There is provided an inspection device allowing surely measuring irregular-shaped parts such as a bevel of a wafer while saving space. An inspection device 100 is provided with outer periphery illuminating units 11, 111 for illuminating an outer peripheral region AP of a wafer WA being a target, and an outer periphery imaging unit that images the outer peripheral region AP of the wafer WA. The outer periphery illuminating units 11, 111 have arcuate illuminating units 11a, 111a that are arranged along a partial region of a circumference CI centered on a reference axis SA and illuminate a predetermined region A1 on the reference axis SA, and the reference axis SA of the arcuate illuminating units 11a, 111a extends in a direction crossing the tangent direction along which an outer peripheral part UA of the wafer WA extends.

A debris detection apparatus and a debris detection method, capable of easily detecting a metal debris existing on the surface of an inspection target by emitting electromagnetic waves having a wavelength in a far-infrared band toward the inspection target during a battery manufacturing process and then analyzing the characteristics of reflected waves from the surface of the inspection target through a thermal image recorder.

An optical scanning system includes a first radiating source capable of outputting a first source light beam, a second radiating source capable of outputting a second source light beam, a first time-varying beam reflector configured to direct the first source light beam and the second source light beam toward the sample, a scan lens configured to focus the first source light beam and the second source light beam reflected by the first time-varying beam reflector onto the sample, and a compound ellipsoidal collector configured to direct light scattered from the sample toward a scattered radiation detector. The optical scanning system causes one of the first or second source light beams to be directed towards a sample at an incident angle. The first light beam has a first wavelength, the second light beam has a second wavelength, and the first wavelength and the second wavelength are not the same.

A detecting device is provided; which includes: a substrate; a plurality of photo sensors disposed on the substrate; and a stress luminescent layer disposed on at least one of the plurality of photo sensors.

A vehicle imaging station comprising one or more cameras each camera having an adjustable shutter speed and a field of view, the fields of view of the one or more cameras covering an vehicle imaging volume, a control unit arranged to control the shutter speed of the cameras, a vehicle speed detection device arranged to measure the speed of a vehicle moving through the vehicle imaging volume and to output detected vehicle speed data to the control unit. The control unit is arranged to automatically adjust the shutter speed of the cameras based on the detected vehicle speed data and to cause the cameras to capture one or more images with the adjusted shutter speed.

An inspection device is a device that inspects the appearance of a target, including: an imaging device configured to image the target from a first direction; an illuminating unit configured to apply light to the target; and a controller configured to acquire a first inspection image by causing the imaging device to image the target to which light is applied from a first position, to acquire a second inspection image by causing the imaging device to image the target to which light is applied from a second position, and to inspect an appearance of the target based on the first inspection image, the second inspection image, and a reference image. The first position and the second position overlap each other when viewed from the first direction.

A method and device recognize and analyze surface defects in three-dimensional objects having a reflective surface, in particular motor vehicle bodies. In which method the surface defects are identified by the evaluation of an image, recorded by a camera in the form of a raster image of pixels, of an illumination pattern projected by a first illumination device onto a part of the reflective surface using a two-dimensional raster coordinate system. The surface defects are identified exclusively using two-dimensional image information with the aid of image processing algorithms without the need for “environmental parameters”, and complex geometric calculations can be omitted. The solution is fast and robust and can be carried out using differently configured first illumination devices, which makes it suitable for mobile applications, for example as a hand-held module. It is also made possible for the method to be optimized by a “deep learning” strategy.

There is provided an inspection device allowing surely measuring irregular-shaped parts such as a bevel of a wafer while saving space. An inspection device 100 is provided with outer periphery illuminating units 11, 111 for illuminating an outer peripheral region AP of a wafer WA being a target, and an outer periphery imaging unit that images the outer peripheral region AP of the wafer WA. The outer periphery illuminating units 11, 111 have arcuate illuminating units 11a, 111a that are arranged along a partial region of a circumference CI centered on a reference axis SA and illuminate a predetermined region A1 on the reference axis SA, and the reference axis SA of the arcuate illuminating units 11a, 111a extends in a direction crossing the tangent direction along which an outer peripheral part UA of the wafer WA extends.

There is disclosed methods and apparatus for detecting contamination on cold-formed steel parts prior to subsequent press-hardening in which such contamination may be problematic, and also for detecting contamination on cold-forming machinery that might be transferred to cold-formed steel parts during cold-forming. In some aspects, the disclosure also relates to methods and apparatus for detecting splits or cracks in cold-formed steel parts prior to subsequent press-hardening. The methods and apparatus make use of ultraviolet light to detect contamination or to detect splits or cracks.

A method for detecting defects in high-aspect-ratio channel holes, via holes or trenches is disclosed. First, a substrate having thereon a film stack and a plurality of deep features in the film stack is provided. At least one of the plurality of deep features comprises a defect. The substrate is then subjected to an optical inspection process. The substrate is illuminated by a broadband light beam. Some of the broadband DUV light beam scattered and/or reflected from the substrate is collected by a detector, thereby producing a bright-field illumination image of the plurality of deep features in the film stack.