A method of detecting defects on a semiconductor wafer includes directing diffuse light to the semiconductor wafer and reflecting the diffuse light off of the semiconductor wafer. The method further includes detecting the diffuse light with a camera to generate an image of the semiconductor wafer and analyzing the image to detect defects on the semiconductor wafer.

A visual inspection system that may be utilized to inspect and identify defects in magnet wire or other objects is described. The system may include an outer housing, a light source, and at least one visual inspection device. The housing may include a channel through which an object to be inspected is traversed, and the channel may extend along a longitudinal direction and include an inner surface having a diameter that narrows along the longitudinal direction between a first point and an examination area. The light source may be positioned on an opposite side of the first point from the examination area along the longitudinal direction. The visual inspection device(s) may be positioned around an outer circumference of the examination area, and each visual inspection device may be configured to inspect the object through a respective opening in the housing.

A defect inspection device includes an illumination unit that irradiates a sample with a linear illumination spot; a condensing detection unit that condenses reflected light of the illumination spot from the sample; and a sensor unit that forms an optical image on a light reception surface, and outputs the optical image as an electrical signal. An angle formed between an optical axis of the condensing detection unit and a longitudinal direction of the linear illumination spot is 10 or more and less than 80. The sensor unit is a line sensor provided with an array-like light reception unit at a position conjugate with the illumination spot. An angle formed between direction of the line sensor and the optical axis of the condensing detection unit is 10 or more and less than 80, and has a difference from the angle of 5 or more.

An imaging system for a component to be imaged, the imaging system comprising a frame having an upper and lower section, at least one section comprising a clamp for holding the component, the frame supporting an camera container, wherein the camera container comprises a box having at least one white light source and a diffuser and at least one camera, and wherein the camera is connected to a computer.

A method of determining a bonding energy of a bonded wafer includes receiving the bonded wafer including a first wafer bonded with a second wafer, and inserting a blade between the first wafer and the second wafer to form a crack between the first wafer and the second wafer, the crack extending from a portion of the blade contacting the first wafer and the second wafer to a point where the first wafer and the second wafer are still bonded. The method further includes passing light beams through the crack at an outer edge of the bonded wafer, and collecting light beams transmitting through the crack at a light detector. And the method further includes determining the bonding energy of the bonded wafer based on a light intensity of the collected light beams.

A device for detecting foreign substances comprising: a lighting unit for irradiating light toward an object that is brighter in one direction than other directions or uniformly irradiating light toward the object; a photographing unit spaced from the lighting unit and capable of photographing the object; a controller capable of: allowing the photographing unit to the photograph the object each time the lighting unit irradiates light toward the object that is brighter in one direction than other directions, and controlling the lighting unit and the photographing unit to allow the photographing unit to photograph the object if the lighting unit uniformly irradiates light toward the object; and a processor capable of synthesizing images photographed by the photographing unit and determining whether the object has foreign substances from the synthesized image.

A visual inspection device and apparatus is disclosed for inspecting fiber ends of a connector by capturing an image of the connector end face, and implementing an image analysis tool for detecting contamination from the captured image. The visual inspection tool includes components for providing a larger field of view to capture the entire connector end face in a single image, and the image analysis tool is able to accurately and efficiently detect contamination from the captured image.

In one embodiment, a substrate imaging apparatus includes: a rotary holding unit that holds and rotates a substrate; a mirror member having a reflecting surface that opposes an end face of the substrate and a peripheral portion of a back surface of the substrate held by the rotary holding unit, the reflecting surface being inclined with respect to a rotation axis of the rotary holding unit; and a camera having an imaging device that receives both first light and second light through a lens, the first light coming from a peripheral portion of a front surface of the substrate held by the rotary holding unit, and the second light being a reflected light of second light which comes from the end face of the substrate held by the rotary holding unit and is reflected by the reflecting surface.

A visual inspection device and apparatus is disclosed for inspecting fiber ends of a connector by capturing an image of the connector end face, and implementing an image analysis tool for detecting contamination from the captured image. The visual inspection tool includes components for providing a larger field of view to capture the entire connector end face in a single image, and the image analysis tool is able to accurately and efficiently detect contamination from the captured image.

Systems and methods here may be used for a setup of image capturing of a gemstone, such as a diamonds that are of high clarity grades. The present embodiments can provide methods to capture a diamond surface and internal clarity features from a diamond table and through and of other facets. Systems and methods may be used to convert gemstone dimension information into azimuth, slope, and distance information and adjust the motorized stage accordingly for surface imaging. Further, a calibration method can consider the offsets between design and actual system alignment. A calibration process can be used to compensate the offsets. Further, an additional conversion can be derived to compensate the offset caused by the geometry of the gemstone. The methods can automatically capture surface reflection images on facets of the gemstone and internal features taken through facets of the gemstone.