A piezoresistive pressure sensor includes a substrate and a silicon device layer. The substrate has a cavity. The silicon device layer includes a diaphragm and a support element. A top surface of the diaphragm is connected to a top surface of the support element by one or more side surfaces. A recess of the silicon device layer is defined by the top surface of the diaphragm and the one or more side surfaces. A plurality of piezoresistive regions are on the top surface of the diaphragm, on the one or more side surfaces and on the top surface of the support element. A plurality of conductive regions are on the top surface of the support element. The plurality of conductive regions do not extend to the top surface of the diaphragm. The plurality of piezoresistive regions have a first ion dosage concentration. The plurality of conductive regions have a second ion dosage concentration. The second ion dosage concentration is greater than the first ion dosage concentration.

A pressure sensor may comprise a nylon socket, an upper PCB, a lower PCB, and a hex housing. The nylon socket may include a plurality of co-molded electrical pin conductors extending axially from electrical connectors defined within a top end of the nylon socket for receiving an external electrical cable to a bottom end of the nylon socket. A top side of the upper PCB may have electrical contacts configured to contact the electrical pin conductors. The lower PCB may be connected to the upper PCB by at least one structural member, and electrically coupled to the upper PCB and to strain gauges coupled to a diaphragm. The hex housing may have an interior axial port extending from a bottom of said hex housing to a counterbore for holding the diaphragm, thereby exposing a first side of said diaphragm to the fluid within the axial port.

A pressure sensor includes a flexible diaphragm which is flexed by pressure changes and a coating layer on one surface of the diaphragm. The diaphragm is a single layer containing silicon, nitrogen, and oxygen. Further, the coating layer contains silicon oxynitride. Also, the coating layer has a nitrogen concentration distribution that varies across the thickness of the coating layer.

A load lock pressure gauge comprises a housing configured to be coupled to a load lock vacuum chamber. The housing supports an absolute vacuum pressure sensor that provides instantaneous high vacuum pressure signal over a range of high vacuum pressures and a differential diaphragm pressure sensor that provides an instantaneous differential pressure signal between load lock pressure and ambient pressure. The housing further supports an absolute ambient pressure sensor. A low vacuum absolute pressure is computed from the instantaneous differential pressure signal and the instantaneous ambient pressure signal. A controller in the housing is able to recalibrate the differential diaphragm pressure sensor based on measured voltages of the sensor and a measured ambient pressure during normal operation of the pressure gauge with routine cycling of pressure in the load lock.

A pressure sensor system having at least one pressure sensor device. The pressure sensor device has a stack having a ceramic substrate, at least one signal processing element, and at least one sensor element. The pressure sensor device is placed in a sensor housing provided with a membrane, and a residual volume of the sensor housing provided with the membrane is filled with an incompressible fluid. A method for producing such a pressure sensor system, and to a measuring device, are also described.

A pressure sensor system including at least one pressure sensor unit configured as a system-in-package, the pressure sensor unit encompassing a supporting structure including a cavity and a sensor element situated in the cavity; the supporting structure being formed by a land grid array/mold premold structure (LGA/MPM) and signal-processing elements being integrated into and/or on the supporting structure; the pressure sensor unit being introduced into a pressure sensor housing provided with a diaphragm and being supported therein, and a residual volume of the pressure sensor housing provided with at least one diaphragm being filled with an incompressible fluid; and the pressure sensor housing including a groove extending around the pressure sensor unit, in which a sealing ring is situatable.

A sensor element includes a sensor chip and a diaphragm base joined to a surface of the sensor chip. The sensor chip includes a first diaphragm for measuring differential pressure between a first pressure and a second pressure and a second diaphragm for measuring absolute pressure or gage pressure of the second pressure. The diaphragm base includes a third diaphragm to directly receive a fluid that is a measurement target and has the first pressure, and a fourth diaphragm to directly receive a fluid that is a measurement target and having the second pressure. The sensor element has a liquid amount adjustment chamber to make an amount of a first pressure transmission medium filled in a first pressure introduction path and an amount of a second pressure transmission medium filled in a second pressure introduction path to be equal to each other.

To obtain a low-pressure-loss physical quantity detection device that can detect a plurality of physical quantities of intake air. A physical quantity detection device of the present invention that detects a plurality of physical quantities of a measured gas flowing in a main passage, the physical quantity detection device includes: a circuit board on which a sensor that detects the plurality of physical quantities and an electronic component that controls the physical quantities are mountable; a circuit board accommodating unit that accommodates the circuit board; and a sub-passage in which a flow sensor is disposed. The circuit board is accommodated in the circuit board accommodating unit on an upstream side of the sub-passage, and disposed in parallel with the measured gas flowing through the main passage.

A pressure sensor configured to prevent tearing or cracking of an insulating film for insulating between a stem and a detection circuit from occurring. A stem having a planar outer bottom surface, an outer side surface intersecting the outer bottom surface, and a pressure receiving inner surface that is the opposite surface to the outer bottom surface and receives pressure from a fluid to be measured; and a detection circuit provided to the outer bottom surface with an insulating film interposed therebetween. The stem has a foot part that: is formed to surround the outer bottom surface; consists of a surface which, when observed parallel to the outer bottom surface, faces a direction different from the direction of the outer bottom surface and the outer side surface; and connects between the outer bottom surface and the outer side surface. The insulating film covers a portion of the foot part.

A silicon carbide-based micro-electro-mechanical system (MEMS) combined temperature-pressure sensor chip and a preparation thereof. The chip includes a peripheric pressure-measuring unit and a center temperature-measuring unit. The pressure-measuring unit includes a silicon carbide substrate with a raised island and a pressure sensitive diaphragm formed by etching the back of the substrate. The raised island and the pressure-sensitive diaphragm constitute a membrane-island structure. Four piezoresistive strips are arranged symmetrically along a circumferential direction of a root of the pressure-sensitive diaphragm and between the raised island and the pressure-sensitive diaphragm. The temperature-measuring unit includes the raised island and a thin-film thermocouple arranged thereon.