A magnetic angle sensor system includes a first magnetic sensor configured to generate a first sensor signal, a second magnetic sensor configured to generate a second sensor signal, and at least one signal processor configured to: generate an angle signal including an angular value corresponding to an orientation of a magnetic field based on the first sensor signal and the second sensor signal; generate a vector length signal comprising a plurality of vector lengths corresponding to the first sensor signal and the second sensor signal; and extract at least one spectral component of the vector length signal, the at least one spectral component being indicative of a vector length variance between at least two consecutively sampled vector lengths of the plurality of vector lengths.

A sensor device, and methods of manufacture thereof, are disclosed. The sensor device comprising a deformable substrate and a plurality of sensing elements formed on the deformable substrate, each of the plurality of sensing elements comprises at least one of a plurality of strain sensitive lines radially extending with respect to a center of the deformable substrate and a plurality of arched-shaped strain sensitive lines extending with respect to the center of the deformable substrate. The plurality of sensing elements are arranged on the deformable substrate such that strain components measured due to extension of strain sensitive lines of at least one of the sensing elements are of opposite strain direction with respect to strain components measured due to compression of strain sensitive lines of at least one other of the sensing elements, thereby maximizing performance and measurement range.

According to an embodiment of the present invention, a structure for a strain gauge device is provided. The structure comprises a layer of strain gauge material and one or more contact pads positioned directly on the layer of strain gauge material. The structure further comprises a multiplexer, measuring device, amplifier, analog to digital converter, microcontroller, and wireless adapter. According to the structure, the multiplexer selects a given contact pad pair of the one or more contact pad pairs, the measuring device measures signal generated by the layer of strain gauge material between the given contact pad pair, the amplifier amplifies the measured signal, the analog to digital converter converts the amplified analog signal to a digital signal, the microcontroller processes the digital signal, and the wireless adapter transmits the processed digital signal. In addition, the structure may further comprise a battery to provide energy to the structure.

A strain gauge includes a resistor formed of a doped silicon material, a conductive shield, and an isolation element disposed between the resistor and the conductive shield. The isolation element electrically isolates the resistor from the conductive shield.

Described herein is a ruggedized microelectromechanical (“MEMS”) force sensor including a sensor die and a strain transfer layer. The MEMS force sensor employs piezoresistive or piezoelectric strain gauges for strain sensing where the strain is transferred through the strain transfer layer, which is disposed on the top or bottom side of the sensor die. In the case of the top side strain transfer layer, the MEMS force sensor includes mechanical anchors. In the case of the bottom side strain transfer layer, the protection layer is added on the top side of the sensor die for bond wire protection.

A pressure sensor has a stem in which a pressure introduction hole into which a pressure medium is introduced and a diaphragm deformable according to the pressure of the pressure medium are formed, and a strain detecting element which is arranged on the diaphragm via an insulating film and being configured to output a detection signal according to the deformation of the diaphragm. The strain detecting element is configured to have a portion made of polysilicon. A low doping layer having a higher electrical resistivity than polysilicon and a higher crystallinity than the insulating film is arranged between the insulating film and the strain detecting element.

A strain gauge and a metal strip having such a strain gauge, which has a first measuring grid, a second measuring grid, and a substrate on which these two measuring grids are positioned in a common plane. In order to enable achievement of an inexpensive strain gauge whose measurement results can be robustly compensated for in relation to a temperature disturbance variable, it is proposed that the multi-layer substrate have a metallic layer and an electrically insulating layer onto which electrically insulating layer these two measuring grids consisting of a piezoresistive material are printed.

The load cell for measuring a force in both push and pull includes a body assembly having a body element defining a measurement chamber with a closed end and an opposite open end, a protruding member positioned within the measurement chamber and extending from the closed end toward the open end. The load cell also includes a base assembly secured at the open end of the body element, including a base element; and a sense die attached to the base element and aligned with the protruding member, where a top surface of the sense die supports a Wheatstone bridge circuit configured to generate a signal based on a force exerted by the protruding member on the sense die. The body element, the protruding member and the base element are integrally formed from a common material which has a CTE close to the CTE of the sense die.

An organic semiconductor element of the present invention includes: an organic semiconductor film formed from single crystal of an organic semiconductor, and a doped layer formed in a surface of the organic semiconductor film. A strain sensor of the present invention includes: the organic semiconductor element, a pair of electrodes which are electrically connected through the doped layer, and a substrate which is deformable, and which has the organic semiconductor element formed on one surface thereof. A vibration sensor of the present invention includes: the organic semiconductor element, a pair of electrodes which are electrically connected through the doped layer, and a substrate which has flexibility, and which is fixed at one end or both ends thereof, the substrate having the organic semiconductor element formed on the surface of the flexible portion of the substrate.

Sensor systems are described that are designed to be integrated with gloves for the human hand. An array of sensors detects forces associated with action of a hand in the glove, and associated circuitry generates corresponding control information that may be used to control a wide variety of processes and devices.