A light detector includes: a substrate; and a membrane which is supported on a surface of the substrate so that a space is formed between the surface of the substrate and the membrane, in which the membrane includes a first wiring layer and a second wiring layer which are opposite each other with a gap extending along a line having a curved portion interposed therebetween and a resistance layer which is electrically connected to each of the first wiring layer and the second wiring layer and has an electric resistance depending on a temperature, and in which a first edge portion at the side of the line in the first wiring layer and a second edge portion at the side of the line in the second wiring layer respectively continuously extend.

The present invention aims at providing a high-accuracy contactless measurement method for measuring the temperature of a metal thermoforming mold, which is capable of timely monitoring the metal temperature in multiple areas and also has threshold warning functionalities for delivering real-time notifications, in order to save the labor costs for long-term monitoring.

The present invention aims at providing a high-accuracy contactless measurement method for measuring the temperature of a metal thermoforming mold, which is capable of timely monitoring the metal temperature in multiple areas and also has threshold warning functionalities for delivering real-time notifications, in order to save the labor costs for long-term monitoring.

An example objective of the present invention is to provide a bolometer capable of reducing its manufacturing cost. A bolometer according to an example aspect of the present invention includes: a substrate; a heat insulating layer formed on the substrate; and a bolometer film formed on the heat insulating layer; wherein the bolometer film is a carbon nanotube film including semiconducting carbon nanotubes in an amount of 67% by mass or more of the total amount of carbon nanotubes, and the thickness of the carbon nanotube film is in the range of 10 nm to 1 μm, and the density of the carbon nanotube film is 0.3 g/cm.sup.3 or more.

An example objective of the present invention is to provide a bolometer capable of reducing its manufacturing cost. A bolometer according to an example aspect of the present invention includes: a substrate; a heat insulating layer formed on the substrate; and a bolometer film formed on the heat insulating layer; wherein the bolometer film is a carbon nanotube film including semiconducting carbon nanotubes in an amount of 67% by mass or more of the total amount of carbon nanotubes, and the thickness of the carbon nanotube film is in the range of 10 nm to 1 μm, and the density of the carbon nanotube film is 0.3 g/cm.sup.3 or more.

Microbolometer systems and methods are provided herein. For example, an infrared imaging device includes a microbolometer array. The microbolometer array includes a plurality of microbolometers. Each microbolometer includes a microbolometer bridge that includes a first portion and a second portion. The first portion includes a resistive layer configured to capture infrared radiation. The second portion includes a second portion having a plurality of perforations defined therein.

Microbolometer systems and methods are provided herein. For example, an infrared imaging device includes a microbolometer array. The microbolometer array includes a plurality of microbolometers. Each microbolometer includes a microbolometer bridge that includes a first portion and a second portion. The first portion includes a resistive layer configured to capture infrared radiation. The second portion includes a second portion having a plurality of perforations defined therein.

An ambient temperature calibration process includes, in accordance with an embodiment, determining an ambient temperature calibration value for a global external resistance associated with a read out integrated circuit (ROIC) of an image capture component comprising a sensor array comprising a focal plane array of microbolometers arranged on the ROIC; determining an ambient temperature calibration value for a sensor integration time associated with the ROIC; and determining an ambient temperature calibration mapping for an offset mapping associated with the ROIC.

An ambient temperature calibration process includes, in accordance with an embodiment, determining an ambient temperature calibration value for a global external resistance associated with a read out integrated circuit (ROIC) of an image capture component comprising a sensor array comprising a focal plane array of microbolometers arranged on the ROIC; determining an ambient temperature calibration value for a sensor integration time associated with the ROIC; and determining an ambient temperature calibration mapping for an offset mapping associated with the ROIC.

Provided is a thermal infrared detector including a thermal infrared sensor array including a plurality of resistive infrared devices that are provided in a plurality of rows and a plurality of columns, and a driving circuit configured to drive the thermal infrared sensor array, wherein at least two resistive infrared devices among the plurality of resistive infrared devices adjacent to each other in a row direction or a column direction are grouped together, wherein at least one resistive infrared device among the plurality of resistive infrared devices is shared by at least two groups, and wherein at least two resistive infrared devices among the plurality of resistive infrared devices that are included in each of the at least two groups are connected in series.