An image inspection device which can image an object with a plurality of cameras in a state in which the object is optimally illuminated and which can also be downsized is provided. The image inspection device includes a plurality of imaging parts that image the object, an illumination part that is disposed between the object and the plurality of imaging parts and radiates light toward the object and has a light-transmissive property, and a control part that controls the plurality of imaging parts and the illumination part. The illumination part includes a plurality of illumination elements which are arranged in a matrix and are allowed to be turned on independently. The control part controls the plurality of illumination elements to cause the illumination part to illuminate a region of the object corresponding to a field of view of the plurality of imaging parts.

A method of determining a physical characteristic of an adhesive material on a semiconductor device element using structured light is provided. The method includes the steps of: (1) applying a structured light pattern to an adhesive material on a semiconductor device element; (2) creating an image of the structured light pattern using a camera; and (3) analyzing the image of the structured light pattern to determine a physical characteristic of the adhesive material. Additional methods and systems for determining physical characteristics of semiconductor devices and elements using structured light are also provided.

Systems and methods for illuminating and/or inspecting one or more features of a unit under test (UUT) are disclosed herein. A system configured in accordance with embodiments of the present technology can include, for example, a machine, one or more diffuser elements, and/or one or more light sources. The system can create and adjust brightfield illumination profiles (e.g., uniform, brightfield illumination profiles) on portions (e.g., on curved features) of the UUT by, for example, using the one or more light sources and/or the one or more diffuser elements to adjust diffuse and/or specular illumination projected onto the curved features of the UUT. In some embodiments, the system includes one or more darkfield light sources configured to project illumination onto second portions of the UUT to create a darkfield illumination profile. The system can capture data of the brightfield and/or darkfield illumination profiles and can thereby inspect portions of the UUT.

A semiconductor wafer processing system for processing a semiconductor wafer includes a semiconductor wafer processing station for processing the semiconductor wafer and a semiconductor wafer imaging system that images the semiconductor wafer after the semiconductor wafer processing station processes the semiconductor wafer. The semiconductor wafer imaging system includes shroud panels defining a black box, a camera positioned in the black box for imaging the semiconductor wafer, and an illumination panel for directing diffuse light to the semiconductor wafer. A portion of the diffuse light is reflected off the semiconductor wafer and the camera images the semiconductor wafer by detecting the reflected diffuse light.

A system for cosmetic inspection of a test object is disclosed that includes a movable platform for receiving a test object. The movable platform is capable of positioning the test object within a dome. A plurality of cameras arranged oriented to capture different views of a plurality of surfaces of the test object. A plurality lights arranged are outside the dome, the plurality of lights selectively enabled or disabled according to which of the plurality of surfaces of the test object is to be captured.

A visual inspection device is an inspection device using an image obtained by shooting an inspection surface of an object to be inspected with a camera disposed so as to face the inspection surface. The object to be inspected is a rolling bearing and the inspection surface is a surface included in an outer ring of the rolling bearing. A lighting device emits light from a light source as diffused light to the inspection surface in a direction different from a direction in which the camera shoots the inspection surface, and the camera shoots the inspection surface irradiated with the diffused light.

Method for checking a tyre. The method includes associating first and second independent light sources with a camera, applying a first force against a first surface portion of the tyre to generate a first deformed surface portion, and illuminating the first deformed surface portion with a first light radiation emitted by the first light source while keeping the second light source deactivated. A first image of the first deformed surface portion is then acquired by the camera. The first force is removed and a second surface portion partially distinct from the first surface portion is illuminated with a second light radiation emitted by the second light source without deforming the second surface portion. A second image of the second surface portion is then acquired by the camera. The first and second images are processed for detection of possible defects in the first and second surface portions.

Reflective or embossed regions are supposed to be illuminated as uniformly as possible over the greatest possible angle range for optical inspection using in one aspect an apparatus for inspection having a passive lighting body spotlighted by a spotlight light source, which body illuminates a test region, as well as at least one optical sensor directed at the test region. The lighting body is configured to be partially transmissible, and the optical sensor is disposed, with reference to the test region, optically beyond the lighting body, detecting the test region through the lighting body, and/or the spotlight light source is directed at the lighting body and the lighting body extends continuously over at least 120 in a section plane that stands perpendicular to the surface of the flat items to be tested or inspected.

A visual inspection system that may be utilized to inspect and identify defects in magnet wire or other objects is described. The system may include an outer housing, a light source, and at least one visual inspection device. The housing may include a channel through which an object to be inspected is traversed, and the channel may extend along a longitudinal direction and include an inner surface having a diameter that narrows along the longitudinal direction between a first point and an examination area. The light source may be positioned on an opposite side of the first point from the examination area along the longitudinal direction. The visual inspection device(s) may be positioned around an outer circumference of the examination area, and each visual inspection device may be configured to inspect the object through a respective opening in the housing.

An image inspection apparatus includes an illuminating section for irradiating illumination light, a line camera in which a plurality of imaging elements are arrayed to be linearly arranged, the line camera receiving the light irradiated from the illuminating section and reflected on the inspection target object, a display section for displaying an image captured by the line camera, an optical axis adjusting section for adjusting an optical axis of the line camera, a trigger setting section for specifying a trigger that specifies timing when the inspection target object is imaged by the line camera, an aspect ratio adjusting section for adjusting longitudinal and lateral pixel resolutions of the image captured by the line camera, and a display control section for displaying the optical axis adjusting section, the trigger setting section, and the aspect ratio adjusting section on the display section in order.