A thermal processing system for performing thermal processing can include a workpiece support plate configured to support a workpiece and heat source(s) configured to heat the workpiece. The thermal processing system can include window(s) having transparent region(s) that are transparent to electromagnetic radiation within a measurement wavelength range and opaque region(s) that are opaque to electromagnetic radiation within a portion of the measurement wavelength range. A temperature measurement system can include a plurality of infrared emitters configured to emit infrared radiation and a plurality of infrared sensors configured to measure infrared radiation within the measurement wavelength range where the transparent region(s) are at least partially within a field of view the infrared sensors. A controller can be configured to perform operations including obtaining transmittance and reflectance measurements associated with the workpiece and determining, based on the measurements, a temperature of the workpiece less than about 600° C.

The invention relates to the use of an optical waveguide for optically measuring the temperature of a high-temperature melt, the optical waveguide directing electromagnetic waves from the measuring point to an optical detector and being moved to the measuring point with the aid of a fluid through a line through which the fluid flows. The optical waveguide has a core, cladding and a coating, with the coating consisting of a protective layer and an outer protective sheath. The outer protective sheath is firmly connected to the protective layer.

A system includes a focusing system, a radiation detector, and a controller. The focusing system is configured to receive an incident radiation beam from a radiation source and focus the incident radiation beam on a portion of a component of a high temperature mechanical system. The incident radiation beam scatters from the portion of the component as a diffracted radiation beam. The focusing system is further configured to focus the diffracted radiation beam from the portion of the component on the radiation detector. The radiation detector is configured to detect a diffraction pattern of the diffracted radiation beam from the portion of the component. The controller is configured to determine a temperature of the portion of the component based on the diffraction pattern.

A cooking chamber includes thermal camera of a lower resolution and a color camera of a higher resolution. The two cameras capture images at the same time to obtain a thermal image and a color image. The thermal image is processed to correlate respective subsets of its pixels to corresponding subsets of pixels in the color image for one or more food items identified in the in accordance with established calibration rules, establishing correlations between pixels of the second image to respective sets of pixels corresponding to the one or more food items identified in the two images, where the established calibration rules associate the perspectives and resolutions of the two cameras. A temperature map is generated for the one or more food items with the second resolution in accordance with the established correlations.

Thermal monitors comprising a substrate with at least one camera position on a bottom surface thereof, a wireless communication controller and a battery. The camera has a field of view sufficient to produce an image of at least a portion of a wafer support, the image representative of the temperature within the field of view. Methods of using the thermal monitors are also described.

A measuring probe head having a housing, which defines a receiving space and at least one coolant fluid supply channel fluidically connected thereto, and at least one sensor which is received, or is capable of being received, in the receiving space, wherein at least one partial region of the housing enclosing the receiving space has a porosity which defines a plurality of coolant fluid passage openings.

Thermal monitors comprising a substrate with at least one camera position on a bottom surface thereof, a wireless communication controller and a battery. The camera has a field of view sufficient to produce an image of at least a portion of a wafer support, the image representative of the temperature within the field of view. Methods of using the thermal monitors are also described.

Embodiments described herein include integrated systems used to directly monitor a substrate temperature during a plasma enhanced deposition process and methods related thereto. In one embodiment, a substrate support assembly includes a support shaft, a substrate support disposed on the support shaft, and a substrate temperature monitoring system for measuring a temperature of a substrate to be disposed on the substrate support. The substrate temperature monitoring system includes a optical fiber tube, a light guide coupled to the optical fiber tube, and a cooling assembly disposed about a junction of the optical fiber tube and the light guide. Herein, at least a portion of the light guide is disposed in an opening extending through the support shaft and into the substrate support and the cooling assembly maintains the optical fiber tube at a temperature of less than about 100 C. during substrate processing.

A method of monitoring the surface temperatures of wafers in real time by measuring them according to the present invention monitors the surface temperatures of a polishing pad in real time by measuring them, and can thus actively deal with irregular variations in temperature on the surface of the wafer attributable to chemical reaction and friction in the process of cleaning the wafer. A sensor for measuring the surface temperatures of a wafer according to the present invention can be used in an environment in which there is fume generated from a cleaning solution, and is responsible for temperatures at respective points of an infrared camera and allows the correction of temperatures in respective sections.

An improved nozzle for use with a fire hose having an infra-red temperature sensor that is aligned with an output of the nozzle. The sensor will detect the infrared energy produced by a fire hot spot and provide a visual indication of the energy on a display. The temperature sensor operates a thermometer and is placed in the center of the discharge nozzle allowing water to pass around the sensor. A laser is positioned next to the sensor on the outlet of the nozzle to project a high intensity visible light toward the area that the IR sensor is directed.