A MEMS pressure sensor includes a resistive sensing bridge with a first sensing resistor and a second sensing resistor, each having variable resistance values in response to change in a sensed physical variable. An oscillator generates an oscillation signal with a frequency or period that is a function of an oscillator control signal. A sensor reference module generates the oscillator control signal as a function of the resistance value of a resistor coupled therewith. This sensor reference module is couplable with the first sensing resistor or second sensing resistor. A processing circuit coupled to the oscillator provides a sensor signal indicative of the frequency or period of the oscillation signal. The sensor signal has first and second values with the sensor reference module coupled with the first sensing resistor and with the second sensing resistor, respectively, the first and second values being thus jointly indicative of the physical variable sensed.

A pressure sensor and an electronic device are disclosed. The pressure sensor includes a flexible printed circuit board (110) and multiple pressure sensitive adhesive resistors. The multiple pressure sensitive adhesive resistors include pressure sensitive adhesive resistors R1, R2, R3, R4, R5, and R6. The flexible printed circuit board (110) includes a first surface (A) and a second surface (B) that are opposite each other. The pressure sensitive adhesive resistors R1, R3, and R5 are disposed on the first surface (A), and the pressure sensitive adhesive resistors R2, R4, and R6 are disposed on the second surface (B). The flexible printed circuit board (110) is provided with a through hole (C) that allows the first surface (A) to communicate with the second surface (B), and the through hole (C) is at least partially covered by the pressure sensitive adhesive resistors R1, R2, R3, and R4.

A thin-film pressure sensor and an arrangement method thereof are provided. The thin-film pressure sensor includes a flat diaphragm and a first induction unit in the shape of a thin film arranged on the flat diaphragm, where the first induction unit includes m rotating multi-segment resistance wires arranged around the center of a circle of a circular deformation area of the flat diaphragm, m/2 rotating multi-segment resistance wires on one side are connected in series to form a second induction resistor, and m/2 rotating multi-segment resistance wires on the other side are connected in series to form a fourth induction resistor, where m is a multiple of 4; the arrangement method includes arrangement for the first induction unit. The radial strain and the tangential strain of the flat diaphragm can be fully utilized, and the detection sensitivity of the thin-film pressure sensor is improved.

A load detection apparatus includes a load input portion having a input surface, and an output surface; a flexure element including on annular portion including a contacting portion configured to make contact with at least a part of the output surface, and a support portion; a set of sensors disposed on a reverse surface opposite to a surface provided with the contacting portion in the annular portion, each of the set of sensors being configured to detect distortion corresponding to an input load; a set of calculation portions configured to calculate a set of magnitudes of the load by use of respective detection results obtained by the set of sensors; and an abnormality determination portion configured to determine whether the set of sensors and the set of calculation portions have no abnormality, by comparing the set of magnitudes of the load with each other.

In some examples, a method of operating a circuit may comprise performing a circuit function under normal conditions, performing the circuit function under aggravated conditions, predicting a potential future problem with the circuit function under the normal conditions based on an output of the circuit function under the aggravated conditions, and outputting a predictive alert based on predicting the potential future problem.

The present invention achieves a force sensor in which an electrode, element, and/or the like connected to a strain gauge can be suitably attached to a strain element. The force sensor includes: a strain element including an arm portion that is deformable under an external force; and a strain gauge attached to the arm portion. The strain element includes a projection that sticks out from the arm portion in a direction intersecting the longitudinal direction of the arm portion.

The pressure sensing device includes a substrate and a pressure sensor. The pressure sensor used is a thin-film piezoresistive sensor with a certain area, and a power wire, a ground wire, and two differential wires are led out from ends of the pressure sensor respectively, and the pressure sensor is arranged on the substrate. The substrate is simply attached to the object being tested that is to be subjected to pressure, the pressure sensor is connected to a pressure sensing detection circuit, the object being tested deforms under pressure, and the thin-film piezoresistive sensor deforms as the substrate deforms. The deformation of the substrate is detected through detecting the voltage drop between the two differential wires, which is converted to obtain the pressure on the object being tested, thereby realizing a pressure-sensitive touch function. A pressure sensing method and an electronic terminal with the pressure sensing device are also provided.

A load sensor is provided with a seat mounting hole between both end parts of a rectangular plate-like main body portion of a load receiving member. A plurality of strain detecting elements the resistance value of each of which changes depending on the amount of strain of the main body portion are disposed around the seat mounting hole. In plan view of the load receiving member, the center point of the seat mounting hole is offset from the center point of the arrangement of the plurality of strain detecting elements toward a part of the load receiving member that has relatively high rigidity.

The invention discloses an attached resistance strain sensor assembly includes a sensor body, wherein substrates are respectively mounted at two ends of a lower end face of the sensor body, a heat insulation layer is provided between two of the substrates, the heat insulation layer covers the lower end face of the sensor body, an outer cover is covered above the sensor body, two ends of the outer cover are respectively mounted on the two substrates, and a wiring terminal is provided at one side of the outer cover. The sensor assembly can be mounted to a structural member by electric welding, so that the influence of high temperature on the performance of an elastic part in the sensor body during welding is reduced, the output value of the sensor is still in an expected range, and a more accurate load measurement value can be obtained.

The present invention is a pressure sensor (1) which includes a sensor main body (2) having a cavity, a cantilever (3) having a lever main body (20) and a lever support portion (21A, 21B) and which is bent according to a pressure difference between the cavity and the outside of the sensor main body (2), and a displacement detection unit (4) which detects displacement of the cantilever (3) based on resistance variation in resistance values of the main body-resistance portion (31) formed in the lever main body (20) and a lever-resistance portion (32) formed in the lever support portion (21A, 21B). A division groove (40) is formed in the lever support (21A), and the division groove (40) divides the lever-resistance portion (32) into a first resistance portion (32a) which is electrically connected to a detection electrode (35) in series and a second resistance portion (32b) which is positioned so as to be closer to the other adjacent lever support portion (21B) than the first resistance portion (32a). The first resistance portion (32a) of the lever support portion (21A, 21B) is electrically connected to the detection electrode (35) via a parallel path of a first path (S1) passing through the main body-resistance portion (31) and a second path (S2) passing through the second resistance portion (32b).