Patent classifications
G01J5/0821
OPTICALLY POWERED CRYOGENIC FOCAL PLANE ARRAY (FPA) WITH AN OPTICAL DATA LINK
An optically powered cryogenic FPA with an optical data link eliminates electrical penetrations of the cryogenic chamber for power delivery thereby reducing heat leaks into the cold volume by copper wires and EMI. An optical splitter receives and separates an optical input signal into an optical carrier signal, an optical Data IN signal and an optical power signal. An optical-to-electrical (0/E) converter converts the optical power signal into an electrical power signal, which is converted into a plurality of DC voltage signals to supply power within the chamber. An optical data link modulates the optical carrier signal with electrical signals from the ROIC to form and output an optical Data OUT signal.
APPARATUS, SYSTEMS, AND METHODS OF MEASURING EDGE RING DISTANCE FOR THERMAL PROCESSING CHAMBERS
Aspects of the present disclosure relate to apparatus, systems, and methods of measuring edge ring distance for thermal processing chambers. In one example, the distance measured is used to determine a center position shift of the edge ring.
HIGH TEMPERATURE NEAR-FIELD PROBE FOR SENSING AND ENERGY HARVESTING APPLICATIONS BASED UPON THERMAL EMISSION
A near-field probe (and associated method) compatible with near-infrared electromagnetic radiation and high temperature applications above 300° C. (or 500° C. in some applications) includes an optical waveguide and a photonic thermal emitting structure comprising a near-field thermally emissive material coupled to or part of the optical waveguide. The photonic thermal emitting structure is structured and configured to emit near-field energy responsive to at least one environmental parameter of interest, and the near-field probe is structured and configured to enable extraction of the near-field energy to a far-field by coupling the near-field energy into one or more guided modes of the optical waveguide.
Thermal imaging with an integrated photonics chip
An integrated photonics chip for thermal imaging comprises a photonics substrate including a plurality of receiver elements. Each receiver element comprises a first grating coupler optically coupled to a first waveguide filter and configured to receive a first wavelength of light at a given angle, with the first waveguide filter configured to pass the first wavelength of light; and a second grating coupler optically coupled to a second waveguide filter and configured to receive a second wavelength of light at the given angle, with second waveguide filter configured to pass the second wavelength of light. Each receiver element receives the wavelengths of light from an object of interest that emits the light due to blackbody radiation, and receives the wavelengths of light at respectively different angles. Each grating coupler receives a unique wavelength of light with respect to the other wavelengths of light received by the other grating couplers.
Optical fiber temperature sensor
An optical fiber temperature sensor includes a broadband light source, a first optical fiber patch cord, a first single-mode optical fiber, a single-hole twin-core eccentric core optical fiber, a second single-mode optical fiber, a second optical fiber patch cord, and an optical spectrum analyzer.
Systems, devices, and apparatus for monitoring temperature at remote locations using infrared light
A remote monitoring system can include a plurality of infrared cables, where each of the infrared cables can have a respective first opening at a first end of the cable and a respective second opening at a second end of the infrared cable that is opposite the first end. The infrared cables can be configured to conduct infrared light emitted from a respective one of a plurality of monitored locations into the respective first opening to exit at the respective second opening. An infrared camera including an infrared sensor array can be optically coupled to each of the second openings of the plurality of infrared cables.
Polaritonic fiber probe and method for nanoscale measurements
The invention offers high resolution and accuracy for nanoscale device characterization from ultraviolet through microwave wavelengths. Instead of collecting light after emission in near-field that decays to far-field, the present invention directly couples the near-field waves to a polaritonic-coated probe. The polaritonic coating can be formed on an wavelength tuned optical fiber to receive the coupled emission and form polaritons, including plasmons, phonons, and magnons, using the polaritonic material. The polaritons propagate along the probe decay back into the fiber core without substantial losses to far-field and are transmitted to a detector, such as a spectroscope. The coupling of the near-field energy to emission detected through the tip apex of fiber can be expressed as emission spectra. Through mapping with other spatial points, multi-dimensional displays and other information can be provided. The resolution can be less than 100 nanometers, including an order of magnitude less than 100 nanometers.
Polaritonic fiber probe and method for nanoscale measurements
The invention offers high resolution and accuracy for nanoscale device characterization from ultraviolet through microwave wavelengths. Instead of collecting light after emission in near-field that decays to far-field, the present invention directly couples the near-field waves to a polaritonic-coated probe. The polaritonic coating can be formed on an wavelength tuned optical fiber to receive the coupled emission and form polaritons, including plasmons, phonons, and magnons, using the polaritonic material. The polaritons propagate along the probe decay back into the fiber core without substantial losses to far-field and are transmitted to a detector, such as a spectroscope. The coupling of the near-field energy to emission detected through the tip apex of fiber can be expressed as emission spectra. Through mapping with other spatial points, multi-dimensional displays and other information can be provided. The resolution can be less than 100 nanometers, including an order of magnitude less than 100 nanometers.
Temperature measurement sensor, temperature measurement system, and temperature measurement method
A temperature measurement sensor according to an exemplary embodiment includes a substrate and an optical fiber provided on an upper surface of the substrate and extending along the upper surface. The temperature measurement sensor further includes a light introduction path of a space that allows a space above the upper surface and a space below a lower surface of the substrate to communicate with each other and an optical coupling portion provided on the upper surface and disposed in the light introduction path. The optical coupling portion is optically connected to the end surface of the optical fiber. The optical fiber forms the first pattern shape and the second pattern shape. The first pattern shape includes the optical fiber more densely than the second pattern shape. Light incident on the optical coupling portion from a side of the lower surface through the light introduction path reaches the end surface through the optical coupling portion.
Temperature measurement sensor, temperature measurement system, and temperature measurement method
A temperature measurement sensor according to an exemplary embodiment includes a substrate and an optical fiber provided on an upper surface of the substrate and extending along the upper surface. The temperature measurement sensor further includes a light introduction path of a space that allows a space above the upper surface and a space below a lower surface of the substrate to communicate with each other and an optical coupling portion provided on the upper surface and disposed in the light introduction path. The optical coupling portion is optically connected to the end surface of the optical fiber. The optical fiber forms the first pattern shape and the second pattern shape. The first pattern shape includes the optical fiber more densely than the second pattern shape. Light incident on the optical coupling portion from a side of the lower surface through the light introduction path reaches the end surface through the optical coupling portion.