Various embodiments may provide a circuit arrangement. The circuit arrangement may include an adjustable resistor bridge configured to receive a driving signal from an electronic device, and further configured to generate one or more intermediate signals based on the driving signal. The circuit arrangement may also include an amplifier stage configured to generate an amplified signal based on the one or more intermediate signals, and a scaler configured to generate an output signal based on the amplified signal. The adjustable resistor bridge may include at least one resistor of a first resistor type having a first coefficient of resistance with respect to an environmental condition, and at least one resistor of a second resistor type having a second coefficient of resistance with respect to the environmental condition different from the first coefficient. A resistance of the first resistor type may be adjustable by a resistor stage digital control signal.

A printed circuit board including electronic components, a carrier equipped with a network of conductor tracks electrically connecting the electronic components and a strain gauge.

A robotic force/torque (FT) sensor restricts the conduction of heat, generated by an attached tool, through the FT sensor body to a radial direction. Heat from the tool is channeled to the center of the FT sensor body by a thermally conductive member. Additionally, heat from the tool is insulated from portions of the FT sensor body other than its center by a thermally insulating member. Transducers, such as strain gages attached to the surfaces of deformable beams, are disposed at a substantially equal distance from the center of the FT sensor body. Accordingly, as heat conducts through the FT sensor body from the center radially outwardly, all transducers experience substantially equal thermal load at any given time. Embodiments of the present invention substantially eliminate thermal gradients across groups of transducers that are wired in differential circuit topologies, such as half-bridge or quarter-bridge, enhancing the ability of such circuits to reject a common-mode signal component caused by thermal changes to the FT sensor body or the transducers themselves. Elimination of thermal gradients in the FT sensor body, other than one in the radial direction, enhances the effectiveness of known temperature compensation techniques.

A sensor circuit architecture includes a Wheatstone bridge-type sensing element that includes a plurality of resistors and a plurality of equivalent compensation networks. Each of the plurality of resistors includes one of the plurality of equivalent compensation networks. Each of the plurality of equivalent compensation networks includes at least one digital resistive compensation network configured to provide at least one of the following: variable resistance, digitally controlled variable resistance, digitally controlled resistance, and/or digitally set resistance. The sensor circuit architecture is configured with the at least one digital resistive compensation network to implement at least one of the following: a desired scale of output, a desired offset compensation, and/or a desired temperature compensation.

A strain gauge includes first and second substrates spaced apart from one another. A first flexible printed circuit board portion is in contact with a top side of the first and second substrates, and has a first Wheatstone bridge formed therein. The first flexible printed circuit board portion positions the first Wheatstone bridge such that two resistors of the first Wheatstone bridge are positioned to span from the top side of the first substrate to the top side of the second substrate. A second flexible printed circuit board portion is in contact with a bottom side of the first and second substrates, and has a second Wheatstone bridge formed therein. The second flexible printed circuit board positions the second Wheatstone bridge such that two resistors of the second Wheatstone bridge are positioned to span from the bottom side of the first substrate to the bottom side of the second substrate.

An electronic device includes an ADC, a multiplexer, a voltage reference circuit, an analog circuit, and a digital circuit. The ADC has a signal input, a reference input, and an output. The multiplexer has signal inputs and a signal output coupled to the signal input of the ADC. The voltage reference circuit has an output coupled to the reference input of the ADC, a first strain sensor coupled to a first signal input of the multiplexer, a second strain sensor coupled to a second signal input of the multiplexer, and a temperature sensor. The analog circuit has an input coupled to a battery, and an output coupled to a fourth signal input of the multiplexer. The digital circuit is coupled to the output of the ADC and stores correction parameters for correcting a converted battery voltage value from the ADC.

A strain gauge includes first and second substrates spaced apart from one another. A first flexible printed circuit board portion is in contact with a top side of the first and second substrates, and has a first Wheatstone bridge formed therein. The first flexible printed circuit board portion positions the first Wheatstone bridge such that two resistors of the first Wheatstone bridge are positioned to span from the top side of the first substrate to the top side of the second substrate. A second flexible printed circuit board portion is in contact with a bottom side of the first and second substrates, and has a second Wheatstone bridge formed therein. The second flexible printed circuit board positions the second Wheatstone bridge such that two resistors of the second Wheatstone bridge are positioned to span from the bottom side of the first substrate to the bottom side of the second substrate.

A stretchable sensor, electronic skin, and a method of manufacturing the same are proposed. The stretchable sensor includes a first stretchable electrode including a first elastomer and a first conductor dispersed in the first elastomer, a stretchable active layer formed on the first stretchable electrode and including a third elastomer and an ion conductor dispersed in the third elastomer, and a second stretchable electrode formed on the stretchable active layer and including a second elastomer and a second conductor dispersed in the second elastomer. The stretchable sensor and the method of manufacturing the same are effectively capable of sensing a temperature without being affected by strain and recognizing strain without being affected by temperature.

The present disclosure relates to a packaging box, a device and method for detecting damage, a detection apparatus, and a storage medium, and belongs to the field of packaging technologies. The packaging box includes a plurality of packaging cardboards that are combined into the packaging box, wherein at least one packaging cardboard of the plurality of packaging cardboards includes: a surface paper; a backing paper; at least one layer of a core paper; and at least one external force detecting member, wherein the at least one layer of the core paper is disposed between the surface paper and the backing paper, and wherein the at least one external force detecting member is configured to measure a strength value of an external force when the packaging cardboard is subjected to the external force.

A strain gauge includes a strain detecting unit and a temperature detecting unit that are formed on or above a flexible substrate. The strain detecting unit includes a resistor formed as a film containing Cr, CrN, and Cr.sub.2N, on one surface of a functional layer. A first metallic layer formed of a material of which a gauge factor is less than that of the resistor is laminated on a folded portion, and a resistance value of the first metallic layer on the folded portion is less than a resistance value of the folded portion. The temperature detecting unit is a thermocouple including a second metallic layer formed of a same material as the resistor, on or above the substrate; and a third metallic layer formed of a same material as the first metallic layer, on the second metallic layer.