Methods for temperature drift compensation of a temperature measurement device using a thermocouple are presented. In one embodiment, the temperature drift may be compensated for through reference junction compensation alone using a thermistor for reference junction compensation without providing a separate temperature measurement element. Thereby, precision of a measured temperature may not change despite change in temperature of the surroundings measured by the temperature measurement device, and the manufacturing cost may be effectively reduced.

Methods for temperature drift compensation of a temperature measurement device using a thermocouple are presented. In one embodiment, the temperature drift may be compensated for through reference junction compensation alone using a thermistor for reference junction compensation without providing a separate temperature measurement element. Thereby, precision of a measured temperature may not change despite change in temperature of the surroundings measured by the temperature measurement device, and the manufacturing cost may be effectively reduced.

A thermocouple temperature sensor has a thermocouple with first and second conductors connected at a junction and a resistance temperature device with first and second conductors. The first conductor of the resistance temperature device is connected to the first conductor of the thermocouple. A first external conductor is connected to the second conductor of the thermocouple, wherein the first external conductor is configured as a voltage sense conductor for the resistance temperature device and a voltage sense conductor for the thermocouple. A second external conductor is connected to the first conductors of the thermocouple and the resistance temperature device, wherein the second external conductor is configured as a current conductor for the resistance temperature device and a voltage sense conductor for the thermocouple. A third external conductor is connected to the second conductor of the resistance temperature device and is configured as a current conductor for the resistance temperature device.

A measuring apparatus for determining a measurement temperature at a measuring point by means of a first thermocouple. The measuring apparatus includes a first connection terminal and a second connection terminal for connecting the first thermocouple, a first connecting line and a second connecting line, which connect the first and second connection terminals with an evaluating electronics, an auxiliary temperature sensor, which is designed to register an auxiliary temperature, and the evaluating electronics, which is designed to determine the measurement temperature at the measuring point. An additional connecting line, which is composed of a material other than that of the second connecting line forms together with the second connecting line a second thermocouple, which is likewise connected to the evaluating electronics. The evaluating electronics is designed to determine the measurement temperature at the measuring point based on a first measurement voltage delivered by the first thermocouple, the second measurement voltage delivered by the second thermocouple and the auxiliary temperature registered by the auxiliary temperature sensor.

A measuring apparatus for determining a measurement temperature at a measuring point by means of a first thermocouple. The measuring apparatus includes a first connection terminal and a second connection terminal for connecting the first thermocouple, a first connecting line and a second connecting line, which connect the first and second connection terminals with an evaluating electronics, an auxiliary temperature sensor, which is designed to register an auxiliary temperature, and the evaluating electronics, which is designed to determine the measurement temperature at the measuring point. An additional connecting line, which is composed of a material other than that of the second connecting line forms together with the second connecting line a second thermocouple, which is likewise connected to the evaluating electronics. The evaluating electronics is designed to determine the measurement temperature at the measuring point based on a first measurement voltage delivered by the first thermocouple, the second measurement voltage delivered by the second thermocouple and the auxiliary temperature registered by the auxiliary temperature sensor.

Input terminal of a thermocouple (TC) instrument. The input terminal may include a printed circuit board (PCB), including an input portion configured to receive signals from a thermocouple, and an output portion configured to communicatively connect to the instrument. The input terminal may further include a sensor mounted on the PCB, configured to measure temperature at or near a cold junction of the input terminal. The PCB may include first traces connecting the input portion of the PCB to the output portion of the PCB, and configured to send TC signals to the TC instrument and second traces connecting the sensor to the output portion of the PCB, and configured to send temperature signals to the instrument. The traces may be configured to provide the TC signals and the temperature signals to the TC instrument without using metal pins.

Input terminal of a thermocouple (TC) instrument. The input terminal may include a printed circuit board (PCB), including an input portion configured to receive signals from a thermocouple, and an output portion configured to communicatively connect to the instrument. The input terminal may further include a sensor mounted on the PCB, configured to measure temperature at or near a cold junction of the input terminal. The PCB may include first traces connecting the input portion of the PCB to the output portion of the PCB, and configured to send TC signals to the TC instrument and second traces connecting the sensor to the output portion of the PCB, and configured to send temperature signals to the instrument. The traces may be configured to provide the TC signals and the temperature signals to the TC instrument without using metal pins.

A method and system for calculating a cold junction temperature comprises an offline phase comprising: determining an applicable algorithm for calculating a cold junction screw temperature, and deploying the applicable algorithm in firmware; and an online phase comprising: providing at least one measured temperature to the applicable algorithm deployed in firmware, calculating a temperature of a cold junction screw according to the applicable algorithm deployed in firmware, and assigning the calculated temperature of the cold junction screw as a cold junction temperature.

A method and system for calculating a cold junction temperature comprises an offline phase comprising: determining an applicable algorithm for calculating a cold junction screw temperature, and deploying the applicable algorithm in firmware; and an online phase comprising: providing at least one measured temperature to the applicable algorithm deployed in firmware, calculating a temperature of a cold junction screw according to the applicable algorithm deployed in firmware, and assigning the calculated temperature of the cold junction screw as a cold junction temperature.

The present invention relates to measuring temperature (t) using a thermocouple (30), with a first measurement point (33) along a positive conductor (31), and a second measurement point (34) along a negative conductor (32). The arrangement is configured to obtain a Seebeck coefficient(S) for the material pair; and to measure a first temperature (t.sub.1) in the cold end of the thermocouple (30) at a first measurement point (33); and to measure a second temperature (t.sub.2) at a second measurement point (34). Thermal voltages (U.sub.1, U.sub.2) are measured. The arrangement further calculates a weighted average of the temperature (T.sub.ave) by dividing a temperature difference of the first (t.sub.1) and second (t.sub.2) temperatures with a ratio N=U.sub.1/U.sub.2; and calculates temperature (t) in the hot end of the thermocouple (30) based on the obtained Seebeck coefficient(S) for the material pair and the calculated weighted average of the temperature (T.sub.ave).