing light beam is finely measured by the integration circuit corresponding to a second optical sensor within the integration time period. Finally, the display brightness value of the to-be-tested display panel is determined by the control circuit according to a voltage value from the integration circuit within the integration time period.

LASER BEAM PROFILER UNIT AND LASER PROCESSING APPARATUS
20190061063 · 2019-02-28 ·

A laser beam profiler unit for measuring an intensity distribution of a laser beam oscillated from a laser oscillator includes a magnifying optical system for magnifying a spot diameter of the laser beam oscillated from the laser oscillator and focused by a condensing lens, a first transmission prism for attenuating the laser beam, a second transmission prism for further attenuating a laser beam reflected by the first transmission prism, an image capturing element for detecting the laser beam reflected by the second transmission prism, and an analyzer for analyzing an intensity distribution of a spot of the laser beam from data of the laser beam detected by the image capturing element.

Optical sensing module and electronic apparatus

An optical sensing module including a lens and a sensing device is provided. The lens has an optical axis. The sensing device is disposed under the lens, wherein the sensing device is to receive an object beam passing the lens. The optical axis of the lens deviates from a geometric center of the sensing device. An optical sensing module including a prism film, a sensing device and a lens is further provided. The prism film has a plurality of prisms. The sensing device is disposed under the prism film, wherein the sensing device is to receive an object beam sequentially passing the prism film and the lens. The lens is disposed between the prism film and the sensing device.

Light beam measurement device, laser apparatus, and light beam separator

A light beam measurement device includes: a polarization measurement unit including a first measurement beam splitter provided on an optical path of a laser beam and configured to measure a polarization state of the laser beam having been partially reflected by the first measurement beam splitter; a beam profile measurement unit including a second measurement beam splitter provided on the optical path of the laser beam and configured to measure a beam profile of the laser beam having been partially reflected by the second measurement beam splitter; and a laser beam-directional stability measurement unit configured to measure a stability in a traveling direction of the laser beam, while the first measurement beam splitter and the second measurement beam splitter are made of a material containing CaF.sub.2.

Array of encoders for alignment measurement

System and method for accurately measuring alignment of every exposure field on a pre-patterned wafer without reducing wafer-exposure throughput. Diffraction grating disposed in scribe-lines of such wafer, used as alignment marks, and array of encoder-heads (each of which is configured to define positional phase(s) of at least one such alignment mark) are used. Determination of trajectory of a wafer-stage scanning during the wafer-exposure in the exposure tool employs determining in-plane coordinates of such spatially-periodic alignment marks by simultaneously measuring position-dependent phases of signals produced by these marks as a result of recombination of light corresponding to different diffraction orders produced by these marks. Measurements may be performed simultaneously at all areas corresponding to at least most of the exposure fields of the wafer, and/or with use of a homodyne light source, and/or in a wavelength-independent fashion, and/or with a pre-registration process allowing for accommodation of wafers with differently-dimensioned exposure fields.