A far infrared sensor package includes a package body and a plurality of far infrared sensor array integrated circuits. The plurality of far infrared sensor array integrated circuits are disposed on a same plane and inside the package body. Each of the far infrared sensor array integrated circuits includes a far infrared sensing element array of a same size.

There is disclosed a structure and the manufacturing method for packaging for thermopile or equivalent thermal sensing elements of single orientation, 1D arrays and 2D arrays used for thermal or equivalent media sensing. The sensing core has a primary use as a detection core, and accessory use for improved thermal stability through maximizing the flow of heat energy, through the various packaging constituents to achieve a zero thermal gradient effect. The core package comprises of a substrate, a heat spreader for the thermal sensor, an external housing material manufactured from a wafer fabrication process, and an optics of a silicon wafer and other optical components that is attached to the external housing enclosure using wafer level processing. The external housing enclosure can be scaled to a layered architecture into distinct layers that are stacked vertically on top of each other to make for a multi-lens package.

A device for detecting electromagnetic radiation, including a substrate; at least one thermal detector, placed on the substrate, including an absorbing membrane suspended above the substrate; and an encapsulating structure encapsulating the thermal detector, including an encapsulating layer extending around and above the thermal detector so as to define with the substrate a cavity in which the thermal detector is located; wherein the encapsulating layer includes at least one through-orifice that is what is referred to as an exhaust vent, each exhaust vent being placed so that at least one thermal detector has a single exhaust vent located facing the corresponding absorbing membrane, preferably plumb with the center of said absorbing membrane.

A sensor package having a thermopile sensor and a reference thermopile sensor disposed therein. In one or more implementations, the sensor package includes a substrate, a thermopile sensor disposed over the substrate, a reference thermopile sensor disposed over the substrate, and a lid assembly disposed over the thermopile sensor and the reference thermopile sensor. The lid assembly includes a transparent structure that passes electromagnetic radiation occurring in a limited spectrum of wavelengths and an electromagnetic blocker disposed over the lid assembly. The electromagnetic blocker defines an aperture over the thermopile sensor such that at least a portion of the electromagnetic blocker is positioned over the reference thermopile sensor. The electromagnetic blocker is configured to at least substantially block the electromagnetic radiation occurring in a limited spectrum of wavelengths from reaching the reference thermopile sensor.

Embodiments disclosed herein generally relate to a substrate temperature monitoring system in a substrate support assembly. In one embodiment, the substrate support assembly includes a support plate and a substrate temperature monitoring system. The support plate has a top surface configured to support a substrate. The substrate temperature monitoring system is disposed in the substrate support plate. The substrate temperature monitoring system is configured to measure a temperature of the substrate from a bottom surface of the substrate. The substrate temperature monitoring system includes a window, a body, and a temperature sensor. The window is integrally formed in a top surface of the support plate. The body is embedded in the support plate, through the bottom surface. The body defines an interior passage. The temperature sensor is disposed in the interior passage beneath the window. The temperature sensor is configured to measure the temperature of the substrate.

An infrared sensor includes a first semiconductor substrate, a second semiconductor substrate, a sealing frame, and a first connection. The first semiconductor substrate includes a first main surface and an infrared detection element. The second semiconductor substrate includes a second main surface and a signal processing circuit. The sealing frame surrounds an internal space with the first main surface, the infrared detection element, and the second main surface. The first connection electrically connects the infrared detection element and the signal processing circuit. The internal space is hermetically sealed by the first main surface, the infrared detection element, the second main surface, and the sealing frame. Each of the sealing frame and the first connection is sandwiched between the first main surface and the second main surface.

A device for detecting electromagnetic radiation is provided, including a substrate; at least one thermal detector placed on the substrate; and an encapsulating structure encapsulating the detector, including a thin encapsulating layer of a material that is transparent to said radiation, extending around and above the detector so as to define with the substrate a cavity in which the detector is located; wherein the thin encapsulating layer comprises a peripheral wall that encircles the detector, and that has a cross section, in a plane parallel to the plane of the substrate, of square or rectangular shape, corners of which are rounded.

A getter assembly is provided and includes a first canister, an internal can including getter, and a second canister. The internal can is disposable in the first canister to occupy a first position at which the getter is hermetically sealable and second positions at which the getter is exposed to an exterior environment. The second canister is engageable with the first canister to drive movements of the internal can between the first position and the second positions following activation and hermetic sealing of the getter.

A method makes an electromagnetic radiation detecting device including at least one thermal detector with an absorbent membrane suspended above a substrate, intended to be located in a sealed cavity. The method includes depositing, on the substrate, a gettering metallic layer including a metallic material with a gettering effect; depositing a carbonaceous sacrificial layer of amorphous carbon on the gettering metallic layer; depositing at least one sacrificial mineral layer on the carbonaceous sacrificial layer; chemical-mechanical planarization of the sacrificial mineral layer; fabricating the thermal detector so that the absorbent membrane is produced on the sacrificial mineral layer; removing the sacrificial mineral layer; and removing the carbonaceous sacrificial layer.

The application relates to a sensing device and a lighting device. The sensing device comprises a sensor provided with a glass window to transmit light and is configured to sense light incident upon the sensor; a circuit board, wherein one side of the circuit board is provided with the sensor; a Fresnel lens arranged above the sensor and configured to transmit light to the sensor; and a housing made from a flame-resistant material, wherein the housing comprises an accommodation space configured to accommodate the sensor and the circuit board, and the housing is provided with a center hole to expose the glass window. By adopting the technical solution, the sensor has flame-resistant performance.