The present invention discloses a thermal pile sensing structure integrated with one or more capacitors, which includes: a substrate, an infrared sensing unit and a partition structure. The infrared sensing unit includes a first and a second sensing structure. A hot junction is formed between the first and the second sensing structures at a location where the first and the second sensing structures are close to each other. A cold junction is formed between the partition structure and the first sensing structure at a location where these two structures are close to each other. Another cold junction is formed between the partition structure and the second sensing structure at a location where these two structures are close to each other. A temperature difference between the hot junction and the cold junction generates a voltage difference signal. Apart of the partition structure forms at least one capacitor.

A device for measuring body core temperature includes a light guide. The light guide is coupled to an earpiece. A first sensor is positioned at a first end of the light guide, and a second sensor is positioned at a second end of the light guide. A processor is coupled to the first sensor and the second sensor. The first sensor senses infrared radiation from an infrared source at the second end of the light guide, and the second sensor measures a temperature of the light guide at the second end of the light guide. The processor determines a temperature of the infrared source at the second end of the light guide by compensating for infrared radiation due to a thermal gradient of the light guide via a regression analysis across a range of ambient temperatures of the light guide.

A temperature detector is provided that is particularly suited towards the differential measurement of foot temperatures in diabetics. A radiation sensor views a surface area of the body and provides a radiation sensor output. Electronics coupled to the radiation sensor and an ambient temperature sensor compute a normalized surface temperature of the area normalized to a specified ambient temperature as a function of a sensed ambient temperature and a sensed radiation.

An infrared detector includes a detecting element, a first electrode, a second electrode, and a covering structure. The detecting element defines an absorbing part and a non-absorbing part. The detecting element includes a first end and a second end opposite with the first end. The first end is disposed in the absorbing part. The second end is disposed in the non-absorbing part. The first electrode is electrically connected with the first end. The second electrode is electrically connected with the second end. The covering structure covers the non-absorbing part. The detecting element further includes a carbon nanotube layer. The carbon nanotube layer includes a plurality of carbon nanotubes disposed uniformly.

An infrared detector includes a detecting element, a first electrode, a second electrode, and a covering structure. The detecting element defines an absorbing part and a non-absorbing part. The detecting element includes a first end and a second end opposite with the first end. The first end is disposed in the absorbing part. The second end is disposed in the non-absorbing part. The first electrode is electrically connected with the first end. The second electrode is electrically connected with the second end. The covering structure covers the non-absorbing part. The detecting element further includes a carbon nanotube layer. The carbon nanotube layer includes a plurality of carbon nanotubes disposed uniformly.

An infrared thermal sensor for sensing infrared radiation is disclosed. The infrared thermal sensor comprises a substrate and a cap structure together forming a sealed cavity, a membrane arranged in said cavity for receiving infrared radiation (IR) through a window or aperture and a plurality of beams for suspending the membrane. At least one beam has a thermocouple arranged therein or thereon for measuring a temperature difference (T) between the membrane and the substrate, the plurality of beams. Furthermore at least one beam is mechanically supporting the membrane without a thermocouple being present therein or thereon.

The present invention provides apparatuses comprising a plurality of junctions providing a Seebeck effect, configured as alternating hot and cold junctions. The apparatus can be configured such that the cold junctions exhibit a different thermal behavior than the hot junctions in response to incident radiation. The junctions can be connected in series, such that the sum of the Seebeck effect from the plurality of junctions provides a sensitive, inherently calibrated indication of heating of the apparatus responsive to incident radiation, and therefore of the radiation itself.

The present invention provides apparatuses comprising a plurality of junctions providing a Seebeck effect, configured as alternating hot and cold junctions. The apparatus can be configured such that the cold junctions exhibit a different thermal behavior than the hot junctions in response to incident radiation. The junctions can be connected in series, such that the sum of the Seebeck effect from the plurality of junctions provides a sensitive, inherently calibrated indication of heating of the apparatus responsive to incident radiation, and therefore of the radiation itself.

An infrared sensor includes: a package body; an infrared sensor chip mounted on a front surface of the package body; an outside cap made of metal, having a function of transmitting infrared light as a detection target for the infrared sensor chip, and attached to the package body such that the outside cap is in front of, and covers, the infrared sensor chip; an inside cap made of metal, having a function of transmitting the infrared light as the detection target for the infrared sensor chip, and disposed between the package body and the outside cap such that the inside cap is in front of, and covers the infrared sensor chip; and a ground terminal to be connected to external ground. The outside cap is electrically insulated from the inside cap and the infrared sensor chip. The inside cap is electrically connected to the ground terminal.

An infrared sensor includes: a package body; an infrared sensor chip mounted on a front surface of the package body; an outside cap made of metal, having a function of transmitting infrared light as a detection target for the infrared sensor chip, and attached to the package body such that the outside cap is in front of, and covers, the infrared sensor chip; an inside cap made of metal, having a function of transmitting the infrared light as the detection target for the infrared sensor chip, and disposed between the package body and the outside cap such that the inside cap is in front of, and covers the infrared sensor chip; and a ground terminal to be connected to external ground. The outside cap is electrically insulated from the inside cap and the infrared sensor chip. The inside cap is electrically connected to the ground terminal.