Various embodiments disclosed herein describe a divided-aperture infrared spectral imaging (DAISI) system that is adapted to acquire multiple IR images of a scene with a single-shot (also referred to as a snapshot). The plurality of acquired images having different wavelength compositions that are obtained generally simultaneously. The system includes at least two optical channels that are spatially and spectrally different from one another. Each of the at least two optical channels are configured to transfer IR radiation incident on the optical system towards an optical FPA unit comprising at least two detector arrays disposed in the focal plane of two corresponding focusing lenses. The system further comprises at least one temperature reference source or surface that is used to dynamically calibrate the two detector arrays and compensate for a temperature difference between the two detector arrays.

An apparatus detects a transient thermal gradient in a substrate. The apparatus is comprised of an electromagnetic radiation source configured to emit source electromagnetic radiation; a fast shutter configured to block the source electromagnetic radiation when closed, and open in response to a command to pulse the source electromagnetic radiation; a substrate support that supports a substrate disposed to emit a pulsed radiation from a back side of the substrate when the source electromagnetic radiation is pulsed through the substrate; and a detector configured to face the back side of the substrate. The detector is used to detect a transient thermal gradient in the pulsed radiation.

Various embodiments disclosed herein describe a divided-aperture infrared spectral imaging (DAISI) system that is adapted to acquire multiple IR images of a scene with a single-shot (also referred to as a snapshot). The plurality of acquired images having different wavelength compositions that are obtained generally simultaneously. The system includes at least two optical channels that are spatially and spectrally different from one another. Each of the at least two optical channels are configured to transfer IR radiation incident on the optical system towards an optical FPA unit comprising at least two detector arrays. One of the at least two detector arrays comprises a cooled mid-wavelength infra-red FPA. The system further comprises at least one temperature reference source or surface that is used to dynamically calibrate the two detector arrays and compensate for a temperature difference between the two detector arrays.

Techniques for facilitating wide field of view (FOV) imaging systems and methods are provided. In one example, an imaging device includes a lens system including a first lens group and a second lens group. The first lens group includes at least one spherical lens element and is associated with a first FOV. The first lens group is configured to transmit electromagnetic radiation associated with a scene. The second lens group includes wafer level optics aspherical lens elements and is associated with a second FOV narrower than the first FOV. The second lens group is configured to transmit the electromagnetic radiation received from the first lens group. The imaging device further includes a detector array including detectors. Each detector is configured to receive a portion of the electromagnetic radiation from the lens system and generate a thermal image based on the electromagnetic radiation. Related methods and systems are also provided.

Various embodiments disclosed herein describe a divided-aperture infrared spectral imaging (DAISI) system that is adapted to acquire multiple IR images of a scene with a single-shot (also referred to as a snapshot). The plurality of acquired images having different wavelength compositions that are obtained generally simultaneously. The system includes at least two optical channels that are spatially and spectrally different from one another. Each of the at least two optical channels are configured to transfer IR radiation incident on the optical system towards an optical FPA unit comprising at least two detector arrays. One of the at least two detector arrays comprises a cooled mid-wavelength infra-red FPA. The system further comprises at least one temperature reference source or surface that is used to dynamically calibrate the two detector arrays and compensate for a temperature difference between the two detector arrays.

Various embodiments disclosed herein describe a divided-aperture infrared spectral imaging (DAISI) system that is adapted to acquire multiple IR images of a scene with a single-shot (also referred to as a snapshot). The plurality of acquired images having different wavelength compositions that are obtained generally simultaneously. The system includes at least two optical channels that are spatially and spectrally different from one another. Each of the at least two optical channels are configured to transfer IR radiation incident on the optical system towards an optical FPA unit comprising at least two detector arrays. One of the at least two detector arrays comprises a cooled mid-wavelength infra-red FPA. The system further comprises at least one temperature reference source or surface that is used to dynamically calibrate the two detector arrays and compensate for a temperature difference between the two detector arrays.

A household microwave appliance includes a cooking compartment, a cooking compartment wall surrounding the cooking compartment and including a cooking compartment opening, and a microwave dome arranged remote from the cooking compartment and designed to cover the cooking compartment opening. The microwave dome includes a first sensor opening and a second sensor opening, with a first sensor arranged behind the first sensor opening and oriented directly into the cooking compartment, and with a second sensor arranged behind the second sensor opening and oriented indirectly into the cooking compartment via a reflecting surface of the microwave dome.

A household microwave appliance includes a cooking compartment, a cooking compartment wall surrounding the cooking compartment and including a cooking compartment opening, and a microwave dome arranged remote from the cooking compartment and designed to cover the cooking compartment opening. The microwave dome includes a first sensor opening and a second sensor opening, with a first sensor arranged behind the first sensor opening and oriented directly into the cooking compartment, and with a second sensor arranged behind the second sensor opening and oriented indirectly into the cooking compartment via a reflecting surface of the microwave dome.

A depth thermal imaging module, including a thermal imager array, which includes a plurality of at least two thermal imagers that capture thermal radiation of a wavelength of a scene from different viewpoints. Each thermal imager includes a thermal imager chip, a lens stack, and a focal plane with focal length f. The thermal imagers are separated by a baseline distance of 2h and depth measurement Z is performed on an object of interest based on Z=2hf/Δ where Δ is the difference in location of the object of interest between its location in the thermal image captured by a first thermal imager and the location of the object of interest in the thermal image captured by a second thermal imager and represents as an offset of the point on the focal plane of the first thermal imager and the second thermal imagers relative to their optical axis.

A passive infrared (PIR) sensor system, includes a PIR sensor configured to produce an output signal in response to receiving infrared (IR) radiation, an electronic shutter positionable in a field of view (FOV) of the PIR sensor, wherein the electronic shutter includes a liquid crystal (LC) material, wherein the electronic shutter includes a first state providing a first transmissivity of IR radiation through the electronic shutter and a second state providing a second transmissivity of IR radiation through the electronic shutter that is less than the first transmissivity, and a shutter actuator configured to apply an actuation signal to the electronic shutter to actuate the electronic shutter between the first state and the second state.