Patent classifications
G01L9/0025
Saw based optical sensor device and package including the same
Provided are an optical sensor device using surface acoustic waves and an optical sensor device package. The optical sensor device includes: a substrate including a first light sensing area and a temperature sensing area and including a piezo electric material; a first input electrode and a first output electrode which are disposed in the first light sensing area and are apart from each other with a first delay gap therebetween; a first sensing film overlapping the first delay gap and configured to cover at least some portions of the first input electrode and the first output electrode; and a second input electrode and a second output electrode which are disposed in the temperature sensing area and are apart from each other with a second delay gap therebetween. The second delay gap is exposed to air.
AN APPARATUS AND METHOD
An implantable cardiovascular pressure sensor comprising a rigid enclosure sealed by a flexible membrane; and an elongate compliant member comprising a piezoelectric material, the member having a width and a length greater than the width, and two ends separated by the length and two sides separated by the width; wherein the flexible membrane is coupled to the elongate compliant member to transfer external fluid pressure load to the elongate compliant member to cause deflection of the elongate compliant member in response to changes in the external fluid pressure; the pressure sensor further comprising a first acoustic wave device provided by the piezoelectric material of the elongate compliant member for sensing said deflection.
Method of fabricating acoustic wave device
An acoustic wave device fabrication method includes: forming on a piezoelectric substrate a comb-shaped electrode and a wiring layer coupled to the comb-shaped electrode; forming on the piezoelectric substrate a first dielectric film having a film thickness greater than those of the comb-shaped electrode and the wiring layer, covering the comb-shaped electrode and the wiring layer, and being made of silicon oxide doped with an element or undoped silicon oxide; forming on the first dielectric film a second dielectric film having an aperture above the wiring layer; removing the first dielectric film exposed by the aperture of the second dielectric film by wet etching using an etching liquid causing an etching rate of the second dielectric film to be less than that of the first dielectric film so that the first dielectric film is left so as to cover an end face of the wiring layer and the comb-shaped electrode.
TRANSDUCER APPARATUS AS WELL AS MEASURING SYSTEM FORMED BY MEANS OF SUCH A TRANSDUCER APPARATUS
A transducer apparatus comprises a deformation body as well as, positioned on the deformation body and connected therewith by material bonding, a radio sensor having a surface facing away from the deformation body. The radio sensor is adapted to receive free-space electromagnetic waves and to convert them into acoustic surface waves propagating along the surface facing away from the deformation body, or to convert acoustic surface waves propagating along the surface into free-space electromagnetic waves. Additionally, the deformation body is adapted as a function of a mechanical force acting thereon, and/or as a function of a temperature change, to be at least partially deformed, in such a manner that at least the surface of the radio sensor facing away from the deformation body experiences a shape change influencing a propagation of acoustic surface waves propagating along the surface. A measuring system formed by means of such a transducer apparatus comprises additionally a measuring electronics electrically coupled with the transducer apparatus and adapted to generate at least one electrical driver signal feeding and/or activating the transducer apparatus and to couple such into the transducer apparatus, and to receive and to evaluate a measurement signal delivered from the transducer apparatus.
PASSIVE MICROPHONE/PRESSURE SENSOR USING A PIEZOELECTRIC DIAPHRAGM
There are disclosed pressure-sensitive acoustic resonators and remote pressure sensing systems and methods. A pressure-sensitive acoustic resonator includes a conductor pattern formed on a planar surface of a dielectric substrate, the conductor pattern including an interdigital transducer (ICP), and a diaphragm, the diaphragm being a portion of a plate of single-crystal piezoelectric material, the diaphragm having a front surface exposed to an environment and a back surface facing, but not contacting, the ICP.
Wireless monitoring system for rotary machines
A monitoring system for monitoring environmental conditions for rotary members includes a plurality of stationary reader antennas positioned proximate rotary members. A first sensor is coupled to a first rotary member and a second sensor is coupled to a second rotary member. Each sensor is configured to generate environmental condition data. A key phasor is coupled to a third rotary member and configured to generate key phasor data. The monitoring system also includes a data integrator communicatively coupled to each stationary reader antenna and configured to determine measurement values for the first and second environmental condition based on raw data from each stationary reader antennas and data from the key phasor.
WIRELESS SENSOR SYSTEM FOR HARSH ENVIORNMENT
A sensor system that combines the sensing application of surface acoustic wave (SAW) sensor and sensor signal transfer though the enclosure wall via acoustic means. The sensor system includes SAW sensor placed inside the enclosure and at least one pair of bulk acoustic wave (BAW) transducers, one mounted inside and second outside the enclosure wall, allowing the interrogation of SAW sensor from outside the enclosure. The external BAW transducer converts interrogation electrical pulse into acoustic pulse which travels though the enclosure wall to the internal BAW transducer. The internal BAW transducer converts the interrogation electrical pulse to electrical pulse and transfers it to SAW sensor. The response of the SAW transducer containing series of electric pulses is converted to the series of acoustic pulses by internal BAW transducer which propagates though enclosure wall. The external BAW transducer converts the series of acoustic pulses into series of electrical pulses and is received by the interrogation circuit for processing.
RESONATING SENSOR FOR HIGH-PRESSURE AND HIGH-TEMPERATURE ENVIRONMENTS
Resonating sensors for use in high-pressure and high-temperature environments are provided. In one embodiment, an apparatus includes a sensor with a double-ended tuning fork piezoelectric resonator that includes a first tine and a second tine. These tines are spaced apart from one another so as to form a slot between the first and second tines. The width of the slot from the first tine to the second tine varies along the lengths of the first and second tines. Various other resonators, devices, systems, and methods are also disclosed.
High-pressure, high-temperature hollow sphere acoustic pressure sensor
A pressure sensor and a method of measuring pressure with the pressure sensor, based on measuring the effect of pressure loads on the acoustic resonance mode frequencies of a spherical core (e.g., a hollow sphere). The pressure sensor includes a transmitter configured to transmit vibrational signals to a sphere, and a receiver on the opposite side of the spherical core that is configured to receive vibrational signals from the spherical core. According to the method of measuring pressure with this sensor, the spherical core exhibits a pressure-dependent resonance response that can be monitored utilizing a frequency response technique. Peak shifts observed under an unknown pressure load can be compared to a calibration of the spherical core under a series of known pressure loads to thereby determine the unknown pressure. The pressure sensor and method may be operated in real-time at very high temperatures and pressure, and may be used in borehole applications and in aggressive media.
Photomask transportation stage in semiconductor fabrication and method for using the same
A transportation stage for transporting a photomask is provided. The transportation stage includes a vacuum source and a supporting plate. The supporting plate has a number of passages connected to the vacuum source. The transportation stage further includes a membrane positioned on the supporting plate. A number of through holes are formed on a middle region of the membrane and communicating with the passages. The transportation stage also includes an acoustic wave transducer positioned on the membrane and is configured generate an acoustic wave along the membrane.