An object is to reduce the influence of noise due to electric conduction carriers trapped between the surface of a silicon substrate and an oxide and thus achieve strain detection with a high S/N ratio. This semiconductor strain detection element includes: a silicon substrate; and a first impurity diffusion layer having a conduction type different from the silicon substrate, the first impurity diffusion layer being formed inside under a surface of the silicon substrate, wherein an amount of strain in the silicon substrate is detected on the basis of change in a resistance of the first impurity diffusion layer.

This invention describes a novel, superior pressure sensor, pressure sensing device, or pressure sensing system. This can act as a pressure sensor, device, or system for a fingertip-like tactile sensor or skin, comprising hydrophilic monomer(s), cross-linked with appropriate cross-linking agent(s), with appropriate solvent(s) or diluent(s), electrolyte(s), electrodes, and coating(s). This sensor is extremely sensitive, yet is also robust and has a wide pressure range. The sensor can be made in a variety of shapes and sizes as desired. The sensor can be used for a wide range of applications, from robotic grippers and prosthetic fingers and hands to health and medical monitoring and sports equipment, and other pressure sensing applications.

An adhesive strain sensing pod includes at least one strain sensor, electronics for electrically sensing at least one strain signal from the at least one strain sensor, and a sensor adhesive for adhering the strain sensor to a surface of a structural element. The pod may have a protective case for protecting the strain sensor and the electronics and for transferring at least part of a force, pressing the pod against the surface, to press the strain sensor against the surface. The sensor adhesive may be a liquid adhesive contained in a fragile pouch that ruptures when the pod is forced against the surface, or may be a thermally activated adhesive film that is activated to bond the strain sensor to the surface. A protective film may protect the sensor adhesive prior to installation of the pod and is removed prior to installation of the pod on the surface.

The present application provides a strain sensing film, a pressure sensor, and a hybrid strain sensing system. The strain sensing film includes a semiconductor thin-film, at least two resistors are disposed on the semiconductor thin-film, one resistor has a different response to a strain with respect to at least another resistor, thereby enhancing resistance to external environmental disturbances and improving the accuracy of pressure measurements.

A device of force sensing, which includes a rigid structure and force sensors. The rigid structure includes rigid blocks spaced apart, and a strain amplification area is formed between two adjacent rigid blocks, every two force sensors in four force sensors are used as a group, and two groups of the force sensors are selectively arranged corresponding to two of the mounting surfaces of the strain amplification area, the four force sensors are connected to form different bridge circuits.

A pressure sensing device is provided. In the pressure sensing device, the rigid structure includes rigid blocks arranged at intervals, and strain amplification zones are formed between every two adjacent rigid blocks. The force sensors include first sensors and second sensors. The first sensors are arranged on the two installation surfaces of the strain amplification zones and capable of following the deformation of the measured object, the second sensors are arranged on the two installation surfaces of the rigid blocks and located close to corresponding first sensors. At least four force sensors are connected to form a bridge circuit, and the bridge circuit is electrically connected to a signal processing circuit, so as to detect deformation of the rigid structure and obtain a force acted on the measured object. An output signal of each of the second sensors serves as a temperature compensation signal of the corresponding first sensors.

A strain gauge includes a flexible resin substrate and a resistor formed of a film that includes Cr, CrN, and Cr.sub.2N, the resistor being situated on or above the substrate. A film thickness of the resistor is greater than or equal to 100 nm and less than or equal to 700 nm.

A method for fabricating a strain sensing film, a strain sensing film, and a pressure sensor are provided in the present application. A semiconductor wafer is firstly thinned to form a semiconductor film. A die attach film is attached onto the semiconductor film. A resulting semiconductor film is diced to form a plurality of independent strain films. The plurality of independent strain films are transferred to a substrate, and the plurality of independent strain films are completely attached to the substrate. A metal pad of each of the plurality of independent strain films is electrically connected with a corresponding metal pad of the substrate. The plurality of independent strain films are packaged. In this way, the package process of the strain sensing film is completed, which tackles the problem that the existing COB packaging has defects when being applied to package the sensor film.

An optically transparent force sensor element compares a force reading from a first strain-sensitive film element with a second strain-sensitive film element, having a compliant and thermally conductive intermediate layer positioned therebetween to compensate for temperature changes. While in the idle state, the optically transparent force sensor can be periodically calibrated to account for additional changes in temperature.

A load change detection apparatus is provided with a base member, an elastic member, a first plate, a fixing member and heat flow sensors. The elastic member deforms according to a changed load applied to the elastic member, received by the receiving member. The first plate supports a surface of the elastic member on a side of the base member. The fixing member fixes the lower plate and the elastic member to the base member. The heat flow sensors, provided between the base member and the lower plate, output signals according to heat flowing between the lower plate and the base member. The heat flows due to heat generated or heat absorbed when the elastic member changes the elasticity shape thereof. Stress occurring when the elastic member deforms, is shut off by the first plate, thus direct transmission of the stress to the heat flow sensors is avoided.